SG10201913356PA - Dummy disk, dressing disk, and surface height measurement method using dummy disk - Google Patents

Dummy disk, dressing disk, and surface height measurement method using dummy disk

Info

Publication number
SG10201913356PA
SG10201913356PA SG10201913356PA SG10201913356PA SG10201913356PA SG 10201913356P A SG10201913356P A SG 10201913356PA SG 10201913356P A SG10201913356P A SG 10201913356PA SG 10201913356P A SG10201913356P A SG 10201913356PA SG 10201913356P A SG10201913356P A SG 10201913356PA
Authority
SG
Singapore
Prior art keywords
disk
dummy
measurement method
dressing
surface height
Prior art date
Application number
SG10201913356PA
Inventor
Hiroyuki Shinozaki
Yasuyuki Motoshima
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201913356PA publication Critical patent/SG10201913356PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B17/00—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor
    • B24B17/08—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor involving fluid transmission means only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10201913356PA 2019-01-31 2019-12-26 Dummy disk, dressing disk, and surface height measurement method using dummy disk SG10201913356PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019015564A JP7315332B2 (en) 2019-01-31 2019-01-31 Surface height measurement method using dummy disk and dummy disk

Publications (1)

Publication Number Publication Date
SG10201913356PA true SG10201913356PA (en) 2020-08-28

Family

ID=71837272

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201913356PA SG10201913356PA (en) 2019-01-31 2019-12-26 Dummy disk, dressing disk, and surface height measurement method using dummy disk

Country Status (4)

Country Link
US (2) US20200246936A1 (en)
JP (1) JP7315332B2 (en)
KR (1) KR20200095345A (en)
SG (1) SG10201913356PA (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022067788A (en) * 2020-10-21 2022-05-09 株式会社ディスコ Linear gauge
US11766758B2 (en) * 2021-01-27 2023-09-26 Taiwan Semiconductor Manufacturing Company Limited Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2263911B (en) * 1991-12-10 1995-11-08 Minnesota Mining & Mfg Tool comprising abrasives in an electrodeposited metal binder dispersed in a binder matrix
US5527424A (en) * 1995-01-30 1996-06-18 Motorola, Inc. Preconditioner for a polishing pad and method for using the same
JP2001219376A (en) 2000-02-07 2001-08-14 Mitsubishi Materials Corp Electrodeposition grinding wheel
US6419574B1 (en) * 1999-09-01 2002-07-16 Mitsubishi Materials Corporation Abrasive tool with metal binder phase
JP2003145424A (en) 2001-11-09 2003-05-20 Tokyo Seimitsu Co Ltd Polishing pad dressing device and polishing device having the same
US8678878B2 (en) * 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
JP4971028B2 (en) * 2007-05-16 2012-07-11 東洋ゴム工業株式会社 Polishing pad manufacturing method
JP5236515B2 (en) 2009-01-28 2013-07-17 株式会社荏原製作所 Dressing apparatus, chemical mechanical polishing apparatus and method
US9254547B2 (en) * 2010-03-31 2016-02-09 Applied Materials, Inc. Side pad design for edge pedestal
KR101674058B1 (en) * 2010-10-05 2016-11-09 삼성전자 주식회사 Chemical mechanical polishing apparatus having pad conditioning disk, and pre-conditioner unit
JP5896625B2 (en) 2011-06-02 2016-03-30 株式会社荏原製作所 Method and apparatus for monitoring the polishing surface of a polishing pad used in a polishing apparatus
JP6592355B2 (en) 2015-01-30 2019-10-16 株式会社荏原製作所 Connecting mechanism and substrate polishing apparatus
KR102581481B1 (en) * 2016-10-18 2023-09-21 삼성전자주식회사 Method of chemical mechanical polishing, method of manufacturing semiconductor device and apparatus of manufacturing semiconductor

Also Published As

Publication number Publication date
US20200246936A1 (en) 2020-08-06
JP2020121385A (en) 2020-08-13
TW202045309A (en) 2020-12-16
KR20200095345A (en) 2020-08-10
US20230415299A1 (en) 2023-12-28
JP7315332B2 (en) 2023-07-26

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