SG11201402512PA - Method for cutting work piece - Google Patents

Method for cutting work piece

Info

Publication number
SG11201402512PA
SG11201402512PA SG11201402512PA SG11201402512PA SG11201402512PA SG 11201402512P A SG11201402512P A SG 11201402512PA SG 11201402512P A SG11201402512P A SG 11201402512PA SG 11201402512P A SG11201402512P A SG 11201402512PA SG 11201402512P A SG11201402512P A SG 11201402512PA
Authority
SG
Singapore
Prior art keywords
work piece
cutting work
cutting
piece
work
Prior art date
Application number
SG11201402512PA
Other languages
English (en)
Inventor
Kazuya Tomii
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201402512PA publication Critical patent/SG11201402512PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG11201402512PA 2011-12-22 2012-11-16 Method for cutting work piece SG11201402512PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011281991A JP2013129046A (ja) 2011-12-22 2011-12-22 ワークの切断方法
PCT/JP2012/007359 WO2013094117A1 (ja) 2011-12-22 2012-11-16 ワークの切断方法

Publications (1)

Publication Number Publication Date
SG11201402512PA true SG11201402512PA (en) 2014-09-26

Family

ID=48668036

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201402512PA SG11201402512PA (en) 2011-12-22 2012-11-16 Method for cutting work piece

Country Status (8)

Country Link
US (1) US20140318522A1 (ja)
JP (1) JP2013129046A (ja)
KR (1) KR20140106583A (ja)
CN (1) CN103998182A (ja)
DE (1) DE112012004819T5 (ja)
SG (1) SG11201402512PA (ja)
TW (1) TW201343347A (ja)
WO (1) WO2013094117A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6235295B2 (ja) * 2013-10-07 2017-11-22 株式会社安永 固定砥粒ワイヤソー装置及びこれを用いたウエハの製造方法
JP5994766B2 (ja) * 2013-11-21 2016-09-21 信越半導体株式会社 ワークの切断方法
JP6304118B2 (ja) * 2015-05-01 2018-04-04 信越半導体株式会社 ワイヤソー装置
KR101841551B1 (ko) * 2016-11-23 2018-03-23 에스케이실트론 주식회사 잉곳 가압 장치 및 이를 포함하는 잉곳 절단 장치
CN107379294B (zh) * 2017-07-20 2019-12-27 阜宁协鑫光伏科技有限公司 金刚线重复利用切割硅片的方法
JP2020121392A (ja) * 2019-01-31 2020-08-13 株式会社タカトリ ワイヤソー及びワイヤソーの被加工物切断方法
CN110039431B (zh) * 2019-03-20 2021-03-26 新昌浙江工业大学科学技术研究院 一种轴承套圈低损耗高效加工方法
CN110181699B (zh) * 2019-05-22 2021-05-04 江苏吉星新材料有限公司 一种蓝宝石金刚线多线切片机的切割工艺
CN110216296B (zh) * 2019-05-30 2021-07-20 西安法士特汽车传动有限公司 一种降低加工拨叉槽成本的粗切槽方法
CN112976382B (zh) * 2021-03-04 2022-04-01 福州天瑞线锯科技有限公司 一种金刚线对脆硬材料的切割方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1282144A (fr) * 1960-12-07 1962-01-19 Electronique & Automatisme Sa Machine perfectionnée pour le sciage par rodage d'échantillons en matériaux fragiles, notamment cristallins
CA1013240A (en) * 1973-12-29 1977-07-05 Yasunaga Engineering Kabushiki Kaisha Wire saw
JPH09300343A (ja) * 1996-05-17 1997-11-25 Hitachi Cable Ltd マルチワイヤソーによる切断方法
JP2004322299A (ja) * 2003-04-30 2004-11-18 Kanai Hiroaki ワイヤソーマシーン
JP2005153031A (ja) * 2003-11-20 2005-06-16 Yasunaga Corp ワイヤソー及びワイヤソーの加工液供給方法
JP4820108B2 (ja) * 2005-04-25 2011-11-24 コマツＮｔｃ株式会社 半導体ウエーハの製造方法およびワークのスライス方法ならびにそれらに用いられるワイヤソー
JP2007326167A (ja) * 2006-06-07 2007-12-20 Toyo Advanced Technologies Co Ltd ワイヤソー
JP4816511B2 (ja) * 2007-03-06 2011-11-16 信越半導体株式会社 切断方法およびワイヤソー装置
JP4998241B2 (ja) * 2007-12-11 2012-08-15 信越半導体株式会社 ワイヤソーによるワークの切断方法およびワイヤソー
WO2009104222A1 (ja) * 2008-02-19 2009-08-27 信越半導体株式会社 ワイヤソーおよびワークの切断方法
JP2010074056A (ja) * 2008-09-22 2010-04-02 Sumco Corp 半導体ウェーハおよびその製造方法
JP5515593B2 (ja) * 2009-10-07 2014-06-11 株式会社Ｓｕｍｃｏ ワイヤーソーによるシリコンインゴットの切断方法およびワイヤーソー

Also Published As

Publication number Publication date
WO2013094117A1 (ja) 2013-06-27
US20140318522A1 (en) 2014-10-30
TW201343347A (zh) 2013-11-01
CN103998182A (zh) 2014-08-20
DE112012004819T5 (de) 2014-09-11
KR20140106583A (ko) 2014-09-03
JP2013129046A (ja) 2013-07-04

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