SG10201902228PA - Annular grindstone - Google Patents

Annular grindstone

Info

Publication number
SG10201902228PA
SG10201902228PA SG10201902228PA SG10201902228PA SG 10201902228P A SG10201902228P A SG 10201902228PA SG 10201902228P A SG10201902228P A SG 10201902228PA SG 10201902228P A SG10201902228P A SG 10201902228PA
Authority
SG
Singapore
Prior art keywords
grindstone
annular
nickel
iron
binding material
Prior art date
Application number
Other languages
English (en)
Inventor
Hiroki Aikawa
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201902228PA publication Critical patent/SG10201902228PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/066—Grinding blocks; their mountings or supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B26D2001/0053—Cutting members therefor having a special cutting edge section or blade section

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
SG10201902228P 2018-03-29 2019-03-13 Annular grindstone SG10201902228PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018065229A JP7094622B2 (ja) 2018-03-29 2018-03-29 環状の砥石

Publications (1)

Publication Number Publication Date
SG10201902228PA true SG10201902228PA (en) 2019-10-30

Family

ID=67910336

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201902228P SG10201902228PA (en) 2018-03-29 2019-03-13 Annular grindstone

Country Status (7)

Country Link
US (1) US11229986B2 (ko)
JP (1) JP7094622B2 (ko)
KR (1) KR102607966B1 (ko)
CN (1) CN110315415B (ko)
DE (1) DE102019204461A1 (ko)
SG (1) SG10201902228PA (ko)
TW (1) TWI799556B (ko)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08130201A (ja) 1994-10-28 1996-05-21 Disco Abrasive Syst Ltd 混合手段を有する処理装置
JP3250411B2 (ja) * 1995-04-07 2002-01-28 ソニー株式会社 半導体装置の製造方法
JPH10166275A (ja) * 1996-12-09 1998-06-23 Toho Titanium Co Ltd 超砥粒工具及びこれに用いる下地ボンド
JPH11300184A (ja) 1998-04-21 1999-11-02 Disco Abrasive Syst Ltd 混合水生成装置
JP3992168B2 (ja) 1998-09-17 2007-10-17 株式会社ディスコ 電着ブレードの製造方法
SE521488C2 (sv) * 2000-12-22 2003-11-04 Seco Tools Ab Belagt skär med järn-nickel-baserad bindefas
US20040041121A1 (en) * 2002-08-30 2004-03-04 Shigeyoshi Yoshida Magnetic loss material and method of producing the same
CN101160405B (zh) * 2005-04-12 2014-01-01 纳幕尔杜邦公司 处理生物质以获得目标化学物质
MY151755A (en) * 2007-12-28 2014-06-30 Shinetsu Chemical Co Outer blade cutting wheel and making method
CN101338441A (zh) * 2008-08-19 2009-01-07 兰桥昌 一种电镀金刚石制品胎体及其电镀工艺
CN201667329U (zh) * 2009-08-27 2010-12-08 中国电子科技集团公司第四十三研究所 用于抗电化学腐蚀电子封装外壳的镀层
TWI671411B (zh) * 2015-02-10 2019-09-11 日商大日本印刷股份有限公司 有機ｅｌ顯示裝置用蒸鍍遮罩之製造方法、欲製作有機ｅｌ顯示裝置用蒸鍍遮罩所使用之金屬板及其製造方法
JP2016168655A (ja) 2015-03-13 2016-09-23 株式会社ディスコ 電着砥石の製造方法
JP2017052019A (ja) 2015-09-07 2017-03-16 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
JP2017087353A (ja) * 2015-11-10 2017-05-25 株式会社ディスコ 電着砥石の製造方法
CN108422336B (zh) * 2018-04-18 2019-09-17 郑州磨料磨具磨削研究所有限公司 一种多孔型电镀结合剂砂轮及其制备方法

Also Published As

Publication number Publication date
US20190299366A1 (en) 2019-10-03
JP7094622B2 (ja) 2022-07-04
US11229986B2 (en) 2022-01-25
DE102019204461A1 (de) 2019-10-02
CN110315415B (zh) 2023-02-21
TW201942375A (zh) 2019-11-01
KR102607966B1 (ko) 2023-11-29
TWI799556B (zh) 2023-04-21
KR20190114759A (ko) 2019-10-10
JP2019171543A (ja) 2019-10-10
CN110315415A (zh) 2019-10-11

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