SG10202009340YA - Polishing composition and polishing method - Google Patents
Polishing composition and polishing methodInfo
- Publication number
- SG10202009340YA SG10202009340YA SG10202009340YA SG10202009340YA SG10202009340YA SG 10202009340Y A SG10202009340Y A SG 10202009340YA SG 10202009340Y A SG10202009340Y A SG 10202009340YA SG 10202009340Y A SG10202009340Y A SG 10202009340YA SG 10202009340Y A SG10202009340Y A SG 10202009340YA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- composition
- polishing composition
- polishing method
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32055—Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019175307 | 2019-09-26 | ||
JP2020030986A JP7356932B2 (en) | 2019-09-26 | 2020-02-26 | Polishing composition and polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202009340YA true SG10202009340YA (en) | 2021-04-29 |
Family
ID=75271553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202009340YA SG10202009340YA (en) | 2019-09-26 | 2020-09-23 | Polishing composition and polishing method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7356932B2 (en) |
KR (1) | KR20210036804A (en) |
SG (1) | SG10202009340YA (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022154513A (en) * | 2021-03-30 | 2022-10-13 | 株式会社フジミインコーポレーテッド | Semiconductor substrate manufacturing method, and semiconductor substrate obtained by the sane |
WO2023189899A1 (en) * | 2022-04-01 | 2023-10-05 | 株式会社フジミインコーポレーテッド | Polishing composition |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7291280B2 (en) * | 2004-12-28 | 2007-11-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multi-step methods for chemical mechanical polishing silicon dioxide and silicon nitride |
JP4776269B2 (en) * | 2005-04-28 | 2011-09-21 | 株式会社東芝 | Metal film CMP slurry and method for manufacturing semiconductor device |
JP2008085058A (en) | 2006-09-27 | 2008-04-10 | Hitachi Chem Co Ltd | Additive for cmp abrasive, cmp abrasive, and substrate polishing method, and electronic component |
JP2015086355A (en) | 2013-09-27 | 2015-05-07 | 株式会社フジミインコーポレーテッド | Polishing composition, polishing method and method for producing substrate |
JP7104053B2 (en) * | 2017-09-07 | 2022-07-20 | 株式会社フジミインコーポレーテッド | Polishing composition and silicon substrate polishing method |
JP7111739B2 (en) | 2017-12-15 | 2022-08-02 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
-
2020
- 2020-02-26 JP JP2020030986A patent/JP7356932B2/en active Active
- 2020-08-28 KR KR1020200109047A patent/KR20210036804A/en unknown
- 2020-09-23 SG SG10202009340YA patent/SG10202009340YA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP7356932B2 (en) | 2023-10-05 |
TW202112991A (en) | 2021-04-01 |
JP2021055041A (en) | 2021-04-08 |
KR20210036804A (en) | 2021-04-05 |
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