SG10201900958QA - Dicing tape - Google Patents

Dicing tape

Info

Publication number
SG10201900958QA
SG10201900958QA SG10201900958QA SG10201900958QA SG10201900958QA SG 10201900958Q A SG10201900958Q A SG 10201900958QA SG 10201900958Q A SG10201900958Q A SG 10201900958QA SG 10201900958Q A SG10201900958Q A SG 10201900958QA SG 10201900958Q A SG10201900958Q A SG 10201900958QA
Authority
SG
Singapore
Prior art keywords
dicing tape
base material
color portion
image
area
Prior art date
Application number
SG10201900958QA
Other languages
English (en)
Inventor
Kato Yuji
Tanaka Shunpei
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG10201900958QA publication Critical patent/SG10201900958QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG10201900958QA 2018-02-09 2019-02-01 Dicing tape SG10201900958QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018022139 2018-02-09
JP2018218225A JP7141924B2 (ja) 2018-02-09 2018-11-21 ダイシングテープ

Publications (1)

Publication Number Publication Date
SG10201900958QA true SG10201900958QA (en) 2019-09-27

Family

ID=67694440

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900958QA SG10201900958QA (en) 2018-02-09 2019-02-01 Dicing tape

Country Status (4)

Country Link
JP (1) JP7141924B2 (zh)
KR (1) KR102574149B1 (zh)
SG (1) SG10201900958QA (zh)
TW (1) TWI763973B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112521878A (zh) * 2019-09-19 2021-03-19 日东电工株式会社 粘合带

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2694854B2 (ja) * 1988-12-16 1997-12-24 光洋化学 株式会社 粘着テープ
JP2003007646A (ja) 2001-06-18 2003-01-10 Nitto Denko Corp ダイシング用粘着シートおよび切断片の製造方法
JP4251915B2 (ja) 2003-05-26 2009-04-08 株式会社巴川製紙所 粘着シート
JP2005236082A (ja) * 2004-02-20 2005-09-02 Nitto Denko Corp レーザーダイシング用粘着シート及びその製造方法
JP4799205B2 (ja) * 2006-02-16 2011-10-26 日東電工株式会社 活性面貼付ダイシング用粘着テープ又はシートおよび被加工物の切断片のピックアップ方法
WO2008084021A1 (en) 2007-01-11 2008-07-17 Basf Se Process for making polymer nanocomposites
JP5000370B2 (ja) * 2007-04-20 2012-08-15 日東電工株式会社 ウォータージェットレーザダイシング用粘着シート
JP2009064975A (ja) * 2007-09-06 2009-03-26 Nitto Denko Corp ダイシング用粘着シート及びダイシング方法
JP4630377B2 (ja) * 2009-03-11 2011-02-09 古河電気工業株式会社 半導体装置の製造方法
JP5490445B2 (ja) * 2009-06-05 2014-05-14 日東電工株式会社 粘着型光学フィルム、その製造方法および画像表示装置、並びに粘着剤塗布液およびその製造方法
JP2011018804A (ja) 2009-07-09 2011-01-27 Sumitomo Bakelite Co Ltd 半導体用フィルムおよび半導体装置の製造方法
KR20120003815A (ko) * 2010-07-05 2012-01-11 닛토덴코 가부시키가이샤 활성 에너지선 경화형 재박리용 점착제 및 다이싱·다이본딩 필름
JP5656741B2 (ja) 2011-05-27 2015-01-21 日東電工株式会社 ダイシング・ダイボンドフィルムの製造方法
KR101742647B1 (ko) 2011-12-26 2017-06-01 듀폰-미츠이 폴리케미칼 가부시키가이샤 레이저 다이싱용 필름 기재, 레이저 다이싱용 필름 및 전자부품의 제조방법
JP6261115B2 (ja) * 2013-09-19 2018-01-17 日東電工株式会社 粘着シート
JP6299315B2 (ja) 2014-03-20 2018-03-28 日立化成株式会社 ウエハ加工用テープ
JP5978246B2 (ja) * 2014-05-13 2016-08-24 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
JP6549902B2 (ja) * 2015-05-27 2019-07-24 日東電工株式会社 ダイシングダイボンドフィルム、半導体装置の製造方法および半導体装置

Also Published As

Publication number Publication date
TW201936832A (zh) 2019-09-16
JP7141924B2 (ja) 2022-09-26
KR102574149B1 (ko) 2023-09-05
TWI763973B (zh) 2022-05-11
KR20190096812A (ko) 2019-08-20
JP2019140378A (ja) 2019-08-22

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