SG10202005438WA - Slurry used in polishing a substrate - Google Patents

Slurry used in polishing a substrate

Info

Publication number
SG10202005438WA
SG10202005438WA SG10202005438WA SG10202005438WA SG10202005438WA SG 10202005438W A SG10202005438W A SG 10202005438WA SG 10202005438W A SG10202005438W A SG 10202005438WA SG 10202005438W A SG10202005438W A SG 10202005438WA SG 10202005438W A SG10202005438W A SG 10202005438WA
Authority
SG
Singapore
Prior art keywords
polishing
substrate
slurry used
slurry
Prior art date
Application number
SG10202005438WA
Other languages
English (en)
Inventor
Nakanishi Yasuyuki
Yoshimura Katsuhiro
tanaka Mizuki
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of SG10202005438WA publication Critical patent/SG10202005438WA/en

Links

SG10202005438WA 2012-06-19 2013-06-07 Slurry used in polishing a substrate SG10202005438WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012137764A JP5613723B2 (ja) 2012-06-19 2012-06-19 キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置

Publications (1)

Publication Number Publication Date
SG10202005438WA true SG10202005438WA (en) 2020-07-29

Family

ID=50035837

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10202005438WA SG10202005438WA (en) 2012-06-19 2013-06-07 Slurry used in polishing a substrate
SG10201510276UA SG10201510276UA (en) 2012-06-19 2013-06-07 Slurry used in polishing a substrate

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201510276UA SG10201510276UA (en) 2012-06-19 2013-06-07 Slurry used in polishing a substrate

Country Status (3)

Country Link
JP (1) JP5613723B2 (https=)
MY (1) MY164088A (https=)
SG (2) SG10202005438WA (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110752143A (zh) * 2019-09-03 2020-02-04 福建晶安光电有限公司 一种提升蓝宝石衬底平坦度的工艺
JP7291795B2 (ja) * 2019-09-30 2023-06-15 Hoya株式会社 基板配置支援治具及び基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1128657A (ja) * 1997-07-08 1999-02-02 Syst Seiko Kk 研磨具のドレッシング方法および装置
JP2000198064A (ja) * 1999-01-07 2000-07-18 Daido Steel Co Ltd 研磨機用キャリヤ
JP2000237949A (ja) * 1999-02-12 2000-09-05 Komag Inc 研磨パッドの清掃方法及び装置
JP2000280167A (ja) * 1999-03-30 2000-10-10 Kyocera Corp キャリアプレート及びこれを用いた両面研磨装置
JP2004023038A (ja) * 2002-06-20 2004-01-22 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハの研磨装置

Also Published As

Publication number Publication date
MY164088A (en) 2017-11-30
JP2014002818A (ja) 2014-01-09
SG10201510276UA (en) 2016-01-28
JP5613723B2 (ja) 2014-10-29

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