SG106156A1 - Methods for producing a semiconductor component and semiconductor component - Google Patents

Methods for producing a semiconductor component and semiconductor component

Info

Publication number
SG106156A1
SG106156A1 SG200305360A SG200305360A SG106156A1 SG 106156 A1 SG106156 A1 SG 106156A1 SG 200305360 A SG200305360 A SG 200305360A SG 200305360 A SG200305360 A SG 200305360A SG 106156 A1 SG106156 A1 SG 106156A1
Authority
SG
Singapore
Prior art keywords
semiconductor component
producing
methods
semiconductor
component
Prior art date
Application number
SG200305360A
Other languages
English (en)
Inventor
Hedler Harry
Meyer Thorsten
Vasquez Barbara
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of SG106156A1 publication Critical patent/SG106156A1/en

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Classifications

    • H—ELECTRICITY
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    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
SG200305360A 2002-08-29 2003-08-26 Methods for producing a semiconductor component and semiconductor component SG106156A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10239866A DE10239866B3 (de) 2002-08-29 2002-08-29 Verfahren zur Herstellung eines Halbleiterbauelements

Publications (1)

Publication Number Publication Date
SG106156A1 true SG106156A1 (en) 2004-09-30

Family

ID=31983885

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200305360A SG106156A1 (en) 2002-08-29 2003-08-26 Methods for producing a semiconductor component and semiconductor component

Country Status (4)

Country Link
US (1) US6953708B2 (zh)
CN (1) CN1245744C (zh)
DE (1) DE10239866B3 (zh)
SG (1) SG106156A1 (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4624131B2 (ja) * 2005-02-22 2011-02-02 三洋電機株式会社 窒化物系半導体素子の製造方法
SG135074A1 (en) 2006-02-28 2007-09-28 Micron Technology Inc Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US8283756B2 (en) * 2007-08-20 2012-10-09 Infineon Technologies Ag Electronic component with buffer layer
TWI360207B (en) 2007-10-22 2012-03-11 Advanced Semiconductor Eng Chip package structure and method of manufacturing
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US20040113270A1 (en) 2004-06-17

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