SG10201910032WA - Wafer processing method - Google Patents

Wafer processing method

Info

Publication number
SG10201910032WA
SG10201910032WA SG10201910032WA SG10201910032WA SG10201910032WA SG 10201910032W A SG10201910032W A SG 10201910032WA SG 10201910032W A SG10201910032W A SG 10201910032WA SG 10201910032W A SG10201910032W A SG 10201910032WA SG 10201910032W A SG10201910032W A SG 10201910032WA
Authority
SG
Singapore
Prior art keywords
processing method
wafer processing
wafer
processing
Prior art date
Application number
SG10201910032WA
Other languages
English (en)
Inventor
Harada Shigenori
Matsuzawa Minoru
Kiuchi Hayato
Yodo Yoshiaki
Arakawa Taro
Agari Masamitsu
Kawamura Emiko
Fujii Yusuke
Miyai Toshiki
Ohmae Makiko
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201910032WA publication Critical patent/SG10201910032WA/en

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Classifications

    • H—ELECTRICITY
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    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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    • H01L21/67011—Apparatus for manufacture or treatment
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    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
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    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
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    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
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    • H01L2924/1033—Gallium nitride [GaN]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG10201910032WA 2018-11-06 2019-10-26 Wafer processing method SG10201910032WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018208629A JP2020077681A (ja) 2018-11-06 2018-11-06 ウェーハの加工方法

Publications (1)

Publication Number Publication Date
SG10201910032WA true SG10201910032WA (en) 2020-06-29

Family

ID=70457809

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201910032WA SG10201910032WA (en) 2018-11-06 2019-10-26 Wafer processing method

Country Status (8)

Country Link
US (1) US11031234B2 (ko)
JP (1) JP2020077681A (ko)
KR (1) KR20200052831A (ko)
CN (1) CN111146115A (ko)
DE (1) DE102019217093A1 (ko)
MY (1) MY194815A (ko)
SG (1) SG10201910032WA (ko)
TW (1) TWI826569B (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7430515B2 (ja) * 2019-11-06 2024-02-13 株式会社ディスコ ウエーハの処理方法
KR20210133787A (ko) 2020-04-29 2021-11-08 주식회사 엘지에너지솔루션 배터리 팩, 그것을 포함하는 전자 디바이스, 및 자동차

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TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
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JP4647228B2 (ja) * 2004-04-01 2011-03-09 株式会社ディスコ ウェーハの加工方法
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