SG104923A1 - A method to create a controllable and reproducible dual copper damascene structure - Google Patents

A method to create a controllable and reproducible dual copper damascene structure

Info

Publication number
SG104923A1
SG104923A1 SG200003006A SG200003006A SG104923A1 SG 104923 A1 SG104923 A1 SG 104923A1 SG 200003006 A SG200003006 A SG 200003006A SG 200003006 A SG200003006 A SG 200003006A SG 104923 A1 SG104923 A1 SG 104923A1
Authority
SG
Singapore
Prior art keywords
reproducible
controllable
create
damascene structure
copper damascene
Prior art date
Application number
SG200003006A
Other languages
English (en)
Inventor
Ho Kwok Keung Paul
Mei Sheng Zhou
Gupta Subhash
Original Assignee
Chartered Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chartered Semiconductor Mfg filed Critical Chartered Semiconductor Mfg
Publication of SG104923A1 publication Critical patent/SG104923A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76874—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroless plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76876—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for deposition from the gas phase, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SG200003006A 1999-09-07 2000-05-31 A method to create a controllable and reproducible dual copper damascene structure SG104923A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/390,782 US6184138B1 (en) 1999-09-07 1999-09-07 Method to create a controllable and reproducible dual copper damascene structure

Publications (1)

Publication Number Publication Date
SG104923A1 true SG104923A1 (en) 2004-07-30

Family

ID=23543915

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200003006A SG104923A1 (en) 1999-09-07 2000-05-31 A method to create a controllable and reproducible dual copper damascene structure

Country Status (4)

Country Link
US (1) US6184138B1 (de)
EP (1) EP1083597A3 (de)
JP (1) JP2001102452A (de)
SG (1) SG104923A1 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW417249B (en) * 1997-05-14 2001-01-01 Applied Materials Inc Reliability barrier integration for cu application
SG79235A1 (en) * 1998-07-16 2001-03-20 Univ Singapore Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
US7381642B2 (en) 2004-09-23 2008-06-03 Megica Corporation Top layers of metal for integrated circuits
US7405149B1 (en) * 1998-12-21 2008-07-29 Megica Corporation Post passivation method for semiconductor chip or wafer
US6965165B2 (en) 1998-12-21 2005-11-15 Mou-Shiung Lin Top layers of metal for high performance IC's
US6924226B2 (en) * 1999-10-02 2005-08-02 Uri Cohen Methods for making multiple seed layers for metallic interconnects
US7105434B2 (en) * 1999-10-02 2006-09-12 Uri Cohen Advanced seed layery for metallic interconnects
US6610151B1 (en) * 1999-10-02 2003-08-26 Uri Cohen Seed layers for interconnects and methods and apparatus for their fabrication
US6329701B1 (en) * 1999-10-04 2001-12-11 Advanced Micro Devices, Inc. Semiconductor device comprising copper interconnects with reduced in-line diffusion
US6376361B1 (en) * 1999-10-18 2002-04-23 Chartered Semiconductor Manufacturing Ltd. Method to remove excess metal in the formation of damascene and dual interconnects
US6340638B1 (en) * 2000-03-31 2002-01-22 Taiwan Semiconductor Manufacturing Company, Ltd Method for forming a passivation layer on copper conductive elements
KR100404941B1 (ko) * 2000-06-20 2003-11-07 주식회사 하이닉스반도체 반도체 소자의 금속 배선 형성방법
US6352917B1 (en) * 2000-06-21 2002-03-05 Chartered Semiconductor Manufacturing Ltd. Reversed damascene process for multiple level metal interconnects
US6531777B1 (en) * 2000-06-22 2003-03-11 Advanced Micro Devices, Inc. Barrier metal integrity testing using a dual level line to line leakage testing pattern and partial CMP
US6605534B1 (en) * 2000-06-28 2003-08-12 International Business Machines Corporation Selective deposition of a conductive material
US6562715B1 (en) 2000-08-09 2003-05-13 Applied Materials, Inc. Barrier layer structure for copper metallization and method of forming the structure
US6376376B1 (en) * 2001-01-16 2002-04-23 Chartered Semiconductor Manufacturing Ltd. Method to prevent CU dishing during damascene formation
US6667217B1 (en) * 2001-03-01 2003-12-23 Taiwan Semiconductor Manufacturing Company Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS process
US6583053B2 (en) * 2001-03-23 2003-06-24 Texas Instruments Incorporated Use of a sacrificial layer to facilitate metallization for small features
TW543093B (en) 2001-04-12 2003-07-21 Cabot Microelectronics Corp Method of reducing in-trench smearing during polishing
US6448185B1 (en) * 2001-06-01 2002-09-10 Intel Corporation Method for making a semiconductor device that has a dual damascene interconnect
US6607976B2 (en) 2001-09-25 2003-08-19 Applied Materials, Inc. Copper interconnect barrier layer structure and formation method
US6455434B1 (en) * 2001-10-23 2002-09-24 International Business Machines Corporation Prevention of slurry build-up within wafer topography during polishing
US6916398B2 (en) * 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
KR20030056913A (ko) * 2001-12-28 2003-07-04 주식회사 하이닉스반도체 반도체 소자의 구리배선 형성방법
US6879051B1 (en) 2002-01-16 2005-04-12 Advanced Micro Devices, Inc. Systems and methods to determine seed layer thickness of trench sidewalls
US6531386B1 (en) 2002-02-08 2003-03-11 Chartered Semiconductor Manufacturing Ltd. Method to fabricate dish-free copper interconnects
KR100431086B1 (ko) * 2002-07-11 2004-05-12 주식회사 하이닉스반도체 반도체 소자의 구리 배선 형성 방법
US6833318B2 (en) * 2002-11-20 2004-12-21 United Microelectronics Corp. Gap-filling process
US7825516B2 (en) * 2002-12-11 2010-11-02 International Business Machines Corporation Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures
US6975032B2 (en) 2002-12-16 2005-12-13 International Business Machines Corporation Copper recess process with application to selective capping and electroless plating
KR100515058B1 (ko) * 2003-03-31 2005-09-14 삼성전자주식회사 금속 패턴을 갖는 반도체 소자의 형성방법
JP4638140B2 (ja) * 2003-07-09 2011-02-23 マグナチップセミコンダクター有限会社 半導体素子の銅配線形成方法
JP2006303063A (ja) * 2005-04-19 2006-11-02 Elpida Memory Inc 半導体装置の製造方法
US7915735B2 (en) * 2005-08-05 2011-03-29 Micron Technology, Inc. Selective metal deposition over dielectric layers
US7271086B2 (en) * 2005-09-01 2007-09-18 Micron Technology, Inc. Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
US7662714B2 (en) * 2005-10-05 2010-02-16 Dongbu Electronics Co., Ltd. Method for forming metal line of semiconductor device
US20070080455A1 (en) * 2005-10-11 2007-04-12 International Business Machines Corporation Semiconductors and methods of making
US7763538B2 (en) * 2006-01-10 2010-07-27 Freescale Semiconductor, Inc. Dual plasma treatment barrier film to reduce low-k damage
US7863183B2 (en) * 2006-01-18 2011-01-04 International Business Machines Corporation Method for fabricating last level copper-to-C4 connection with interfacial cap structure
JP2008060532A (ja) * 2006-08-04 2008-03-13 Seiko Epson Corp 半導体装置
JP5211503B2 (ja) * 2007-02-16 2013-06-12 富士通セミコンダクター株式会社 半導体装置の製造方法
US8153528B1 (en) * 2009-11-20 2012-04-10 Integrated Photovoltaic, Inc. Surface characteristics of graphite and graphite foils
CN102592982B (zh) * 2011-01-17 2017-05-03 精材科技股份有限公司 晶片封装体的形成方法
US8796150B2 (en) 2011-01-24 2014-08-05 International Business Machines Corporation Bilayer trench first hardmask structure and process for reduced defectivity
US9029260B2 (en) * 2011-06-16 2015-05-12 Taiwan Semiconductor Manufacturing Company, Ltd. Gap filling method for dual damascene process
CN103094189B (zh) * 2011-10-31 2015-11-25 中芯国际集成电路制造(上海)有限公司 硅通孔的形成方法
CN104465500A (zh) * 2014-11-26 2015-03-25 上海华力微电子有限公司 一种改善铜互连的方法
JP6318188B2 (ja) * 2016-03-30 2018-04-25 株式会社日立国際電気 半導体装置の製造方法、基板処理装置およびプログラム
US10109525B1 (en) 2017-11-21 2018-10-23 United Microelectronics Corp. Fabrication method and structure of semiconductor device with contact and plug
KR20200029835A (ko) * 2018-09-11 2020-03-19 삼성전자주식회사 반도체 소자의 배선 형성 방법 및 이에 의한 반도체 소자의 배선

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183795A (en) 1989-12-13 1993-02-02 Intel Corporation Fully planar metalization process
US5739579A (en) 1992-06-29 1998-04-14 Intel Corporation Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections
US5705430A (en) 1995-06-07 1998-01-06 Advanced Micro Devices, Inc. Dual damascene with a sacrificial via fill
US5686337A (en) 1996-01-11 1997-11-11 Vanguard International Semiconductor Corporation Method for fabricating stacked capacitors in a DRAM cell
US5674787A (en) 1996-01-16 1997-10-07 Sematech, Inc. Selective electroless copper deposited interconnect plugs for ULSI applications
US5880018A (en) * 1996-10-07 1999-03-09 Motorola Inc. Method for manufacturing a low dielectric constant inter-level integrated circuit structure
US6140234A (en) * 1998-01-20 2000-10-31 International Business Machines Corporation Method to selectively fill recesses with conductive metal
US6093966A (en) * 1998-03-20 2000-07-25 Motorola, Inc. Semiconductor device with a copper barrier layer and formation thereof

Also Published As

Publication number Publication date
EP1083597A2 (de) 2001-03-14
EP1083597A3 (de) 2003-06-18
US6184138B1 (en) 2001-02-06
JP2001102452A (ja) 2001-04-13

Similar Documents

Publication Publication Date Title
SG104923A1 (en) A method to create a controllable and reproducible dual copper damascene structure
SG104919A1 (en) Method ot form, and structure of, a dual damascene interconnect device
AU2620700A (en) Electric bicycle and methods
HK1024028A1 (en) Copper alloy and process for obtaining same
PL353734A1 (en) Copper alloy
EP1205972A4 (de) Kupferleiterbahn
EP1243672A4 (de) Plattierungsvorrichtung und -verfahren
GB0007871D0 (en) Method
IL146999A0 (en) Interconnection method and structure
EP1307076A4 (de) Struktur zur verbindung von leitern und verbindungsverfahren
GB9915625D0 (en) Method
HK1024776A1 (en) Music browser
EP1123756A4 (de) Drahtmasswalzverfahren
IL133671A0 (en) Exercise method
GB9903254D0 (en) Conductor structure
GB2336715B (en) Dual damascene structure and its manufacturing method
GB2355455B (en) Method
GB9924161D0 (en) Copper tubing
GB9624245D0 (en) Copper stickons
GB9915936D0 (en) Method
PL333444A1 (en) Novel copper alloy
TW401799U (en) Simple roaster structure
GB9927238D0 (en) Improved browser
GB9924256D0 (en) Extraction method
TW382329U (en) Improving structure for ornament ball