SG10201902777SA - Processing apparatus - Google Patents

Processing apparatus

Info

Publication number
SG10201902777SA
SG10201902777SA SG10201902777SA SG10201902777SA SG 10201902777S A SG10201902777S A SG 10201902777SA SG 10201902777S A SG10201902777S A SG 10201902777SA SG 10201902777S A SG10201902777S A SG 10201902777SA
Authority
SG
Singapore
Prior art keywords
unit
processed groove
workpiece
display
processing apparatus
Prior art date
Application number
Other languages
English (en)
Inventor
Keiji Kashiwagi
Satoshi Miyata
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201902777SA publication Critical patent/SG10201902777SA/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/2428—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring existing positions of tools or workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005—Devices for the automatic drive or the program control of the machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36185—Application, for cylindrical groove shape
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50122—Workpiece holder, chuck jaws, fixture setup

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Optics & Photonics (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • User Interface Of Digital Computer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Image Analysis (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
SG10201902777S 2018-04-13 2019-03-28 Processing apparatus SG10201902777SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018077357A JP7126849B2 (ja) 2018-04-13 2018-04-13 加工装置

Publications (1)

Publication Number Publication Date
SG10201902777SA true SG10201902777SA (en) 2019-11-28

Family

ID=68053024

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201902777S SG10201902777SA (en) 2018-04-13 2019-03-28 Processing apparatus

Country Status (8)

Country Link
US (1) US10935957B2 (zh)
JP (1) JP7126849B2 (zh)
KR (1) KR20190120071A (zh)
CN (1) CN110370471B (zh)
DE (1) DE102019205233A1 (zh)
MY (1) MY194677A (zh)
SG (1) SG10201902777SA (zh)
TW (1) TWI797310B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7382833B2 (ja) 2020-01-06 2023-11-17 株式会社ディスコ 加工装置
JP7370265B2 (ja) * 2020-01-30 2023-10-27 株式会社ディスコ 加工方法及び加工装置
JP7430449B2 (ja) * 2020-02-04 2024-02-13 株式会社ディスコ 加工装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10197221A (ja) * 1997-01-13 1998-07-31 Topcon Corp 測定顕微鏡
JP4462717B2 (ja) * 2000-05-22 2010-05-12 株式会社ディスコ 回転ブレードの位置検出装置
JP5134216B2 (ja) * 2006-06-23 2013-01-30 株式会社ディスコ ウエーハの加工結果管理方法
JP2008004885A (ja) * 2006-06-26 2008-01-10 Disco Abrasive Syst Ltd 加工装置
JP4972447B2 (ja) * 2007-04-06 2012-07-11 オークマ株式会社 数値制御装置
JP2009083016A (ja) * 2007-09-28 2009-04-23 Disco Abrasive Syst Ltd 切削装置
JP5539023B2 (ja) 2010-05-25 2014-07-02 株式会社ディスコ ウェーハの加工方法
IT1401373B1 (it) * 2010-08-06 2013-07-18 Fidia Spa Sistema predittivo di controllo e visualizzazione virtuale per una macchina utensile a controllo numerico
CN103209806B (zh) * 2010-11-10 2016-11-16 交互式机器系统有限公司 用于操纵机床的辅助系统
JP5762005B2 (ja) 2011-01-13 2015-08-12 株式会社ディスコ 加工位置調製方法及び加工装置
JP5844059B2 (ja) 2011-03-10 2016-01-13 東芝機械株式会社 ワーク切削ラインの表示方法
JP5908351B2 (ja) * 2012-06-26 2016-04-26 セイコープレシジョン株式会社 穴開け位置決定装置、穴開け位置決定方法、及び、プログラム
JP6282194B2 (ja) * 2014-07-30 2018-02-21 株式会社ディスコ ウェーハの加工方法
JP6695102B2 (ja) * 2015-05-26 2020-05-20 株式会社ディスコ 加工システム
JP6746198B2 (ja) * 2016-04-01 2020-08-26 株式会社ディスコ 切削装置
JP6707396B2 (ja) * 2016-05-11 2020-06-10 株式会社ディスコ 切削装置
US10654185B2 (en) * 2016-07-29 2020-05-19 John Bean Technologies Corporation Cutting/portioning using combined X-ray and optical scanning

Also Published As

Publication number Publication date
TW201944030A (zh) 2019-11-16
JP7126849B2 (ja) 2022-08-29
MY194677A (en) 2022-12-13
US10935957B2 (en) 2021-03-02
DE102019205233A1 (de) 2019-10-17
CN110370471A (zh) 2019-10-25
JP2019186447A (ja) 2019-10-24
US20190317471A1 (en) 2019-10-17
TWI797310B (zh) 2023-04-01
KR20190120071A (ko) 2019-10-23
CN110370471B (zh) 2022-08-02

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