SG10202010058QA - Dopant compositions for ion implantation - Google Patents

Dopant compositions for ion implantation

Info

Publication number
SG10202010058QA
SG10202010058QA SG10202010058QA SG10202010058QA SG10202010058QA SG 10202010058Q A SG10202010058Q A SG 10202010058QA SG 10202010058Q A SG10202010058Q A SG 10202010058QA SG 10202010058Q A SG10202010058Q A SG 10202010058QA SG 10202010058Q A SG10202010058Q A SG 10202010058QA
Authority
SG
Singapore
Prior art keywords
ion implantation
dopant compositions
dopant
compositions
implantation
Prior art date
Application number
SG10202010058QA
Other languages
English (en)
Inventor
Aaron Reinicker
Ashwini Sinha
Original Assignee
Praxair Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Praxair Technology Inc filed Critical Praxair Technology Inc
Publication of SG10202010058QA publication Critical patent/SG10202010058QA/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00Ion implantation into wafers, substrates or parts of devices
    • H10P30/20Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/48Ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/08Ion sources; Ion guns
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/006Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31701Ion implantation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
SG10202010058QA 2016-04-11 2017-04-11 Dopant compositions for ion implantation SG10202010058QA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662321069P 2016-04-11 2016-04-11
US15/483,448 US20170294314A1 (en) 2016-04-11 2017-04-10 Germanium compositions suitable for ion implantation to produce a germanium-containing ion beam current
US15/483,522 US20170292186A1 (en) 2016-04-11 2017-04-10 Dopant compositions for ion implantation
US15/483,479 US20170294289A1 (en) 2016-04-11 2017-04-10 Boron compositions suitable for ion implantation to produce a boron-containing ion beam current

Publications (1)

Publication Number Publication Date
SG10202010058QA true SG10202010058QA (en) 2020-11-27

Family

ID=59998279

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10202010058QA SG10202010058QA (en) 2016-04-11 2017-04-11 Dopant compositions for ion implantation
SG11201808852YA SG11201808852YA (en) 2016-04-11 2017-04-11 Dopant compositions for ion implantation

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201808852YA SG11201808852YA (en) 2016-04-11 2017-04-11 Dopant compositions for ion implantation

Country Status (8)

Country Link
US (4) US20170294314A1 (https=)
EP (1) EP3443137A1 (https=)
JP (1) JP6990691B2 (https=)
KR (2) KR102443564B1 (https=)
CN (1) CN109362231B (https=)
SG (2) SG10202010058QA (https=)
TW (3) TWI724152B (https=)
WO (1) WO2017180562A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11098402B2 (en) * 2017-08-22 2021-08-24 Praxair Technology, Inc. Storage and delivery of antimony-containing materials to an ion implanter
JP2021524648A (ja) * 2018-05-17 2021-09-13 インテグリス・インコーポレーテッド イオン注入システムのための四フッ化ゲルマニウムと水素の混合物
US10892137B2 (en) * 2018-09-12 2021-01-12 Entegris, Inc. Ion implantation processes and apparatus using gallium
US10923309B2 (en) * 2018-11-01 2021-02-16 Applied Materials, Inc. GeH4/Ar plasma chemistry for ion implant productivity enhancement
US11120966B2 (en) * 2019-09-03 2021-09-14 Applied Materials, Inc. System and method for improved beam current from an ion source
US11232925B2 (en) 2019-09-03 2022-01-25 Applied Materials, Inc. System and method for improved beam current from an ion source
WO2021232036A1 (en) * 2020-05-11 2021-11-18 Praxair Technology, Inc. Storage and delivery of antimony-containing materials to an ion implanter
EP4222773A4 (en) 2020-10-02 2025-04-30 Entegris, Inc. METHODS AND SYSTEMS FOR THE PRODUCTION OF ALUMINUM IONS
KR20260003811A (ko) * 2023-05-08 2026-01-07 엔테그리스, 아이엔씨. 이온 주입 시스템 및 관련 방법

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
CA1305350C (en) * 1986-04-08 1992-07-21 Hiroshi Amada Light receiving member
US4891330A (en) * 1987-07-27 1990-01-02 Energy Conversion Devices, Inc. Method of fabricating n-type and p-type microcrystalline semiconductor alloy material including band gap widening elements
US6007609A (en) 1997-12-18 1999-12-28 Uop Llc Pressurized container with restrictor tube having multiple capillary passages
US5937895A (en) 1998-04-17 1999-08-17 Uop Llc Fail-safe delivery valve for pressurized tanks
US6045115A (en) 1998-04-17 2000-04-04 Uop Llc Fail-safe delivery arrangement for pressurized containers
US6756600B2 (en) * 1999-02-19 2004-06-29 Advanced Micro Devices, Inc. Ion implantation with improved ion source life expectancy
US7396381B2 (en) * 2004-07-08 2008-07-08 Air Products And Chemicals, Inc. Storage and delivery systems for gases held in liquid medium
JP2008124111A (ja) * 2006-11-09 2008-05-29 Nissin Electric Co Ltd プラズマcvd法によるシリコン系薄膜の形成方法
US7732309B2 (en) * 2006-12-08 2010-06-08 Applied Materials, Inc. Plasma immersed ion implantation process
US7708028B2 (en) 2006-12-08 2010-05-04 Praxair Technology, Inc. Fail-safe vacuum actuated valve for high pressure delivery systems
US7655931B2 (en) 2007-03-29 2010-02-02 Varian Semiconductor Equipment Associates, Inc. Techniques for improving the performance and extending the lifetime of an ion source with gas mixing
US7905247B2 (en) 2008-06-20 2011-03-15 Praxair Technology, Inc. Vacuum actuated valve for high capacity storage and delivery systems
EP3267470A3 (en) * 2012-02-14 2018-04-18 Entegris, Inc. Carbon dopant gas and co-flow for implant beam and source life performance improvement
SG11201500684RA (en) * 2012-08-28 2015-04-29 Praxair Technology Inc Silicon-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during silicon ion implantation
JP2016514352A (ja) * 2013-03-05 2016-05-19 インテグリス・インコーポレーテッド イオン注入のための組成物、システムおよび方法
US8883620B1 (en) * 2013-04-24 2014-11-11 Praxair Technology, Inc. Methods for using isotopically enriched levels of dopant gas compositions in an ion implantation process
WO2014190087A1 (en) * 2013-05-21 2014-11-27 Advanced Technology Materials, Inc. Enriched silicon precursor compositions and apparatus and processes for utilizing same
US9165773B2 (en) 2013-05-28 2015-10-20 Praxair Technology, Inc. Aluminum dopant compositions, delivery package and method of use
WO2015023903A1 (en) * 2013-08-16 2015-02-19 Entegris, Inc. Silicon implantation in substrates and provision of silicon precursor compositions therefor
US9209033B2 (en) * 2013-08-21 2015-12-08 Tel Epion Inc. GCIB etching method for adjusting fin height of finFET devices
WO2015191929A1 (en) * 2014-06-13 2015-12-17 Entegris, Inc. Adsorbent-based pressure stabilzation of pressure-regulated fluid storage and dispensing vessels
US9909670B2 (en) 2015-03-04 2018-03-06 Praxair Technology, Inc. Modified vacuum actuated valve assembly and sealing mechanism for improved flow stability for fluids sub-atmospherically dispensed from storage and delivery systems

Also Published As

Publication number Publication date
TWI743105B (zh) 2021-10-21
US20170294314A1 (en) 2017-10-12
TW201807235A (zh) 2018-03-01
JP2019517158A (ja) 2019-06-20
CN109362231B (zh) 2022-12-27
TW201807236A (zh) 2018-03-01
JP6990691B2 (ja) 2022-02-15
US20170294289A1 (en) 2017-10-12
TW201807234A (zh) 2018-03-01
TWI826349B (zh) 2023-12-21
SG11201808852YA (en) 2018-11-29
WO2017180562A1 (en) 2017-10-19
US20170292186A1 (en) 2017-10-12
KR20180132133A (ko) 2018-12-11
TWI724152B (zh) 2021-04-11
EP3443137A1 (en) 2019-02-20
CN109362231A (zh) 2019-02-19
KR102443564B1 (ko) 2022-09-16
US20200013621A1 (en) 2020-01-09
KR20220129108A (ko) 2022-09-22

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