JP7141924B2 - dicing tape - Google Patents

Description

The present invention relates to a dicing tape. More particularly, the present invention relates to a dicing tape that is preferably used when performing stealth dicing through the dicing tape.

A work (for example, a semiconductor wafer) that is an assembly of electronic components is manufactured with a large diameter, and after forming a pattern on the surface, the back surface is usually ground so that the thickness of the wafer is about 100 to 600 μm. It is cut and separated (diced) into element pieces, and further transferred to the mounting process. In this dicing process, the work is cut into small pieces. In order to fix the workpiece after dicing, dicing is usually performed after bonding an adhesive tape (dicing tape) to the workpiece (for example, Patent Document 1). As one of the dicing methods, a method of dicing a workpiece with a laser beam is known. As such a dicing method, a method of condensing a laser beam on the surface of a workpiece to form grooves on the surface of the workpiece and then cutting the workpiece is frequently used. On the other hand, in recent years, stealth dicing has also been proposed in which a laser beam is focused inside a work, and the work is cut after reforming the work at that location.

As described above, in dicing by laser light, when the laser light is irradiated from the dicing tape side, the dicing tape is required to have a property that allows the laser light irradiation position to be detected satisfactorily by a camera. In particular, when dicing a semiconductor wafer in stealth dicing, it is required to recognize the surface pattern of the semiconductor wafer for determining the laser light irradiation position and to detect the position in the height direction of the semiconductor wafer for laser light focus adjustment with high accuracy. In addition, it is required to form a modified layer satisfactorily, and the dicing tape is required to have properties that do not hinder the achievement of these requirements.

JP 2003-007646 A

An object of the present invention is to provide a dicing tape that can be used for stealth dicing and that does not hinder the detection of the laser light irradiation position by a camera during dicing and the formation of a good modified layer.

The dicing tape of the present invention comprises a substrate and an adhesive layer disposed on one side of the substrate, and a grayscale image of 256 brightness levels obtained by observation with a laser microscope from the substrate side can be displayed at a maximum of When the white portion and the black portion are binarized using 55% of the brightness as a threshold, the area of the white portion is 80% or more of the image area.
In one embodiment, the wettability of one surface of the substrate is 40 mN/m or less.
In one embodiment, the substrate is arranged such that the surface having a wettability of 40 mN/m or less is the surface opposite to the pressure-sensitive adhesive layer.
In one embodiment, the base material contains a polyethylene-based resin.
In one embodiment, at least one side of the substrate is a corona treated side.
In one embodiment, the pressure-sensitive adhesive layer has a tensile modulus at 22° C. of 0.05 MPa to 1 MPa.
In one embodiment, the pressure-sensitive adhesive layer has a two-layer structure, and the dicing tape includes the base material, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer in this order.
In one embodiment, the first pressure-sensitive adhesive layer has a tensile modulus at 22° C. of 0.05 MPa to 1 MPa.
In one embodiment, the second pressure-sensitive adhesive layer has a tensile modulus at 22° C. of 0.1 MPa to 2 MPa.
In one embodiment, the thickness of the first adhesive layer is 5 μm to 468 μm.

According to the present invention, it is possible to provide a dicing tape that can be used for stealth dicing and that does not hinder the detection of the laser light irradiation position by a camera and the formation of a good modified layer.

1 is a schematic cross-sectional view of a dicing tape according to one embodiment of the invention; FIG.

A. Overview of Dicing Tape FIG. 1 is a schematic cross-sectional view of a dicing tape according to one embodiment of the present invention. A dicing tape 100 according to this embodiment comprises a substrate 10 and an adhesive layer 20 arranged on one side of the substrate 10 . Although not shown, the dicing tape of the present invention may be provided with a release liner on the outside of the pressure-sensitive adhesive layer for the purpose of protecting the pressure-sensitive adhesive surface until it is used. In addition, the dicing tape may further contain any appropriate other layers as long as the effects of the present invention are obtained. Preferably, the adhesive layer is placed directly on the substrate.

In another embodiment, the pressure-sensitive adhesive layer has a two-layer structure, and the dicing tape comprises a substrate, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer in this order.

A grayscale image with a brightness of 256 gradations obtained by observing with a laser microscope from the base side of the dicing tape is divided into white portions (high brightness portions) and black portions (low brightness portions) with a threshold of 55% of the maximum brightness. When quantified, the area of the white portion is 80% or more of the image area. Here, the binarization with a threshold value of 55% of the maximum luminance divides the gradation from the low luminance side of the luminance 256 gradations to the 140 gradation boundary, making the low luminance side black and the high luminance side white. It is a process to be a part. The binarization process can be performed using, for example, image analysis software Image J (manufactured by Wayne Rasband). By using the dicing tape of the present invention configured as described above, in the stealth dicing process, camera detection via the dicing tape, that is, surface pattern recognition of the semiconductor wafer by a camera (eg, IR camera, SD camera) , position detection in the height direction of the semiconductor wafer, etc. can be performed with high accuracy. Further, by using the dicing tape of the present invention configured as described above, even when laser light is irradiated through the dicing tape in the stealth dicing process, the laser light can be well focused. As a result, a modified layer can be satisfactorily formed inside the semiconductor wafer. More specifically, it is possible to prevent defective portions such as gaps and meandering from being formed in the modified layer.

The area of the white portion is preferably 83% or more, more preferably 85% or more, and still more preferably 90% or more of the image area. Within such a range, the above effects are more pronounced. The larger the area of the white portion, the better, but the upper limit is, for example, 99.5% (preferably 99.8%, more preferably 100%).

The initial adhesive force at 23° C. when the dicing tape of the present invention is attached to a stainless steel plate is preferably 0.2 N/20 mm to 8 N/20 mm, more preferably 0.5 N/20 mm to 5 N/20 mm. . Adhesion is measured according to JIS Z 0237:2000. Specifically, the dicing tape was attached to a stainless steel plate (arithmetic mean surface roughness Ra: 50 ± 25 nm) by reciprocating a 2 kg roller once, left at 23 ° C. for 30 minutes, and then peeled at a peel angle of 180 °. It is measured by peeling off the dicing tape at a speed (pulling speed) of 300 mm/min. As described later, the pressure-sensitive adhesive layer may change its adhesive strength due to irradiation with active energy rays, but in this specification, the "initial adhesive strength" means the adhesive strength before irradiation with active energy rays.

In one embodiment, the adhesive strength at 23° C. after the dicing tape is attached to a silicon mirror wafer and irradiated with 460 mJ/cm ² ultraviolet rays is preferably 0.01 N/20 mm to 0.3 N/20 mm. and more preferably 0.02 N/20 mm to 0.2 N/20 mm. Within this range, a dicing tape can be obtained in which the adhesive strength is reduced by UV irradiation after dicing, making it easy to pick up small pieces of workpieces (eg, semiconductor chips). The above ultraviolet irradiation is performed, for example, by using an ultraviolet irradiation device (manufactured by Nitto Seiki Co., Ltd., trade name “UM-810”) and applying ultraviolet rays from a high-pressure mercury lamp (characteristic wavelength: 365 nm, integrated light amount: 460 mJ/cm ² , irradiation energy: 70 W. /cm ² , irradiation time: 6.6 seconds).

The thickness of the dicing tape is preferably 35 μm to 500 μm, more preferably 60 μm to 300 μm, still more preferably 80 μm to 200 μm.

The total light transmittance of the dicing tape is preferably 70% or more, more preferably 80% or more, even more preferably 90% or more, and particularly preferably 95% or more. Within such a range, it is possible to obtain a dicing tape that allows good camera detection through the dicing tape and that hardly hinders the transmission and collection of laser light. The upper limit of the total light transmittance of the dicing tape is, for example, 98% (preferably 99%).

In the dicing tape, the transmittance of light having a wavelength of 1064 nm is preferably 70% or more, more preferably 80% or more, even more preferably 90% or more, and particularly preferably 95% or more. Within such a range, it is possible to obtain a dicing tape that hardly inhibits the transmission and collection of laser light. The upper limit of the transmittance of light with a wavelength of 1064 nm of the dicing tape is, for example, 98% (preferably 99%).

The haze value of the dicing tape is preferably 20% or less, more preferably 10% or less, still more preferably 5% or less. Within such a range, it is possible to obtain a dicing tape that allows good camera detection through the dicing tape and that hardly hinders the transmission and collection of laser light. The lower limit of the haze value of the dicing tape is, for example, 1%.

B. Substrate The substrate may be composed of any suitable resin. Examples of the resin include polyolefin-based resins such as polyethylene-based resins, polypropylene-based resins, polybutene-based resins, and polymethylpentene-based resins, polyurethane-based resins, polyester-based resins, polyimide-based resins, polyetherketone-based resins, and polystyrene-based resins. Resins, polyvinyl chloride resins, polyvinylidene chloride resins, fluorine resins, silicone resins, cellulose resins, ionomer resins, and the like can be mentioned. Among them, polyolefin resins are preferred.

In one embodiment, the substrate contains a polyethylene-based resin. A dicing tape having a large white area of the binary image can be obtained by using a base material containing a polyethylene resin. Examples of polyethylene-based resins include low-density polyethylene, linear polyethylene, medium-density polyethylene, high-density polyethylene, and ultra-low-density polyethylene.

The content of ethylene-derived structural units in the polyethylene resin is preferably 80 mol % or more, more preferably 90 mol % or more, and still more preferably 95 mol % or more. Structural units other than ethylene-derived structural units include structural units derived from monomers copolymerizable with ethylene and copolymers, such as propylene, 1-butene, isobutene, 1-pentene, 2-methyl -1-butene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 4-methyl-1-pentene, 1-heptene, 1-octene, 1-decene, 1-dodecene, 1 -tetradecene, 1-hexadecene, 1-octadecene, 1-icosene and the like.

The content of the polyethylene resin is preferably 80 parts by weight or more, more preferably 85 parts by weight to 100 parts by weight, and more preferably 95 parts by weight to 100 parts by weight, based on 100 parts by weight of the substrate.

The substrate may further contain any suitable additive. Examples of additives include lubricants, antioxidants, ultraviolet absorbers, processing aids, fillers, antistatic agents, stabilizers, antibacterial agents, flame retardants, colorants and the like.

In one embodiment, the substrate contains a lubricant. By containing a lubricant, it is possible to prevent blocking when the dicing tape is rolled. As a result, a dicing tape having a large white area in the binarized image can be obtained. Examples of lubricants include fatty acid amide-based lubricants, silicone-based lubricants, fluorine-based lubricants, long-chain alkyl-based lubricants, and the like. Of these, fatty acid amide-based lubricants are preferred because they have little risk of contamination with impurities and are highly effective as lubricants. The content of the lubricant is preferably 0.1 to 30 parts by weight, more preferably 0.5 to 15 parts by weight, and still more preferably 0.8 parts by weight with respect to 100 parts by weight of the base material. 1 to 10 parts by weight, particularly preferably 1 to 5 parts by weight.

In one embodiment, the wettability of one surface of the substrate is 40 mN/m or less. In one embodiment, the substrate is arranged such that the surface having a wettability of 40 mN/m or less is the surface opposite to the pressure-sensitive adhesive layer. By disposing the substrate so that the surface having wettability is the surface opposite to the pressure-sensitive adhesive layer, blocking can be prevented when the dicing tape is rolled. As a result, a dicing tape having a large white area in the binarized image can be obtained. The wettability of one surface of the substrate is preferably 39 mN/m or less, more preferably 38 mN/m or less, and still more preferably 30 mN/m to 38 mN/m. The wettability of the base material can be adjusted by the type of the base material; presence/absence, type, and amount of additives added to the base material; presence/absence, type, and conditions of surface treatment on the wettability-adjusting surface. In one embodiment, by using a polyolefin-based resin (preferably polyethylene-based resin) as a base material and not performing a surface treatment such as corona treatment, a base material having wettability in the above range can be obtained. The wettability can be measured according to JIS K6768.

In one embodiment, at least one surface of the substrate is corona-treated. Preferably, only one side of the substrate is subjected to corona treatment, and the corona-treated side is the side facing the pressure-sensitive adhesive layer. The adhesion between the adhesive layer and the substrate can be improved by subjecting the adhesive layer side surface to corona treatment. In another embodiment, both sides of the substrate are not corona treated. By making the surface of the base material opposite to the pressure-sensitive adhesive layer a corona-untreated surface, it is possible to prevent blocking when the dicing tape is rolled. As a result, the dicing tape is less likely to be damaged when the roll-shaped dicing tape is unwound, and a dicing tape with a large white area of the binary image can be obtained. Corona treatment can be performed, for example, under conditions of speed: 20 m/min, discharge power: 0.7 kw, and discharge electrode length: 1550 mm.

In one embodiment, one surface of the substrate is embossed. Preferably, only one side of the base material is embossed, and the embossed side is the pressure-sensitive adhesive layer side. By embossing the adhesive layer side surface, the adhesiveness between the adhesive layer and the substrate can be improved. Preferably, the surface of the substrate opposite to the pressure-sensitive adhesive layer is not embossed. A dicing tape having a large white area of the binary image can be obtained by smoothing the surface of the substrate opposite to the pressure-sensitive adhesive layer without embossing. The arithmetic mean surface roughness Ra (JIS B 0601) of the non-embossed surface of the substrate is preferably less than 1.0 μm, more preferably 0.8 μm or less, still more preferably 0.5 μm or less, Especially preferred is 0.01 μm to 1 μm. The arithmetic mean surface roughness Ra (JIS B 0601) of the embossed surface of the substrate is preferably 1.0 μm to 3 μm, more preferably 1.4 μm to 2 μm. If the arithmetic mean surface roughness Ra of the embossed surface of the base material exceeds 3 μm, gaps are likely to form between the pressure-sensitive adhesive layer and the base material, which may increase the white area of the binarized image. Also, if the Ra is less than 1 μm, blocking may occur during storage of the substrate.

The thickness of the substrate is preferably 30 μm to 300 μm, more preferably 53 μm to 200 μm, still more preferably 70 μm to 160 μm.

The total light transmittance of the substrate is preferably 70% or higher, more preferably 80% or higher, even more preferably 90% or higher, and particularly preferably 95% or higher. The upper limit of the total light transmittance of the substrate is, for example, 98% (preferably 99%).

The tensile modulus of elasticity at 22° C. of the substrate is preferably 50 MPa to 120 MPa, more preferably 70 MPa to 90 MPa. Within such a range, a dicing tape with excellent expandability can be obtained. The tensile modulus of elasticity of the substrate is measured using a tensile tester (manufactured by SHIMADZU, "AG-IS") under the conditions of distance between chucks: 50 mm, tensile speed: 300 mm/min, and substrate width: 10 mm. .

C. Adhesive layer C-1. Adhesive Layer Constructed of Single Layer In one embodiment, the adhesive layer is composed of a single layer. The adhesive layer can be composed of any appropriate adhesive. Examples of adhesives include acrylic adhesives, rubber adhesives, silicone adhesives, polyvinyl ether adhesives, and the like.

In one embodiment, the adhesive layer is composed of an active energy ray-curable adhesive. If the adhesive layer is composed of an active energy ray-curable adhesive, the adhesive strength is reduced by the irradiation of the active energy ray (typically, ultraviolet rays) after dicing, and the workpiece (for example, semiconductor chip) is broken into small pieces. A dicing tape that can be easily picked up can be obtained.

The active energy ray-curable adhesive may contain a base polymer exhibiting adhesiveness. Monomers constituting the base polymer include, for example, hydrophilic monomers. Any suitable monomer having a polar group can be used as the hydrophilic monomer. Specifically, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; acid anhydride monomers such as maleic anhydride and isotanoic anhydride ; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate , 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl) hydroxyl group-containing monomers such as methyl methacrylate; styrenesulfonic acid, allylsulfonic acid, 2-(meth) Sulfonic acid group-containing monomers such as acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloyloxynaphthalenesulfonic acid; phosphoric acid such as 2-hydroxyethyl acryloyl phosphate Group-containing monomer; (N -Substituted) amide-based monomers; (meth)aminoalkyl acrylate-based monomers such as aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; Alkoxyalkyl (meth)acrylate monomers such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate; maleimide monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide and N-phenylmaleimide Monomer; Itaconimide-based monomers such as N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexylitaconimide, N-cyclohexylitaconimide, N-laurylitaconimide ; N-(meth)acryloyloxymethylenesuccinimide, N-(meth)acryloyl-6-oxyhexamethylenesuccinimide, N-(meth)acryloyl-8-oxyoctamethylenesuccinimide succinimide-based monomers such as vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholine, N- vinyl monomers such as vinylcarboxylic acid amides, styrene, α-methylstyrene, and N-vinylcaprolactam; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing acrylic monomers such as glycidyl (meth)acrylate; Glycol-based acrylic ester monomers such as polyethylene glycol meth)acrylate, polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate, and methoxypolypropylene glycol (meth)acrylate; tetrahydrofurfuryl (meth)acrylate, fluorine Heterocycles such as (meth)acrylates and silicon (meth)acrylates, halogen atoms, acrylic acid ester monomers having silicon atoms, etc.; hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, ) propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth) Polyfunctional monomers such as acrylates, epoxy acrylates, polyester acrylates and urethane acrylates can be mentioned. Hydroxyl group-containing monomers and/or (N-substituted) amide monomers can be suitably used as hydrophilic monomers. Only one type of hydrophilic monomer may be used, or two or more types may be used in combination.

You may combine the said hydrophilic monomer and hydrophobic monomer. As the hydrophobic monomer, any appropriate monomer can be used as long as it is a monomer having hydrophobic properties. Specifically, vinyl alkyl or aryl ether having an alkyl group having 9 to 30 carbon atoms such as vinyl 2-ethylhexanoate, vinyl laurate, vinyl stearate, stearyl vinyl ether; hexyl (meth)acrylate, (meth)acrylate heptyl acrylate, octyl (meth)acrylate, isooctyl acrylate, isononyl acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, dodecyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, ( benzyl meth)acrylate, lauryl (meth)acrylate, oleyl (meth)acrylate, palmityl (meth)acrylate, and stearyl (meth)acrylate (meth)acrylic acid having 6 to 30 carbon atoms; fatty acid and unsaturated vinyl esters of (meth) acrylic acid derived from fatty alcohols; monomers derived from cholesterol; 1-butene, 2-butene, 1-pentene, 1-hexene, 1-octene, isobutylene, isoprene, etc. Olefin monomers are mentioned. Only one type of hydrophobic monomer may be used, or two or more types may be used in combination. The hydrophobic monomer used in the present invention refers to a monomer having a solubility of 0.02 g or less in 100 g of water.

The base polymer may further contain monomer components other than the hydrophilic monomer and the hydrophobic monomer. Other monomer components include alkyl acrylates such as butyl acrylate and ethyl acrylate. Other monomer components may be used alone or in combination of two or more.

The base polymer may further contain a structural unit derived from an isocyanate compound having a curable functional group in the molecule. A base polymer containing a structural unit derived from an isocyanate compound can be obtained, for example, by reacting a substituent (e.g., OH group) of the structural unit derived from the hydrophilic monomer with an NCO group of the isocyanate compound. Examples of the isocyanate compound include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate and the like.

The weight average molecular weight of the base polymer constituting the pressure-sensitive adhesive is preferably 300,000 to 2,000,000, more preferably 500,000 to 1,500,000. A weight average molecular weight can be measured by GPC (solvent: THF).

The active energy ray-curable pressure-sensitive adhesive may contain a photopolymerization initiator.

Any appropriate initiator can be used as the photopolymerization initiator. Examples of photopolymerization initiators include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl-2-hydroxypropio α-ketol compounds such as phenone and 1-hydroxycyclohexylphenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio) Acetophenone compounds such as -phenyl]-2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether; ketal compounds such as benzyl dimethyl ketal; 2-naphthalenesulfonyl chloride, etc. aromatic sulfonyl chloride compounds; 1-phenone-1,1-propanedione-2-(o-ethoxycarbonyl) oxime and other photoactive oxime compounds; benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4 -benzophenone compounds such as methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4 thioxanthone-based compounds such as diethylthioxanthone and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketones; The amount of photopolymerization initiator used can be set to any appropriate amount.

A commercially available product may be used as the photopolymerization initiator. For example, trade names such as "Irgacure 651", "Irgacure 184", "Irgacure 369", "Irgacure 819" and "Irgacure 2959" manufactured by BASF are listed.

Preferably, the active energy ray-curable pressure-sensitive adhesive contains a cross-linking agent. Examples of cross-linking agents include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, Examples include metal chelate cross-linking agents, metal salt cross-linking agents, carbodiimide cross-linking agents, amine cross-linking agents and the like.

When the pressure-sensitive adhesive layer has a single-layer structure, the content of the cross-linking agent is preferably 0.5 to 10 parts by weight, more preferably 1 part by weight, with respect to 100 parts by weight of the base polymer of the pressure-sensitive adhesive. ~8 parts by weight. Within such a range, a pressure-sensitive adhesive layer having an appropriately adjusted elastic modulus can be formed.

In one embodiment, an isocyanate-based cross-linking agent is preferably used. An isocyanate-based cross-linking agent is preferable because it can react with various functional groups. Specific examples of the isocyanate-based cross-linking agents include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; aromatic isocyanates such as tolylene diisocyanate, 4,4′-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylolpropane/tolylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name “Coronate L”), tri Methylolpropane/hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL"), hexamethylene diisocyanate isocyanurate (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HX"), etc. isocyanate adduct; and the like. Preferably, a cross-linking agent having 3 or more isocyanate groups is used.

The active energy ray-curable pressure-sensitive adhesive may further contain any appropriate additive as necessary. Additives include, for example, active energy ray polymerization accelerators, radical scavengers, tackifiers, plasticizers (e.g., trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, etc.), pigments, dyes, and fillers. agents, anti-aging agents, conductive agents, antistatic agents, ultraviolet absorbers, light stabilizers, release modifiers, softeners, surfactants, flame retardants, antioxidants, and the like.

When the adhesive layer has a single-layer structure, the tensile modulus of the adhesive layer at 22° C. is preferably 0.05 MPa to 1 MPa, more preferably 0.1 MPa to 0.8 MPa, and still more preferably 0. 0.15 MPa to 0.6 MPa. Within such a range, a pressure-sensitive adhesive layer having sufficient strength can be formed, and the pressure-sensitive adhesive layer and the substrate are well adhered to each other, and voids are generated in the vicinity of the interface between the substrate and the pressure-sensitive adhesive layer. can be suppressed. As a result, a dicing tape having a large white area in the binarized image can be obtained. In particular, when using a base material having an embossed surface on the pressure-sensitive adhesive layer side, voids are likely to occur normally. can be suppressed. In other words, if the tensile modulus exceeds 1 MPa, the adhesive layer may not conform to the irregularities of the substrate when the adhesive layer is laminated on the embossed surface of the substrate. Also, if the tensile modulus is less than 0.5 MPa, the pressure-sensitive adhesive layer may not maintain a fixed shape and may not have sufficient properties. As described above, when the pressure-sensitive adhesive layer is composed of an active energy ray-curable pressure-sensitive adhesive, it is preferable that the tensile modulus at 22° C. before irradiation with the active energy ray is within the above range. A method for measuring the tensile modulus of the pressure-sensitive adhesive layer will be described later.

In one embodiment, when the pressure-sensitive adhesive layer has a single-layer structure, the tensile elastic modulus of the pressure-sensitive adhesive layer at 22° C. after irradiation with ultraviolet rays (460 mJ/cm ² ) is preferably 50 MPa to 3000 MPa, more preferably. is 100 MPa to 1500 MPa, more preferably 200 MPa to 1000 MPa. Within such a range, a dicing tape with excellent pick-up properties can be obtained.

When the pressure-sensitive adhesive layer has a single layer structure, the thickness of the pressure-sensitive adhesive layer is preferably 5 μm to 470 μm, more preferably 7 μm to 247 μm, still more preferably 10 μm to 130 μm. Within such a range, when the pressure-sensitive adhesive layer is formed on the embossed surface, the pressure-sensitive adhesive layer satisfactorily fills the embossments, and the generation of unnecessary voids can be prevented. As a result, a dicing tape having a large white area in the binarized image can be obtained.

The total light transmittance of the adhesive layer is preferably 70% or higher, more preferably 80% or higher, still more preferably 90% or higher, and particularly preferably 95% or higher. The upper limit of the total light transmittance of the adhesive layer is, for example, 98% (preferably 99%).

The haze value of the adhesive layer is preferably 20% or less, more preferably 10% or less, still more preferably 5% or less. The lower limit of the haze value of the adhesive layer is, for example, 1%.

C-2. Adhesive Layer Constructed of Two Layers In one embodiment, the adhesive layer is composed of two layers. Hereinafter, for the sake of convenience, the pressure-sensitive adhesive layer on the substrate side is referred to as the first pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer on the side opposite to the substrate is referred to as the second pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer can be distinguished by a difference in tensile elastic modulus. The first adhesive layer preferably has lower elasticity than the second adhesive layer. By placing the first pressure-sensitive adhesive layer with low elasticity on the side of the substrate, the pressure-sensitive adhesive layer and the substrate are well adhered to suppress the generation of voids in the vicinity of the interface between the substrate and the pressure-sensitive adhesive layer. can be done. As a result, a dicing tape having a large white area in the binarized image can be obtained. Moreover, by providing the highly elastic second pressure-sensitive adhesive layer, it is possible to obtain a dicing tape that can contribute to highly accurate dicing.

The tensile elastic modulus of the first pressure-sensitive adhesive layer at 22° C. is preferably 0.05 MPa to 1 MPa, more preferably 0.06 MPa to 0.8 MPa, and still more preferably 0.07 MPa to 0.5 MPa. . Within such a range, the pressure-sensitive adhesive layer and the substrate adhere well, and the generation of voids in the vicinity of the interface between the substrate and the pressure-sensitive adhesive layer can be significantly suppressed. As a result, a dicing tape having a large white area in the binarized image can be obtained. In particular, when using a base material having an embossed surface on the pressure-sensitive adhesive layer side, voids are likely to occur normally. can be suppressed. In addition, when the first pressure-sensitive adhesive layer is composed of an active energy ray-curable pressure-sensitive adhesive, it is preferable that the tensile elastic modulus at 22° C. before the irradiation of the active energy ray is within the above range.

In one embodiment, the tensile elastic modulus of the first pressure-sensitive adhesive layer at 22° C. after irradiation with ultraviolet rays (460 mJ/cm ² ) is preferably 50 MPa to 300 MPa, more preferably 100 MPa to 1500 MPa, and further It is preferably 200 MPa to 1000 MPa. Within such a range, a dicing tape with excellent pick-up properties can be obtained.

The tensile elastic modulus of the second pressure-sensitive adhesive layer at 22° C. is preferably 0.1 MPa to 2 MPa, more preferably 0.15 MPa to 1.5 MPa, still more preferably 0.2 MPa to 1 MPa. Within such a range, it is possible to obtain a dicing tape that has appropriate rigidity as a whole pressure-sensitive adhesive layer and that can contribute to highly accurate dicing. In addition, when the second pressure-sensitive adhesive layer is composed of an active energy ray-curable pressure-sensitive adhesive, it is preferable that the tensile elastic modulus at 22° C. before the irradiation of the active energy ray is within the above range.

The thickness of the first adhesive layer is preferably 5 μm to 468 μm, more preferably 7 μm to 244 μm. If the thickness of the first pressure-sensitive adhesive layer is 5 μm or more, when the first pressure-sensitive adhesive layer is formed on the embossed surface, the first pressure-sensitive adhesive layer satisfactorily fills the embossments, creating unnecessary voids. can be prevented. As a result, a dicing tape having a large white area in the binarized image can be obtained. Moreover, if the first pressure-sensitive adhesive layer has a thickness of 468 μm or less, a dicing tape can be obtained that makes it easy to pick up small pieces of a work (for example, a semiconductor chip).

The thickness of the second adhesive layer is preferably 2 μm to 465 μm, more preferably 3 μm to 240 μm.

When the pressure-sensitive adhesive layer has a two-layer structure, the total thickness of the pressure-sensitive adhesive layer is preferably 7 μm to 470 μm, more preferably 10 μm to 247 μm, still more preferably 15 μm to 130 μm.

When the pressure-sensitive adhesive layer has a two-layer structure, the total light transmittance of the pressure-sensitive adhesive layer is preferably 70% or more, more preferably 80% or more, still more preferably 90% or more, and particularly preferably 95% or more. The upper limit of the total light transmittance of the adhesive layer is, for example, 98% (preferably 99%).

When the pressure-sensitive adhesive layer has a two-layer structure, the haze value of the pressure-sensitive adhesive layer is preferably 20% or less, more preferably 10% or less, and even more preferably 5% or less. The lower limit of the haze value of the adhesive layer is, for example, 1%.

As the adhesive constituting the first adhesive layer and the second adhesive layer, the adhesive described in the above section C-1 can be used. Preferably, an active energy ray-curable adhesive is used.

The cross-linking agent content of the active energy ray-curable adhesive constituting the first adhesive layer is preferably 0.005 parts by weight to 5 parts by weight with respect to 100 parts by weight of the base polymer of the adhesive, and more It is preferably 0.02 to 3 parts by weight. Within such a range, the elastic modulus is appropriately adjusted, the embossed surface of the base material is satisfactorily filled, and a pressure-sensitive adhesive layer capable of maintaining a regular shape can be formed.

The content of the cross-linking agent in the active energy ray-curable pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer is preferably 1 to 20 parts by weight, more preferably 100 parts by weight of the base polymer of the pressure-sensitive adhesive. 2 to 10 parts by weight. Within such a range, it is possible to form a pressure-sensitive adhesive layer in which the elastic modulus and adhesive strength (adhesive strength that enables both wafer holding during dicing and chip pick-up after dicing) are appropriately adjusted. .

D. Manufacturing method of dicing tape The dicing tape can be manufactured by any appropriate method. A dicing tape can be obtained, for example, by applying the pressure-sensitive adhesive onto a substrate. Coating methods include bar coater coating, air knife coating, gravure coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexographic printing, screen printing, etc. Various methods can be employed. Alternatively, a method of forming a pressure-sensitive adhesive layer on a release liner and then attaching it to a base material may be adopted.

EXAMPLES The present invention will be specifically described below with reference to Examples, but the present invention is not limited to these Examples. Tests and evaluation methods in Examples are as follows. Also, "parts" and "%" are by weight unless otherwise specified.

(1) Elastic Modulus of Adhesive Layer The adhesive prepared in Examples and Comparative Examples is applied between a pair of PET separators to form an adhesive layer (20 μm thick), and the adhesive layer is dried. It was aged for 48 hours in an environment of 50°C in the vessel. After that, the pressure-sensitive adhesive layer was cut into a size of 50 mm×30 mm, the separator was peeled off, and the sheet was rolled without air bubbles to prepare a rod-shaped sample with a length of 30 mm and a diameter of 1.13 mm.
The tensile modulus of elasticity of the rod-shaped sample was measured using a tensile tester (manufactured by ORIENTEC, trade name "RTC-1150A"), and the SS curve was measured under the conditions of a measurement temperature of 22 ° C., a distance between chucks of 10 mm, and a speed of 10 mm / min. did. The initial elastic modulus was determined from the rise of the SS curve, and this was taken as the tensile elastic modulus of the pressure-sensitive adhesive layer.

(2) Wettability of Substrate The wettability of both surfaces of the substrate was measured according to JIS K6768.

(3) Arithmetic mean surface roughness Ra of substrate
The arithmetic mean surface roughness (line roughness) Ra of the surface of the substrate opposite to the pressure-sensitive adhesive layer was measured according to JIS B 0601-2001 using P-15 manufactured by KLA-Tencor.

(4) Total Light Transmittance The total light transmittance of the dicing tape was measured according to JIS K 7361 using a haze meter trade name "HM-150" manufactured by Murakami Color Research Laboratory.

(5) Haze value The haze value of the dicing tape was measured according to JIS K 7136 using a haze meter trade name "HM-150" manufactured by Murakami Color Research Laboratory.

(6) Light transmittance at a wavelength of 1064 nm The light transmittance of the dicing tape at a wavelength of 1064 nm was measured using SolidSpec-3700 manufactured by Shimadzu Corporation.

(7) Measurement of binarized white area A dicing tape was pressed onto the Si wafer mirror surface. Observe the dicing tape from the base material side with a laser microscope VK-X150 (manufactured by Keyence) set to a brightness of 80, and transfer the observed image (range: 5.8 mm × 4.4 mm, brightness 256 gradations) to a PC. taken in. Using ImageJ (free software), the observed image is converted to a binarized image with a luminance of 140, that is, a boundary of 140 gradations from the low luminance side of 256 gradations of luminance (with a threshold of 55% of the maximum luminance), The ratio of the white area (high luminance portion) was obtained by a predetermined macro processing.

(8) Apparatus visibility evaluation before stealth dicing A silicon wafer and a ring frame were attached to a dicing tape, and camera visibility was confirmed with the following apparatus and evaluated according to the following criteria.
Apparatus used: DAL7360 (SDE05) manufactured by Disco
SD camera: Camera for height adjustment. A camera is focused on the rear surface of the wafer through the dicing tape, and the height of the focus is recognized as the position of the rear surface of the wafer by coordinates within the apparatus control system. The laser irradiation position inside the wafer is determined based on the height of the back surface of the wafer. This laser irradiation positioning operation is continuously repeated during dicing.
IR camera: A camera for pattern recognition of silicon wafers. A camera used to recognize the wafer surface pattern through the dicing tape and determine the laser irradiation start position (XY coordinate setting) within the device.
<Evaluation Criteria>
〇・・・Position recognition by SD camera and IR camera is possible without problems.
x: Accuracy of height recognition and/or pattern recognition is poor, making it impossible to drive the apparatus in automatic mode.

(9) Dividing suitability evaluation A silicon wafer and a ring frame were attached to a dicing tape, and a modified portion was formed inside the wafer by irradiating a laser through the dicing tape under the following dividing conditions.
(Division condition)
Device used: Disco DAL7360 (SDE05)
Power: 0.25W
Defocus amount: -2.5um
Feeding speed: 350mm/sec
Frequency: 80kHz
Number of passes: 2 (mapping pass 1 pass + processing 1 pass)
Silicon wafer: diameter 200 mmφ, thickness 50 μm, chip size: 5 mm × 5 mm
After that, using an expanding device (manufactured by Disco, trade name "DDS-2300"), the peripheral portion of the dicing tape is expanded at an expansion amount of 10 mm, an expansion speed of 20 mm / sec, and an expansion temperature of 22 ° C. to singulate the silicon wafer. did.
Observe the cross section of the singulated chip with a digital microscope (manufactured by KEYENCE, trade name “VHX-1000”), and if the laser modified portion is formed linearly at regular intervals, ○, modified When the interval between the modified portions was uneven (improved layer missing) and/or when the line connecting the modified portions was not straight (meandering), it was evaluated as x.

[Production Example 1] Preparation of active energy ray-curable pressure-sensitive adhesive (1) 100 parts by weight of 2-methoxyethyl acrylate, 27 parts by weight of acryloylmorpholine, and 22 parts by weight of 2-hydroxyethyl acrylate were mixed to form a monomer composition. prepared the product.
Next, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer, and 500 parts by weight of ethyl acetate, 149 parts by weight of the above monomer composition, and 0.2 parts by weight of azoisobutylnitrile (AIBN) were mixed under a nitrogen atmosphere. 2 parts by weight were charged and stirred at 60° C. for 24 hours. Then, it was cooled to room temperature to obtain an acrylic copolymer solution A1 containing an acrylic copolymer a1 (weight average molecular weight: 600,000). 24 parts by weight of 2-methacryloyloxyethyl isocyanate was added to the obtained acrylic copolymer solution a and reacted to add an NCO group to the side chain terminal OH group of 2-hydroxyethyl acrylate in the copolymer. to obtain an acrylic copolymer solution A2 containing an acrylic copolymer a2 having a weight average molecular weight of 800,000 and having carbon-carbon double bonds at the terminals.
Acrylic copolymer solution A2 containing 100 parts by weight of acrylic copolymer a2, 3 parts by weight of a cross-linking agent (Japan Polyurethane Industry Co., Ltd., trade name "Coronate L"), a photopolymerization initiator (manufactured by Ciba Japan) , trade name "Irgacure 184") 7 parts by weight, UV effect auxiliary (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name "NK Oligo U-6LPA") 30 parts by weight, active energy ray curable adhesive (1 ).

[Production Example 2] Production of active energy ray-curable adhesive (2) Production example except that the amount of the cross-linking agent (Japan Polyurethane Industry Co., Ltd., trade name "Coronate L") was 0.6 parts by weight An active energy ray-curable adhesive (2) was obtained in the same manner as in 1.

[Production Example 3] Production of active energy ray-curable adhesive (3) Production example except that the amount of the cross-linking agent (Japan Polyurethane Industry Co., Ltd., trade name "Coronate L") was 0.025 parts by weight An active energy ray-curable adhesive (3) was obtained in the same manner as in 1.

[Production Example 4] Production of active energy ray-curable pressure-sensitive adhesive (4) An active energy ray-curable pressure-sensitive adhesive (4) was obtained in the same manner.

[Production Example 5] Production of Substrate (1) As a substrate forming material, high-pressure polyethylene (PE) (manufactured by Sumitomo Chemical Co., Ltd., trade name “Sumikasen F213-P”) was used.
The substrate-forming material is put into an extruder, and T-die melt co-extrusion (extruder: manufactured by GM Engineering, trade name "GM30-28"/T-die: feed block method; extrusion temperature 240° C.) is performed. A film having a thickness of 100 μm was obtained while performing embossing treatment (surface roughness Ra: 1.42 μm) on one side of the film. The thickness of the layer was controlled by the shape of the T-die exit. Both surfaces of the obtained film were subjected to corona treatment to obtain a substrate (1). The Ra of the embossed surface is a numerical value obtained by measuring with VK-X150 manufactured by Keyence Corporation.

[Production Example 6] Production of Substrate (2) A substrate (2) was obtained in the same manner as in Production Example 5, except that only the embossed surface of the film was subjected to corona treatment.

[Production Example 7] Production of base material (3) As a material for forming the base material, 100 parts by weight of high-pressure polyethylene (PE) (manufactured by Sumitomo Chemical Co., Ltd., trade name "Sumikasen F213-P") and a lubricant (manufactured by Mitsubishi Chemical Co., Ltd., A mixture with 1 part by weight of "Amide Ap-1" (trade name) was used.
The substrate-forming material is put into an extruder, and T-die melt co-extrusion (extruder: manufactured by GM Engineering, trade name "GM30-28"/T-die: feed block method; extrusion temperature 240° C.) is performed. A film having a thickness of 100 μm was obtained while performing embossing treatment (surface roughness Ra: 1.42 μm) on one side of the film. The thickness of the layer was controlled by the shape of the T-die exit. The embossed surface of the obtained film was subjected to corona treatment to obtain a substrate (3).

[Example 1]
The active energy ray-curable adhesive (1) was applied to the silicone-treated surface of a PET separator (thickness: 38 μm), and then heated at 120° C. for 2 minutes to form an adhesive layer with a thickness of 15 μm. .
A dicing tape was obtained by transferring the pressure-sensitive adhesive layer to the substrate using a hand roller. "NSO Film 100um Tomei" manufactured by Okura Kogyo Co., Ltd. was used as the base material. The film is a film that has been corona treated on one side and is not embossed. The adhesive layer was laminated onto the corona treated surface.
The obtained dicing tape was subjected to the above evaluations (1) to (9). Table 1 shows the results.

[Example 2]
Instead of the active energy ray-curable adhesive (1), the active energy ray-curable adhesive (2) was used, and the substrate (2) prepared in Production Example 6 was used as the substrate. A dicing tape was obtained in the same manner as in Example 1. The adhesive layer was laminated on the embossed surface.
The obtained dicing tape was subjected to the above evaluations (1) to (9). Table 1 shows the results.

[Example 3]
The active energy ray-curable adhesive (3) is applied to the silicone-treated surface of a PET separator (thickness: 38 μm), and then heated at 120° C. for 2 minutes to form an adhesive layer a with a thickness of 7 μm. did.
Separately, the active energy ray-curable adhesive (1) is applied to the silicone-treated surface of a PET separator (thickness: 38 μm), and then heated at 120 ° C. for 2 minutes to form an adhesive layer b having a thickness of 8 μm. formed.
Using a hand roller, the adhesive layer a is transferred to the base material (2), and the adhesive layer b is transferred to the adhesive layer a to form a dicing tape (base material (2)/first adhesive layer a/Second adhesive layer b) was obtained. The adhesive layer was laminated on the embossed surface.
The obtained dicing tape was subjected to the above evaluations (1) to (9). Table 1 shows the results.

[Example 4]
The active energy ray-curable adhesive (3) is applied to the silicone-treated surface of a PET separator (thickness: 38 μm), and then heated at 120° C. for 2 minutes to form an adhesive layer a with a thickness of 7 μm. did.
Separately, the active energy ray-curable adhesive (4) is applied to the silicone-treated surface of a PET separator (thickness: 38 μm), and then heated at 120° C. for 2 minutes to form an adhesive layer c having a thickness of 8 μm. formed.
Using a hand roller, the adhesive layer a is transferred to the base material (2), and the adhesive layer c is transferred to the adhesive layer a to form a dicing tape (base material (2) / first adhesive layer a/Second adhesive layer c) was obtained. The adhesive layer was laminated on the embossed surface.
The obtained dicing tape was subjected to the above evaluations (1) to (9). Table 1 shows the results.

[Example 5]
A dicing tape was obtained in the same manner as in Example 4, except that the base material (3) was used instead of the base material (2).
The obtained dicing tape was subjected to the above evaluations (1) to (9). Table 1 shows the results.

[Comparative Example 1]
A dicing tape was obtained in the same manner as in Example 1, except that the base material (1) produced in Production Example 5 was used as the base material. The adhesive layer was laminated on the embossed surface.
The obtained dicing tape was subjected to the above evaluations (1) to (9). Table 1 shows the results.

[Comparative Example 2]
A dicing tape was obtained in the same manner as in Example 2, except that the base material (1) produced in Production Example 5 was used as the base material. The adhesive layer was laminated on the embossed surface.
The obtained dicing tape was subjected to the above evaluations (1) to (9). Table 1 shows the results.

[Comparative Example 3]
The active energy ray-curable adhesive (3) is applied to the silicone-treated surface of a PET separator (thickness: 38 μm), and then heated at 120° C. for 2 minutes to form an adhesive layer a′ having a thickness of 5 μm. formed.
Separately, the active energy ray-curable adhesive (4) is applied to the silicone-treated surface of a PET separator (thickness: 38 μm), and then heated at 120° C. for 2 minutes to form an adhesive layer c having a thickness of 10 μm. 'formed.
Using a hand roller, the adhesive layer a' is transferred to the base material (2), and the adhesive layer c' is transferred to the adhesive layer a to form a dicing tape (base material (2)/first adhesive An agent layer a'/second adhesive layer c') was obtained. The adhesive layer was laminated on the embossed surface.
The obtained dicing tape was subjected to the above evaluations (1) to (9). Table 1 shows the results.

As is clear from Table 1, if the dicing tape of the present invention is used, the binarized white area is equal to or greater than a specific value, so in the stealth dicing process, camera detection via the dicing tape, that is, a camera (for example, , IR camera, SD camera) can recognize the surface pattern of the semiconductor wafer, detect the position in the height direction of the semiconductor wafer, and the like with high accuracy. Moreover, a modified layer can be satisfactorily formed inside the semiconductor wafer. In the examples, blocking of the base material should be prevented; By constructing the dicing tape, the binarized white area can be increased. In Comparative Example 3, although the surface roughness of the substrate is relatively small, the binarized white area is less than or equal to a specific value, indicating that the dicing accuracy is inferior.

REFERENCE SIGNS LIST 10 base material 20 adhesive layer 100 dicing tape

Claims (10)

comprising a substrate and an adhesive layer disposed on one side of the substrate;
With the Si wafer mirror surface pressed against the dicing tape, a grayscale image with a brightness of 256 levels obtained by observing with a laser microscope from the base material side is used as a threshold value of 55% of the maximum brightness. When binarized, the area of the white part is 80% or more of the image area ,
Only one surface of the substrate is embossed, the embossed surface is the surface on the adhesive layer side, and the arithmetic average surface roughness Ra of the embossed surface of the substrate is 1.0 μm to is 3 μm;
dicing tape. 2. The dicing tape according to claim 1, wherein the wettability of one surface of said base material is 40 mN/m or less. 3. The dicing tape according to claim 2, wherein the substrate is arranged such that the surface having a wettability of 40 mN/m or less is the surface opposite to the pressure-sensitive adhesive layer. The dicing tape according to any one of claims 1 to 3, wherein the base material contains a polyethylene resin. The dicing tape according to any one of claims 1 to 4, wherein at least one surface of said base material is a corona-treated surface. 6. The dicing tape according to claim 1, wherein the adhesive layer has a tensile elastic modulus at 22° C. of 0.05 MPa to 1 MPa. The pressure-sensitive adhesive layer has a two-layer structure,
The dicing tape according to any one of claims 1 to 5, comprising the base material, a first adhesive layer, and a second adhesive layer in this order. 8. The dicing tape according to claim 7, wherein the tensile elastic modulus at 22° C. of the first pressure-sensitive adhesive layer is 0.05 MPa to 1 MPa. 9. The dicing tape according to claim 7, wherein the second pressure-sensitive adhesive layer has a tensile elastic modulus at 22° C. of 0.1 MPa to 2 MPa. The dicing tape according to any one of claims 7 to 9, wherein the first adhesive layer has a thickness of 5 µm to 468 µm.

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