TWI799556B - 環狀磨石 - Google Patents
環狀磨石 Download PDFInfo
- Publication number
- TWI799556B TWI799556B TW108110551A TW108110551A TWI799556B TW I799556 B TWI799556 B TW I799556B TW 108110551 A TW108110551 A TW 108110551A TW 108110551 A TW108110551 A TW 108110551A TW I799556 B TWI799556 B TW I799556B
- Authority
- TW
- Taiwan
- Prior art keywords
- ring grindstone
- grindstone
- ring
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/066—Grinding blocks; their mountings or supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/0053—Cutting members therefor having a special cutting edge section or blade section
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Forests & Forestry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-065229 | 2018-03-29 | ||
JP2018065229A JP7094622B2 (ja) | 2018-03-29 | 2018-03-29 | 環状の砥石 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201942375A TW201942375A (zh) | 2019-11-01 |
TWI799556B true TWI799556B (zh) | 2023-04-21 |
Family
ID=67910336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108110551A TWI799556B (zh) | 2018-03-29 | 2019-03-26 | 環狀磨石 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11229986B2 (zh) |
JP (1) | JP7094622B2 (zh) |
KR (1) | KR102607966B1 (zh) |
CN (1) | CN110315415B (zh) |
DE (1) | DE102019204461A1 (zh) |
SG (1) | SG10201902228PA (zh) |
TW (1) | TWI799556B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200940262A (en) * | 2007-12-28 | 2009-10-01 | Shinetsu Chemical Co | Cutting wheels, their manufacture and use |
JP2017052019A (ja) * | 2015-09-07 | 2017-03-16 | 新日鉄住金マテリアルズ株式会社 | 研磨布用ドレッサー |
TW201718182A (zh) * | 2015-11-10 | 2017-06-01 | Disco Corp | 電沉積磨石的製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08130201A (ja) | 1994-10-28 | 1996-05-21 | Disco Abrasive Syst Ltd | 混合手段を有する処理装置 |
JP3250411B2 (ja) * | 1995-04-07 | 2002-01-28 | ソニー株式会社 | 半導体装置の製造方法 |
JPH10166275A (ja) * | 1996-12-09 | 1998-06-23 | Toho Titanium Co Ltd | 超砥粒工具及びこれに用いる下地ボンド |
JPH11300184A (ja) | 1998-04-21 | 1999-11-02 | Disco Abrasive Syst Ltd | 混合水生成装置 |
JP3992168B2 (ja) * | 1998-09-17 | 2007-10-17 | 株式会社ディスコ | 電着ブレードの製造方法 |
SE521488C2 (sv) * | 2000-12-22 | 2003-11-04 | Seco Tools Ab | Belagt skär med järn-nickel-baserad bindefas |
US20040041121A1 (en) * | 2002-08-30 | 2004-03-04 | Shigeyoshi Yoshida | Magnetic loss material and method of producing the same |
EP1869197A2 (en) * | 2005-04-12 | 2007-12-26 | E.I. Dupont De Nemours And Company | Treatment of biomass to obtain ethanol |
CN101338441A (zh) * | 2008-08-19 | 2009-01-07 | 兰桥昌 | 一种电镀金刚石制品胎体及其电镀工艺 |
CN201667329U (zh) * | 2009-08-27 | 2010-12-08 | 中国电子科技集团公司第四十三研究所 | 用于抗电化学腐蚀电子封装外壳的镀层 |
CN106460150B (zh) * | 2015-02-10 | 2020-01-10 | 大日本印刷株式会社 | 蒸镀掩模的制造方法、用于制作蒸镀掩模的金属板及其制造方法 |
JP2016168655A (ja) | 2015-03-13 | 2016-09-23 | 株式会社ディスコ | 電着砥石の製造方法 |
CN108422336B (zh) * | 2018-04-18 | 2019-09-17 | 郑州磨料磨具磨削研究所有限公司 | 一种多孔型电镀结合剂砂轮及其制备方法 |
-
2018
- 2018-03-29 JP JP2018065229A patent/JP7094622B2/ja active Active
-
2019
- 2019-03-12 KR KR1020190028058A patent/KR102607966B1/ko active IP Right Grant
- 2019-03-13 SG SG10201902228P patent/SG10201902228PA/en unknown
- 2019-03-20 CN CN201910211293.0A patent/CN110315415B/zh active Active
- 2019-03-21 US US16/360,681 patent/US11229986B2/en active Active
- 2019-03-26 TW TW108110551A patent/TWI799556B/zh active
- 2019-03-29 DE DE102019204461.1A patent/DE102019204461A1/de active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200940262A (en) * | 2007-12-28 | 2009-10-01 | Shinetsu Chemical Co | Cutting wheels, their manufacture and use |
CN105773457A (zh) * | 2007-12-28 | 2016-07-20 | 信越化学工业株式会社 | 外刃切割砂轮及其制造方法 |
JP2017052019A (ja) * | 2015-09-07 | 2017-03-16 | 新日鉄住金マテリアルズ株式会社 | 研磨布用ドレッサー |
TW201718182A (zh) * | 2015-11-10 | 2017-06-01 | Disco Corp | 電沉積磨石的製造方法 |
Non-Patent Citations (1)
Title |
---|
期刊 Lirong Tan等撰寫 Electroplating Nickel-iron Alloy on the Diamond Surface Key Engineering Materials Vol.416 Trans Tech. Publications 2009年出版 pp.164-167 * |
Also Published As
Publication number | Publication date |
---|---|
CN110315415B (zh) | 2023-02-21 |
JP2019171543A (ja) | 2019-10-10 |
CN110315415A (zh) | 2019-10-11 |
JP7094622B2 (ja) | 2022-07-04 |
KR20190114759A (ko) | 2019-10-10 |
KR102607966B1 (ko) | 2023-11-29 |
US11229986B2 (en) | 2022-01-25 |
TW201942375A (zh) | 2019-11-01 |
DE102019204461A1 (de) | 2019-10-02 |
SG10201902228PA (en) | 2019-10-30 |
US20190299366A1 (en) | 2019-10-03 |
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