SG10201901084WA - Foup cleaning device and foup cleaning method - Google Patents
Foup cleaning device and foup cleaning methodInfo
- Publication number
- SG10201901084WA SG10201901084WA SG10201901084WA SG10201901084WA SG10201901084WA SG 10201901084W A SG10201901084W A SG 10201901084WA SG 10201901084W A SG10201901084W A SG 10201901084WA SG 10201901084W A SG10201901084W A SG 10201901084WA SG 10201901084W A SG10201901084W A SG 10201901084WA
- Authority
- SG
- Singapore
- Prior art keywords
- foup
- cleaning
- cover
- loading
- cleaning device
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 16
- 238000000034 method Methods 0.000 title abstract 4
- 101100438971 Caenorhabditis elegans mat-1 gene Proteins 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/0861—Cleaning crates, boxes or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
- A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
- A61L2/08—Radiation
- A61L2/10—Ultraviolet radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/0821—Handling or manipulating containers, e.g. moving or rotating containers in cleaning devices, conveying to or from cleaning devices
- B08B9/0826—Handling or manipulating containers, e.g. moving or rotating containers in cleaning devices, conveying to or from cleaning devices the containers being brought to the cleaning device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
- B08B9/0936—Cleaning containers, e.g. tanks by the force of jets or sprays using rotating jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/205—Conveying containers to or from the cleaning machines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/007—Heating the liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2209/00—Details of machines or methods for cleaning hollow articles
- B08B2209/08—Details of machines or methods for cleaning containers, e.g. tanks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2230/00—Other cleaning aspects applicable to all B08B range
- B08B2230/01—Cleaning with steam
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Veterinary Medicine (AREA)
- Animal Behavior & Ethology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epidemiology (AREA)
- General Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Public Health (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
FOUP CLEANING DEVICE AND FOUP CLEANING METHOD The present invention is directed to providing a front opening unified pod 5 (FOUP) cleaning device capable of improving cleaning and drying efficiency for a FOUP body and a FOUP cover and a FOUP cleaning method. To this end, the FOUP cleaning device for cleaning a FOUP including a FOUP body and a FOUP cover includes: a loading and unloading part configured to load or unload the FOUP; a standby part which is provided at one side of the loading and unloading part and on 10 which the FOUP body and the FOUP cover are separated from or coupled to each other; a cleaning chamber configured to clean the FOUP body and the FOUP cover using steam; and a robot configured to transport the FOUP body and the FOUP cover between the standby part and the cleaning chamber. The FOUP cleaning method for cleaning a FOUP including a FOUP body and a FOUP cover includes loading the 15 FOUP on a loading and unloading part; transporting the loaded FOUP to a standby part; transporting the FOUP body and the FOUP cover transported to the standby part to a cleaning chamber using a robot; and cleaning the FOUP body and the FOUP cover by supplying steam into the cleaning chamber. 20 (Fig. 1 for publication)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180016586A KR102067752B1 (en) | 2018-02-09 | 2018-02-09 | FOUP cleaning device and FOUP cleaning method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201901084WA true SG10201901084WA (en) | 2019-09-27 |
Family
ID=67541933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201901084WA SG10201901084WA (en) | 2018-02-09 | 2019-02-08 | Foup cleaning device and foup cleaning method |
Country Status (5)
Country | Link |
---|---|
US (1) | US11097320B2 (en) |
KR (1) | KR102067752B1 (en) |
CN (1) | CN110125065A (en) |
SG (1) | SG10201901084WA (en) |
TW (1) | TWI750453B (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11705358B2 (en) * | 2018-10-29 | 2023-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for automated processing ports |
KR102351010B1 (en) * | 2019-10-17 | 2022-01-14 | (주)에스티아이 | FOUP cleaning device |
KR102272005B1 (en) * | 2019-10-17 | 2021-07-02 | (주)에스티아이 | FOUP cleaning device |
CN111097768B (en) * | 2019-12-21 | 2022-04-29 | 江门粤玻实业有限公司 | Repeatedly-used glass bottle cleaning machine |
TWI721729B (en) * | 2019-12-25 | 2021-03-11 | 佳宸科技有限公司 | Wafer transfer box cleaning equipment and system |
KR102262852B1 (en) * | 2020-02-19 | 2021-06-09 | (주)에스티아이 | Buffer part of the FOUP cleaning device and Method for determining whether the FOUP is defective using the same |
US11508596B2 (en) * | 2020-05-28 | 2022-11-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and methods for automatically handling die carriers |
US11813649B2 (en) | 2020-05-29 | 2023-11-14 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement and method for making |
US11315816B2 (en) * | 2020-06-10 | 2022-04-26 | Kla Corporation | Localized purge module for substrate handling |
AU2021212116B1 (en) * | 2020-09-30 | 2021-12-23 | Green Scope Projects Pty Ltd | A system for cleaning grease filters |
DE102020129470A1 (en) * | 2020-11-09 | 2022-05-12 | PACE-Tec GmbH | Device and method for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks |
DE102020129469B4 (en) * | 2020-11-09 | 2024-05-29 | Gsec German Semiconductor Equipment Company Gmbh | Device for cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks |
KR102565731B1 (en) * | 2020-11-16 | 2023-08-17 | (주)에스티아이 | Pod cleaning chamber |
KR102593653B1 (en) * | 2020-11-16 | 2023-10-26 | (주)에스티아이 | Pod cleaning device |
KR102596033B1 (en) * | 2020-11-16 | 2023-11-01 | (주)에스티아이 | Pod cleaning process |
CN113140483A (en) * | 2021-03-03 | 2021-07-20 | 上海璞芯科技有限公司 | Wafer conveying method and wafer conveying platform |
US20230182181A1 (en) * | 2021-03-11 | 2023-06-15 | Pintek Solutions Corporation | System and Method for Cleaning Carrier |
TWI762273B (en) * | 2021-04-16 | 2022-04-21 | 科嶠工業股份有限公司 | Material transfer box cleaning method and equipment |
CN115213184A (en) * | 2021-04-16 | 2022-10-21 | 科峤工业股份有限公司 | Method and equipment for cleaning material conveying box |
TWI762311B (en) * | 2021-05-13 | 2022-04-21 | 科嶠工業股份有限公司 | Method and device for detecting cleaning results of material transfer box |
IT202100029417A1 (en) * | 2021-11-22 | 2023-05-22 | Orma S R L Soc Agricola | MOBILE ROBOT FOR TWO-PHASE, CUSTOMIZED AND SIMULTANEOUS, INTERNAL AND EXTERNAL WASHING OF BEER KEGS AND GLASS BOTTLES |
WO2023213457A1 (en) * | 2022-05-06 | 2023-11-09 | Gsec German Semiconductor Equipment Company Gmbh | Device for cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for euv lithography masks |
CN115020302B (en) * | 2022-07-15 | 2022-10-14 | 江苏芯梦半导体设备有限公司 | Cleaning and drying equipment and cleaning and drying method for wafer storage box |
TWI820947B (en) * | 2022-10-03 | 2023-11-01 | 台銨科技股份有限公司 | Wafer container washing machine |
DE102022130420A1 (en) * | 2022-11-17 | 2024-05-23 | Gsec German Semiconductor Equipment Company Gmbh | Cleaning device, treatment device and method for cleaning or treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for lithography masks |
CN115910869B (en) * | 2022-12-30 | 2024-02-02 | 江苏微导纳米科技股份有限公司 | Loading cavity, cleaning method thereof and semiconductor device |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002017355A2 (en) * | 2000-07-07 | 2002-02-28 | Semitool, Inc. | Semiconductor wafer container cleaning apparatus |
DE602005017250D1 (en) * | 2004-02-05 | 2009-12-03 | Entegris Inc | CLEANING A WAFER STORAGE CONTAINER |
CN102804332B (en) * | 2009-06-17 | 2017-06-09 | 动力微系统公司 | Integrated form cleaner and dryer system |
KR101022014B1 (en) * | 2010-05-18 | 2011-03-16 | (주) 디바이스이엔지 | Cleaner for wafer container |
KR101244900B1 (en) * | 2010-11-25 | 2013-03-18 | 코리아테크노(주) | Purge systems for a wafer container |
KR101330990B1 (en) * | 2011-03-03 | 2013-11-20 | 에이치아이티 주식회사 | Equipment for manufacturing a semiconductor device |
KR101220094B1 (en) * | 2011-05-26 | 2013-01-11 | (주)네오텍 | System for cleaning wafer carrier |
KR101220127B1 (en) * | 2011-05-26 | 2013-01-11 | (주)네오텍 | Apparatus for cleaning wafer carrier |
KR101173987B1 (en) | 2012-01-30 | 2012-08-16 | (주) 디바이스이엔지 | Cleaner for wafer container |
KR101338183B1 (en) | 2012-02-17 | 2013-12-09 | (주) 디바이스이엔지 | Cleaner for wafer container |
KR101265182B1 (en) * | 2012-07-20 | 2013-05-27 | (주) 디바이스이엔지 | Cleaner for wafer container |
JP6025250B2 (en) * | 2012-09-20 | 2016-11-16 | ヒューグルエレクトロニクス株式会社 | Substrate case cleaning device |
US9579697B2 (en) * | 2012-12-06 | 2017-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method of cleaning FOUP |
KR20140084511A (en) * | 2012-12-27 | 2014-07-07 | 조창현 | Nozzle part for cleaning carrier |
KR20140126909A (en) * | 2013-04-24 | 2014-11-03 | (주) 디바이스이엔지 | Apparatus and method for cleaning wafer storage container |
US20160303622A1 (en) * | 2013-10-23 | 2016-10-20 | Brooks Ccs Gmbh | Cleaning Systems and Methods for Semiconductor Substrate Storage Articles |
KR101545242B1 (en) | 2013-12-31 | 2015-08-18 | (주) 이더 | Apparatus for purging FOUP inside using a semiconductor fabricating |
CN104867853A (en) * | 2015-03-30 | 2015-08-26 | 上海华力微电子有限公司 | FOUP structure and FOUP cleaning method |
-
2018
- 2018-02-09 KR KR1020180016586A patent/KR102067752B1/en active IP Right Grant
-
2019
- 2019-02-01 TW TW108104203A patent/TWI750453B/en active
- 2019-02-02 CN CN201910107419.XA patent/CN110125065A/en active Pending
- 2019-02-08 SG SG10201901084WA patent/SG10201901084WA/en unknown
- 2019-02-08 US US16/270,953 patent/US11097320B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20190096766A (en) | 2019-08-20 |
TW201935597A (en) | 2019-09-01 |
CN110125065A (en) | 2019-08-16 |
US20190247900A1 (en) | 2019-08-15 |
KR102067752B1 (en) | 2020-01-17 |
US11097320B2 (en) | 2021-08-24 |
TWI750453B (en) | 2021-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201901084WA (en) | Foup cleaning device and foup cleaning method | |
US20180114710A1 (en) | Equipment front end module and semiconductor manufacturing apparatus including the same | |
WO2018130712A3 (en) | Conveyed goods container having an ejection device and associated suspended conveying device | |
MY177234A (en) | Wafer processing system | |
CN108155117B (en) | Supercritical fluid manufacturing apparatus and substrate processing apparatus | |
JP2005520321A5 (en) | ||
MY170824A (en) | System architecture for vacuum processing | |
TWI673809B (en) | Substrate processing device | |
JP2013143513A5 (en) | ||
EP0935279A3 (en) | Device and method for load locking for semiconductor processing | |
MX2020005441A (en) | Pallet shelfing apparatus. | |
US10403532B2 (en) | Semiconductor apparatus with inner wafer carrier buffer and method | |
WO2013086432A3 (en) | High throughput load lock for solar wafers | |
WO2013067201A3 (en) | System architecture for plasma processing solar wafers | |
JP2011124564A5 (en) | Vacuum processing apparatus and operating method of vacuum processing apparatus | |
MX2019005734A (en) | Conveying device for conveying goods. | |
US10229847B2 (en) | Substrate transfer chamber and container connecting mechanism with lid opening mechanisms | |
CN109716147A (en) | Base board checking device | |
JP2017108050A (en) | Load port device and purification gas introduction method into container in load port device | |
KR102190187B1 (en) | Substrate transport apparatus, substrate processing apparatus, and dew condensation suppression method | |
WO2009011166A1 (en) | Vacuum processing device and vacuum processing method | |
US10438820B2 (en) | Substrate processing apparatus, discharge method, and program | |
TW200834255A (en) | Exposure apparatus and conveyance apparatus | |
SG10201903029VA (en) | Conveying mechanism | |
SG11201908613YA (en) | Wafer accommodation container |