SG10201900958QA - Dicing tape - Google Patents

Dicing tape

Info

Publication number
SG10201900958QA
SG10201900958QA SG10201900958QA SG10201900958QA SG10201900958QA SG 10201900958Q A SG10201900958Q A SG 10201900958QA SG 10201900958Q A SG10201900958Q A SG 10201900958QA SG 10201900958Q A SG10201900958Q A SG 10201900958QA SG 10201900958Q A SG10201900958Q A SG 10201900958QA
Authority
SG
Singapore
Prior art keywords
dicing tape
base material
color portion
image
area
Prior art date
Application number
SG10201900958QA
Inventor
Kato Yuji
Tanaka Shunpei
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG10201900958QA publication Critical patent/SG10201900958QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

OF THE DISCLOSURE Provided is a dicing tape that may be used in stealth dicing, the dicing tape being free from inhibiting the detection of a position to be irradiated with laser light with a camera and the formation of a satisfactory modified layer. The dicing tape includes: a base material; and a pressure-sensitive adhesive layer arranged on one side of the base material, wherein, when an image having brightness of gray scale levels, which is obtained through observation from a base material side of the dicing tape with a laser microscope, is binarized into a white color portion and a black color portion through use of 55% of maximum brightness as a threshold, a ratio of an area of the white color portion to an area of the image is 80% or more. FIG.1
SG10201900958QA 2018-02-09 2019-02-01 Dicing tape SG10201900958QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018022139 2018-02-09
JP2018218225A JP7141924B2 (en) 2018-02-09 2018-11-21 dicing tape

Publications (1)

Publication Number Publication Date
SG10201900958QA true SG10201900958QA (en) 2019-09-27

Family

ID=67694440

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900958QA SG10201900958QA (en) 2018-02-09 2019-02-01 Dicing tape

Country Status (4)

Country Link
JP (1) JP7141924B2 (en)
KR (1) KR102574149B1 (en)
SG (1) SG10201900958QA (en)
TW (1) TWI763973B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112521878A (en) * 2019-09-19 2021-03-19 日东电工株式会社 Adhesive tape

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2694854B2 (en) * 1988-12-16 1997-12-24 光洋化学 株式会社 Adhesive tape
JP2003007646A (en) 2001-06-18 2003-01-10 Nitto Denko Corp Adhesive sheet for dicing and method of manufacturing cut chip
JP4251915B2 (en) 2003-05-26 2009-04-08 株式会社巴川製紙所 Adhesive sheet
JP2005236082A (en) * 2004-02-20 2005-09-02 Nitto Denko Corp Pressure sensitive adhesive sheet for laser dicing, and its manufacturing method
JP4799205B2 (en) * 2006-02-16 2011-10-26 日東電工株式会社 Active surface-attached dicing adhesive tape or sheet and method of picking up a workpiece cut piece
WO2008084021A1 (en) 2007-01-11 2008-07-17 Basf Se Process for making polymer nanocomposites
JP5000370B2 (en) * 2007-04-20 2012-08-15 日東電工株式会社 Adhesive sheet for water jet laser dicing
JP2009064975A (en) * 2007-09-06 2009-03-26 Nitto Denko Corp Dicing adhesive sheet and dicing method
JP4630377B2 (en) * 2009-03-11 2011-02-09 古河電気工業株式会社 Manufacturing method of semiconductor device
JP5490445B2 (en) * 2009-06-05 2014-05-14 日東電工株式会社 Adhesive optical film, production method and image display device thereof, and adhesive coating liquid and production method thereof
JP2011018804A (en) 2009-07-09 2011-01-27 Sumitomo Bakelite Co Ltd Film for semiconductor, and method of manufacturing semiconductor device
KR20120003815A (en) * 2010-07-05 2012-01-11 닛토덴코 가부시키가이샤 Active energy ray-curable pressure-sensitive adhesive for re-release and dicing die-bonding film
JP5656741B2 (en) 2011-05-27 2015-01-21 日東電工株式会社 Manufacturing method of dicing die-bonding film
KR101742647B1 (en) 2011-12-26 2017-06-01 듀폰-미츠이 폴리케미칼 가부시키가이샤 Substrate for stealth dicing film, film for stealth dicing, and method for manufacturing electronic component
JP6261115B2 (en) * 2013-09-19 2018-01-17 日東電工株式会社 Adhesive sheet
JP6299315B2 (en) 2014-03-20 2018-03-28 日立化成株式会社 Wafer processing tape
JP5978246B2 (en) * 2014-05-13 2016-08-24 日東電工株式会社 Dicing tape-integrated film for semiconductor back surface and method for manufacturing semiconductor device
JP6549902B2 (en) * 2015-05-27 2019-07-24 日東電工株式会社 Dicing die bond film, method of manufacturing semiconductor device and semiconductor device

Also Published As

Publication number Publication date
TW201936832A (en) 2019-09-16
JP7141924B2 (en) 2022-09-26
KR102574149B1 (en) 2023-09-05
TWI763973B (en) 2022-05-11
KR20190096812A (en) 2019-08-20
JP2019140378A (en) 2019-08-22

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