SG10201906698QA - Post etch residue cleaning compositions and methods of using the same - Google Patents

Post etch residue cleaning compositions and methods of using the same

Info

Publication number
SG10201906698QA
SG10201906698QA SG10201906698QA SG10201906698QA SG10201906698QA SG 10201906698Q A SG10201906698Q A SG 10201906698QA SG 10201906698Q A SG10201906698Q A SG 10201906698QA SG 10201906698Q A SG10201906698Q A SG 10201906698QA SG 10201906698Q A SG10201906698Q A SG 10201906698QA
Authority
SG
Singapore
Prior art keywords
methods
same
cleaning compositions
etch residue
residue cleaning
Prior art date
Application number
SG10201906698QA
Other languages
English (en)
Inventor
Sun Laisheng
Lee Yi-Chia
Wang Lili
Wu Aiping
Original Assignee
Versum Materials Us Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Versum Materials Us Llc filed Critical Versum Materials Us Llc
Publication of SG10201906698QA publication Critical patent/SG10201906698QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/0008—Detergent materials or soaps characterised by their shape or physical properties aqueous liquid non soap compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/267—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3245—Aminoacids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C11D2111/22—
SG10201906698QA 2018-07-24 2019-07-19 Post etch residue cleaning compositions and methods of using the same SG10201906698QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862702633P 2018-07-24 2018-07-24
US16/457,119 US11091727B2 (en) 2018-07-24 2019-06-28 Post etch residue cleaning compositions and methods of using the same

Publications (1)

Publication Number Publication Date
SG10201906698QA true SG10201906698QA (en) 2020-02-27

Family

ID=67438705

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201906698QA SG10201906698QA (en) 2018-07-24 2019-07-19 Post etch residue cleaning compositions and methods of using the same

Country Status (6)

Country Link
US (1) US11091727B2 (zh)
EP (1) EP3599633B1 (zh)
JP (1) JP7022100B2 (zh)
CN (1) CN110777021A (zh)
SG (1) SG10201906698QA (zh)
TW (1) TWI734149B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101971824B1 (ko) * 2018-03-05 2019-04-23 캐논 톡키 가부시키가이샤 로봇, 로봇 시스템, 디바이스 제조 장치, 디바이스 제조 방법 및 티칭 위치 조정 방법
KR102003659B1 (ko) * 2019-03-05 2019-07-24 캐논 톡키 가부시키가이샤 로봇 시스템, 디바이스 제조 장치, 디바이스 제조 방법, 티칭 위치 조정 방법 및 컴퓨터 판독가능 기록 매체
CN112500938A (zh) * 2020-12-22 2021-03-16 苏州柏越纳米科技有限公司 半水基型半导体元器件清洗剂
TW202328423A (zh) * 2021-11-11 2023-07-16 美商陶氏全球科技責任有限公司 包含螯合劑的二醇組成物
CN114273320B (zh) * 2021-12-23 2022-11-08 江阴江化微电子材料股份有限公司 一种半导体晶圆干刻后清洗工艺

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4368220A (en) 1981-06-30 1983-01-11 International Business Machines Corporation Passivation of RIE patterned al-based alloy films by etching to remove contaminants and surface oxide followed by oxidation
JP4356962B2 (ja) 1998-11-27 2009-11-04 昭和電工株式会社 サイドウォール除去用組成物及びサイドウォール除去方法
JP3328250B2 (ja) 1998-12-09 2002-09-24 岸本産業株式会社 レジスト残渣除去剤
US7087564B2 (en) 2004-03-05 2006-08-08 Air Liquide America, L.P. Acidic chemistry for post-CMP cleaning
JP2007531992A (ja) * 2004-03-30 2007-11-08 ビーエーエスエフ　アクチェンゲゼルシャフト エッチング残渣を除去するための水溶液
TWI564387B (zh) * 2007-05-17 2017-01-01 恩特葛瑞斯股份有限公司 用於移除化學機械研磨後殘留物之清洗組成物、套組及方法
JP2010535422A (ja) * 2007-08-02 2010-11-18 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド マイクロ電子デバイスから残渣を除去するための非フッ化物含有組成物
CN102216854A (zh) * 2008-08-04 2011-10-12 高级技术材料公司 环境友好型聚合物剥离组合物
JP5873718B2 (ja) * 2008-10-21 2016-03-01 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 銅の洗浄及び保護配合物
KR20110127244A (ko) 2009-03-11 2011-11-24 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 표면 상의 잔류물을 제거하기 위한 세정 조성물
WO2012009639A2 (en) 2010-07-16 2012-01-19 Advanced Technology Materials, Inc. Aqueous cleaner for the removal of post-etch residues
KR20140008995A (ko) * 2010-11-19 2014-01-22 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 반도체 기판의 세정용 액체 조성물 및 이를 이용한 반도체 기판의 세정 방법
KR101493294B1 (ko) * 2012-10-08 2015-02-16 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 두꺼운 필름 레지스트를 제거하기 위한 스트리핑 및 세정 조성물
US20160122696A1 (en) * 2013-05-17 2016-05-05 Advanced Technology Materials, Inc. Compositions and methods for removing ceria particles from a surface
JP6200289B2 (ja) * 2013-11-18 2017-09-20 富士フイルム株式会社 半導体基板の処理液、処理方法、これらを用いた半導体基板製品の製造方法
JP2015165562A (ja) 2014-02-06 2015-09-17 三菱化学株式会社 半導体デバイス用基板洗浄液及び半導体デバイス用基板の洗浄方法
WO2016111990A1 (en) 2015-01-05 2016-07-14 Entegris, Inc. Post chemical mechanical polishing formulations and method of use
TWI782893B (zh) 2015-07-09 2022-11-11 美商恩特葛瑞斯股份有限公司 選擇性地移除鍺化矽材料之方法、套組及組成物
US10072237B2 (en) * 2015-08-05 2018-09-11 Versum Materials Us, Llc Photoresist cleaning composition used in photolithography and a method for treating substrate therewith
WO2017156304A1 (en) 2016-03-09 2017-09-14 Entegris, Inc. Tungsten post-cmp cleaning compositions
WO2018191424A1 (en) 2017-04-11 2018-10-18 Entegris, Inc. Post chemical mechanical polishing formulations and method of use

Also Published As

Publication number Publication date
JP2020047913A (ja) 2020-03-26
EP3599633A1 (en) 2020-01-29
TW202007770A (zh) 2020-02-16
US11091727B2 (en) 2021-08-17
JP7022100B2 (ja) 2022-02-17
US20200032177A1 (en) 2020-01-30
TWI734149B (zh) 2021-07-21
CN110777021A (zh) 2020-02-11
EP3599633B1 (en) 2023-12-06

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