SG10202005951YA - Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor - Google Patents

Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor

Info

Publication number
SG10202005951YA
SG10202005951YA SG10202005951YA SG10202005951YA SG10202005951YA SG 10202005951Y A SG10202005951Y A SG 10202005951YA SG 10202005951Y A SG10202005951Y A SG 10202005951YA SG 10202005951Y A SG10202005951Y A SG 10202005951YA SG 10202005951Y A SG10202005951Y A SG 10202005951YA
Authority
SG
Singapore
Prior art keywords
reducing
methods
electrochemical plating
electroplating processor
eliminating deposits
Prior art date
Application number
SG10202005951YA
Other languages
English (en)
Inventor
J Bergman Eric
Crane Stuart
A Youngbull Tricia
G Stolt Timothy
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10202005951YA publication Critical patent/SG10202005951YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B17/00—Methods preventing fouling
    • B08B17/02—Preventing deposition of fouling or of dust
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SG10202005951YA 2019-06-22 2020-06-22 Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor SG10202005951YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16/449,358 US11371159B2 (en) 2019-06-22 2019-06-22 Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor

Publications (1)

Publication Number Publication Date
SG10202005951YA true SG10202005951YA (en) 2021-01-28

Family

ID=73799440

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202005951YA SG10202005951YA (en) 2019-06-22 2020-06-22 Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor

Country Status (5)

Country Link
US (2) US11371159B2 (ko)
KR (2) KR102423646B1 (ko)
CN (1) CN112111767B (ko)
SG (1) SG10202005951YA (ko)
TW (1) TWI826698B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240287702A1 (en) * 2023-02-23 2024-08-29 Applied Materials, Inc. Methods of reducing or eliminating deposits in an electroplating system

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09279355A (ja) * 1996-04-12 1997-10-28 Kobe Steel Ltd 銅又は銅合金管内面へのめっき性に優れる無電解Ｓｎめっき液及びＳｎめっき方法
US6290865B1 (en) * 1998-11-30 2001-09-18 Applied Materials, Inc. Spin-rinse-drying process for electroplated semiconductor wafers
US6494219B1 (en) * 2000-03-22 2002-12-17 Applied Materials, Inc. Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits
US6692588B1 (en) * 1999-07-12 2004-02-17 Nutool, Inc. Method and apparatus for simultaneously cleaning and annealing a workpiece
JP3695703B2 (ja) * 2001-10-25 2005-09-14 株式会社日立製作所 電気めっき方法、電気めっき装置及び半導体装置の製造方法及び製造装置
US20050028838A1 (en) * 2002-11-25 2005-02-10 Karl Brueckner Cleaning tantalum-containing deposits from process chamber components
JP3741682B2 (ja) * 2002-12-03 2006-02-01 松下電器産業株式会社 メッキ方法、メッキ装置及び電子デバイスの製造方法
JP4880301B2 (ja) * 2005-12-26 2012-02-22 石原薬品株式会社 無電解スズメッキの後処理方法
WO2007116493A1 (ja) * 2006-03-31 2007-10-18 Ebara-Udylite Co., Ltd. プラスチック用の表面改質液およびそれを利用したプラスチック表面の金属化方法
US9222194B2 (en) * 2010-08-19 2015-12-29 International Business Machines Corporation Rinsing and drying for electrochemical processing
JP2012109290A (ja) * 2010-11-15 2012-06-07 Kurita Water Ind Ltd シリコンウェハ清浄化方法及びシリコンウェハ清浄化装置
SG11201406133WA (en) * 2012-03-28 2014-10-30 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
US20130264214A1 (en) * 2012-04-04 2013-10-10 Rohm And Haas Electronic Materials Llc Metal plating for ph sensitive applications
JP6022836B2 (ja) * 2012-07-18 2016-11-09 株式会社荏原製作所 めっき装置及び基板ホルダ洗浄方法
US9598788B2 (en) * 2012-09-27 2017-03-21 Applied Materials, Inc. Electroplating apparatus with contact ring deplating

Also Published As

Publication number Publication date
US11697888B2 (en) 2023-07-11
KR102423646B1 (ko) 2022-07-20
TW202100816A (zh) 2021-01-01
CN112111767B (zh) 2023-06-27
KR20220104666A (ko) 2022-07-26
KR102523929B1 (ko) 2023-04-19
TWI826698B (zh) 2023-12-21
US11371159B2 (en) 2022-06-28
US20220282394A1 (en) 2022-09-08
CN112111767A (zh) 2020-12-22
KR20200145741A (ko) 2020-12-30
US20200399779A1 (en) 2020-12-24

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