SG10202006027VA - Substrate container system - Google Patents

Substrate container system

Info

Publication number
SG10202006027VA
SG10202006027VA SG10202006027VA SG10202006027VA SG10202006027VA SG 10202006027V A SG10202006027V A SG 10202006027VA SG 10202006027V A SG10202006027V A SG 10202006027VA SG 10202006027V A SG10202006027V A SG 10202006027VA SG 10202006027V A SG10202006027V A SG 10202006027VA
Authority
SG
Singapore
Prior art keywords
container system
substrate container
substrate
container
Prior art date
Application number
SG10202006027VA
Other languages
English (en)
Inventor
Chiu Ming-Chien
Lin Chih-Ming
Chung Cheng-En
Yu Nien-Yun
Lee Po-Ting
Original Assignee
Gudeng Precision Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gudeng Precision Industrial Co Ltd filed Critical Gudeng Precision Industrial Co Ltd
Publication of SG10202006027VA publication Critical patent/SG10202006027VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
SG10202006027VA 2019-07-13 2020-06-24 Substrate container system SG10202006027VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW108124813 2019-07-13
US16/872,392 US11508594B2 (en) 2019-07-13 2020-05-12 Substrate container system

Publications (1)

Publication Number Publication Date
SG10202006027VA true SG10202006027VA (en) 2021-02-25

Family

ID=74102751

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202006027VA SG10202006027VA (en) 2019-07-13 2020-06-24 Substrate container system

Country Status (6)

Country Link
US (2) US20210013075A1 (zh)
JP (2) JP2021015951A (zh)
KR (1) KR102396244B1 (zh)
CN (2) CN112289718A (zh)
SG (1) SG10202006027VA (zh)
TW (1) TWI727795B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD209117S (zh) * 2019-08-02 2021-01-01 家登精密工業股份有限公司 光罩傳送盒之上蓋
TWD209927S (zh) * 2019-08-02 2021-02-21 家登精密工業股份有限公司 光罩傳送盒之上蓋
CN117063271A (zh) * 2021-03-10 2023-11-14 恩特格里斯公司 具有前及后开口的半导体衬底载运容器
CN113937041A (zh) 2021-06-30 2022-01-14 家登精密工业股份有限公司 基板容器系统

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3198841B2 (ja) 1994-12-16 2001-08-13 日本鋼管株式会社 気体中浮遊粒子の原子吸光分析方法及び装置
CN100431930C (zh) 2005-08-04 2008-11-12 北京市塑料研究所 用于大直径硅片储存和运输的包装容器
WO2009114798A2 (en) 2008-03-13 2009-09-17 Entegris, Inc. Wafer container with tubular environmental control components
US8413815B2 (en) 2008-08-27 2013-04-09 Gudeng Precision Industrial Co, Ltd Wafer container with at least one purgeable supporting module having a long slot
KR101832512B1 (ko) 2009-12-10 2018-02-26 엔테그리스, 아이엔씨. 미세환경 안에 퍼지가스를 균일하게 분포시키는 다공성의 장벽
TWI431712B (zh) * 2011-09-20 2014-03-21 Gudeng Prec Ind Co Ltd 大型前開式晶圓盒
JP6217977B2 (ja) 2014-02-27 2017-10-25 Tdk株式会社 ポッド、及び該ポッドを用いたパージシステム
JP6351317B2 (ja) * 2014-03-14 2018-07-04 ミライアル株式会社 基板収納容器
TWM489155U (en) 2014-06-09 2014-11-01 Gudeng Precision Industrial Co Ltd Gas diffusion device of wafer pod
JP6271354B2 (ja) 2014-06-30 2018-01-31 信越ポリマー株式会社 基板収納容器及びその製造方法
WO2016013536A1 (ja) 2014-07-25 2016-01-28 信越ポリマー株式会社 基板収納容器
JP6450156B2 (ja) * 2014-11-12 2019-01-09 ミライアル株式会社 ガスパージ用フィルタ
KR20230085228A (ko) 2015-05-12 2023-06-13 엔테그리스, 아이엔씨. 외부 수동 게터 모듈을 구비하는 웨이퍼 컨테이너
JP6431440B2 (ja) * 2015-05-27 2018-11-28 信越ポリマー株式会社 基板収納容器
JP6367153B2 (ja) * 2015-06-09 2018-08-01 信越ポリマー株式会社 基板収納容器
JP6400534B2 (ja) * 2015-07-06 2018-10-03 信越ポリマー株式会社 基板収納容器
US10161033B2 (en) 2015-08-21 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method for cleaning load port of wafer processing apparatus
KR101688620B1 (ko) 2015-12-24 2016-12-21 피코앤테라(주) 웨이퍼 수납용기
KR101865636B1 (ko) 2016-07-06 2018-06-08 우범제 웨이퍼 수납용기
WO2018179964A1 (ja) * 2017-03-27 2018-10-04 信越ポリマー株式会社 基板収納容器
WO2018203384A1 (ja) 2017-05-02 2018-11-08 ミライアル株式会社 基板収納容器
TWM563421U (zh) 2018-03-06 2018-07-11 中勤實業股份有限公司 晶圓容器
JP7087357B2 (ja) 2017-11-28 2022-06-21 Tdk株式会社 ポッド及びパージ装置

Also Published As

Publication number Publication date
JP2021015951A (ja) 2021-02-12
KR102396244B1 (ko) 2022-05-09
TWI727795B (zh) 2021-05-11
CN112289719A (zh) 2021-01-29
JP2021015979A (ja) 2021-02-12
US11508594B2 (en) 2022-11-22
CN112289718A (zh) 2021-01-29
US20210013075A1 (en) 2021-01-14
KR20210008460A (ko) 2021-01-22
US20210013076A1 (en) 2021-01-14
TW202102416A (zh) 2021-01-16
JP7024159B2 (ja) 2022-02-24

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