SG110038A1 - Lithographic apparatus, device manufacturing method, and device manufactured thereby - Google Patents

Lithographic apparatus, device manufacturing method, and device manufactured thereby

Info

Publication number
SG110038A1
SG110038A1 SG200301907A SG200301907A SG110038A1 SG 110038 A1 SG110038 A1 SG 110038A1 SG 200301907 A SG200301907 A SG 200301907A SG 200301907 A SG200301907 A SG 200301907A SG 110038 A1 SG110038 A1 SG 110038A1
Authority
SG
Singapore
Prior art keywords
lithographic apparatus
device manufacturing
manufactured
device manufactured
manufacturing
Prior art date
Application number
SG200301907A
Other languages
English (en)
Inventor
Harm Roelof Rossing
Den Brink Marinus Aart Van
Richard Alexander George
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG110038A1 publication Critical patent/SG110038A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24835—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including developable image or soluble portion in coating or impregnation [e.g., safety paper, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200301907A 2002-04-09 2003-04-07 Lithographic apparatus, device manufacturing method, and device manufactured thereby SG110038A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02252526A EP1353229A1 (en) 2002-04-09 2002-04-09 Lithographic apparatus, device manufacturing method and device manufactured thereby

Publications (1)

Publication Number Publication Date
SG110038A1 true SG110038A1 (en) 2005-04-28

Family

ID=28051842

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200301907A SG110038A1 (en) 2002-04-09 2003-04-07 Lithographic apparatus, device manufacturing method, and device manufactured thereby

Country Status (7)

Country Link
US (1) US7046331B2 (zh)
EP (1) EP1353229A1 (zh)
JP (1) JP4048151B2 (zh)
KR (1) KR100525287B1 (zh)
CN (1) CN1279404C (zh)
SG (1) SG110038A1 (zh)
TW (1) TWI254838B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1353233A3 (en) * 2002-04-09 2007-10-03 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2216685B1 (en) 2003-06-19 2012-06-27 Nikon Corporation Exposure apparatus and device manufacturing method
US8064730B2 (en) * 2003-09-22 2011-11-22 Asml Netherlands B.V. Device manufacturing method, orientation determination method and lithographic apparatus
US7116398B2 (en) * 2003-11-07 2006-10-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4340638B2 (ja) * 2004-03-02 2009-10-07 エーエスエムエル ネザーランズ ビー．ブイ． 基板の表側または裏側に結像するためのリソグラフィ装置、基板識別方法、デバイス製造方法、基板、およびコンピュータプログラム
US7307688B2 (en) * 2004-11-19 2007-12-11 Asml Netherlands B.V. Clamping device for optical elements, lithographic apparatus with optical elements in a clamping device, and method for manufacturing such apparatus
US7878791B2 (en) * 2005-11-04 2011-02-01 Asml Netherlands B.V. Imprint lithography
US8011915B2 (en) 2005-11-04 2011-09-06 Asml Netherlands B.V. Imprint lithography
EP1795497B1 (en) * 2005-12-09 2012-03-14 Obducat AB Apparatus and method for transferring a pattern with intermediate stamp
US7808613B2 (en) * 2006-08-03 2010-10-05 Asml Netherlands B.V. Individual wafer history storage for overlay corrections
JP5064079B2 (ja) * 2007-03-30 2012-10-31 富士フイルム株式会社 描画方法および描画システム
US20090191723A1 (en) * 2008-01-30 2009-07-30 Chi-Ching Huang Method of performing lithographic processes
CN102246605B (zh) * 2008-12-16 2013-08-07 株式会社村田制作所 电路模块
EP2199855B1 (en) * 2008-12-19 2016-07-20 Obducat Methods and processes for modifying polymer material surface interactions
EP2199854B1 (en) * 2008-12-19 2015-12-16 Obducat AB Hybrid polymer mold for nano-imprinting and method for making the same
NL2004545A (en) 2009-06-09 2010-12-13 Asml Netherlands Bv Lithographic method and arrangement
DE102011112232A1 (de) * 2011-09-01 2013-03-07 Heidelberger Druckmaschinen Aktiengesellschaft Verfahren und Vorrichtung zur Erzeugung eines Barcodes auf einem Substrat
JP6525500B2 (ja) * 2014-02-03 2019-06-05 キヤノン株式会社 パターン形成方法、リソグラフィ装置及び物品の製造方法
CN113900356B (zh) * 2020-07-07 2023-03-21 长鑫存储技术有限公司 一种曝光方法及曝光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001040875A1 (en) * 1999-11-30 2001-06-07 Silicon Valley Group, Inc. Dual-stage lithography apparatus and method
US6266144B1 (en) * 1999-08-26 2001-07-24 Taiwan Semiconductor Manufacturing Company Stepper and scanner new exposure sequence with intra-field correction
US20040157143A1 (en) * 1998-01-16 2004-08-12 Nikon Corporation Exposure method and lithography system, exposure apparatus and method of making the apparatus, and method of manufacturing device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1244018C (zh) * 1996-11-28 2006-03-01 株式会社尼康 曝光方法和曝光装置
JPH10209039A (ja) * 1997-01-27 1998-08-07 Nikon Corp 投影露光方法及び投影露光装置
US5793052A (en) * 1997-03-18 1998-08-11 Nikon Corporation Dual stage following method and apparatus
JP2001118773A (ja) * 1999-10-18 2001-04-27 Nikon Corp ステージ装置及び露光装置
JP2001244177A (ja) * 2000-02-28 2001-09-07 Nikon Corp ステージ装置とホルダ、および走査型露光装置並びに露光装置
US6788385B2 (en) * 2001-06-21 2004-09-07 Nikon Corporation Stage device, exposure apparatus and method
US6876439B2 (en) * 2003-05-29 2005-04-05 Asml Holding N.V. Method to increase throughput in a dual substrate stage double exposure lithography system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040157143A1 (en) * 1998-01-16 2004-08-12 Nikon Corporation Exposure method and lithography system, exposure apparatus and method of making the apparatus, and method of manufacturing device
US6266144B1 (en) * 1999-08-26 2001-07-24 Taiwan Semiconductor Manufacturing Company Stepper and scanner new exposure sequence with intra-field correction
WO2001040875A1 (en) * 1999-11-30 2001-06-07 Silicon Valley Group, Inc. Dual-stage lithography apparatus and method

Also Published As

Publication number Publication date
TWI254838B (en) 2006-05-11
US7046331B2 (en) 2006-05-16
EP1353229A1 (en) 2003-10-15
TW200402604A (en) 2004-02-16
US20030211297A1 (en) 2003-11-13
CN1279404C (zh) 2006-10-11
KR100525287B1 (ko) 2005-11-02
CN1456940A (zh) 2003-11-19
JP4048151B2 (ja) 2008-02-13
KR20040002486A (ko) 2004-01-07
JP2004165610A (ja) 2004-06-10

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