SG10201802767VA - Liquid supplying device and liquid supplying method - Google Patents

Liquid supplying device and liquid supplying method

Info

Publication number
SG10201802767VA
SG10201802767VA SG10201802767VA SG10201802767VA SG10201802767VA SG 10201802767V A SG10201802767V A SG 10201802767VA SG 10201802767V A SG10201802767V A SG 10201802767VA SG 10201802767V A SG10201802767V A SG 10201802767VA SG 10201802767V A SG10201802767V A SG 10201802767VA
Authority
SG
Singapore
Prior art keywords
liquid
liquid supplying
flow rate
supplying device
rate control
Prior art date
Application number
SG10201802767VA
Other languages
English (en)
Inventor
Fujihiko Toyomasu
Junji Kunisawa
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201802767VA publication Critical patent/SG10201802767VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K37/00—Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
    • F16K37/0075—For recording or indicating the functioning of a valve in combination with test equipment
    • F16K37/0091—For recording or indicating the functioning of a valve in combination with test equipment by measuring fluid parameters
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00—Control of flow ratio
    • G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/131—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
    • G05D11/132—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B2211/00—Circuits for servomotor systems
    • F15B2211/50—Pressure control
    • F15B2211/505—Pressure control characterised by the type of pressure control means
    • F15B2211/50554—Pressure control characterised by the type of pressure control means the pressure control means controlling a pressure downstream of the pressure control means, e.g. pressure reducing valve
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B2211/00—Circuits for servomotor systems
    • F15B2211/50—Pressure control
    • F15B2211/57—Control of a differential pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7759—Responsive to change in rate of fluid flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
SG10201802767VA 2017-04-03 2018-04-03 Liquid supplying device and liquid supplying method SG10201802767VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017073791A JP6486986B2 (ja) 2017-04-03 2017-04-03 液体供給装置及び液体供給方法

Publications (1)

Publication Number Publication Date
SG10201802767VA true SG10201802767VA (en) 2018-11-29

Family

ID=63672448

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201802767VA SG10201802767VA (en) 2017-04-03 2018-04-03 Liquid supplying device and liquid supplying method

Country Status (6)

Country Link
US (2) US10343192B2 (ko)
JP (1) JP6486986B2 (ko)
KR (2) KR102513025B1 (ko)
CN (1) CN108695203A (ko)
SG (1) SG10201802767VA (ko)
TW (2) TWI760466B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7326003B2 (ja) 2019-04-09 2023-08-15 株式会社荏原製作所 液体供給装置、洗浄ユニット、基板処理装置
AT526426B1 (de) * 2023-01-26 2024-03-15 Siconnex Customized Solutions Gmbh Behandlungsvorrichtung und Verfahren zur Behandlung von Halbleiterobjekten

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331364A (en) 1992-07-20 1994-07-19 Thatcher Chemical Company Apparatus for diluting and mixing chemicals and automatically feeding the diluted chemicals to a photographic processor on demand
US5950645A (en) * 1993-10-20 1999-09-14 Verteq, Inc. Semiconductor wafer cleaning system
US6152162A (en) * 1998-10-08 2000-11-28 Mott Metallurgical Corporation Fluid flow controlling
US6280300B1 (en) * 1998-11-25 2001-08-28 Ebara Corporation Filter apparatus
JP4127346B2 (ja) 1999-08-20 2008-07-30 株式会社荏原製作所 ポリッシング装置及び方法
TW541230B (en) * 2000-10-06 2003-07-11 Ebara Corp Method for supplying slurry to polishing apparatus
US7216656B2 (en) * 2000-12-28 2007-05-15 Yoshiharu Yamamoto Semiconductor substrate cleansing apparatus
US6767877B2 (en) * 2001-04-06 2004-07-27 Akrion, Llc Method and system for chemical injection in silicon wafer processing
KR20050044456A (ko) 2001-11-13 2005-05-12 에프 에스 아이 인터내셔날,인코포레이티드 침수 처리용 개량된 처리 제어
JP2004111668A (ja) 2002-09-19 2004-04-08 Citizen Watch Co Ltd 基板処理装置及び基板処理方法
JP4406292B2 (ja) * 2004-01-20 2010-01-27 株式会社フジキン 流体通路のウォータハンマーレス開放方法及びこれを用いたウォータハンマーレス開放装置
US20060188412A1 (en) * 2005-02-24 2006-08-24 Dainippon Screen Mfg.Co., Ltd. Substrate treating apparatus and method
JP2007141926A (ja) 2005-11-15 2007-06-07 Sony Corp 基板処理装置および基板処理方法
US7849505B2 (en) 2006-08-17 2010-12-07 At&T Intellectual Property I, Lp System and method of selecting a virtual private network access server
JP2008078322A (ja) * 2006-09-20 2008-04-03 Sony Corp 半導体ウェーハの処理方法及び処理装置
JP5079401B2 (ja) * 2007-06-25 2012-11-21 サーパス工業株式会社 圧力センサ、差圧式流量計及び流量コントローラ
JP5236231B2 (ja) 2007-08-29 2013-07-17 大日本スクリーン製造株式会社 基板処理装置
KR100904452B1 (ko) * 2007-12-06 2009-06-24 세메스 주식회사 오존수혼합액 공급장치 및 방법, 그리고 이를 구비하는기판 처리 설비
JP5043696B2 (ja) 2008-01-21 2012-10-10 東京エレクトロン株式会社 処理液混合装置、基板処理装置および処理液混合方法並びに記憶媒体
JP5379621B2 (ja) 2009-09-17 2013-12-25 大日本スクリーン製造株式会社 検査レシピ自動生成装置、ならびに検査レシピ自動生成プログラムおよびそれを記録した記録媒体
JP5646956B2 (ja) 2010-11-04 2014-12-24 東京エレクトロン株式会社 液体流量制御装置、液体流量制御方法および記憶媒体
JP6005334B2 (ja) 2010-12-24 2016-10-12 株式会社堀場エステック 材料ガス制御システム
WO2012099895A1 (en) * 2011-01-18 2012-07-26 Flow Control Industries, Inc. Pressure compensated flow rate controller with btu meter
KR101599343B1 (ko) * 2011-05-10 2016-03-03 가부시키가이샤 후지킨 유량 모니터 부착 압력식 유량 제어 장치
JP2013138062A (ja) * 2011-12-28 2013-07-11 Jet Co Ltd 薬液混合装置
JP6212253B2 (ja) 2012-11-15 2017-10-11 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP6339954B2 (ja) * 2014-06-09 2018-06-06 株式会社荏原製作所 洗浄薬液供給装置、洗浄薬液供給方法、及び洗浄ユニット
JP6378555B2 (ja) * 2014-06-26 2018-08-22 株式会社荏原製作所 洗浄ユニット
US10340159B2 (en) * 2014-06-09 2019-07-02 Ebara Corporation Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit
SG11201701919XA (en) * 2014-09-16 2017-04-27 Organo Corp Diluted solution production method and diluted solution production apparatus
US10500691B2 (en) * 2016-08-29 2019-12-10 Ebara Corporation Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
US10926301B2 (en) 2021-02-23
TWI760466B (zh) 2022-04-11
JP2018181883A (ja) 2018-11-15
KR20180112705A (ko) 2018-10-12
KR102513025B1 (ko) 2023-03-22
TWI781890B (zh) 2022-10-21
CN108695203A (zh) 2018-10-23
KR102555758B1 (ko) 2023-07-17
JP6486986B2 (ja) 2019-03-20
TW202226424A (zh) 2022-07-01
KR20230047971A (ko) 2023-04-10
US10343192B2 (en) 2019-07-09
TW201842563A (zh) 2018-12-01
US20190270125A1 (en) 2019-09-05
US20180281026A1 (en) 2018-10-04

Similar Documents

Publication Publication Date Title
SA517390483B1 (ar) أنظمة وطرق، ووسط حاسوب لتوفير تصنيف يعتمد على الإنتروبيا لتدفق متعدد الأطوار
MY193314A (en) Apparatus and method for monitoring use of a device
CO2019004934A2 (es) Dispositivo electronico regulador de vacio
MX2019009403A (es) Sistema, metodo y aparato para el monitoreo, regulacion o control de flujo de fluido.
JP2019528127A5 (ko)
MX2017004015A (es) Metodo y aparato para monitorear, comunicar y analizar la cantidad de un fluido en un tanque.
SA516371696B1 (ar) طريقة لتفسير بيانات مستشعرات درجة الحرارة الموزعة خلال عمليات حفرة البئر
MX2017010769A (es) Dispositivos y metodos de determinacion de confianza de mediciones de caudalimetros.
SA518400106B1 (ar) مقياس ضغط إلكتروني لنظام مضغوط مع تدفقات مخرج متغيرة
MX2021005199A (es) Dispositivos de intercambio de fluidos y controles, sistemas y metodos relacionados.
MX364857B (es) Dispositivos y metodos de determinacion de umbral de coriolis.
TR201711045A2 (tr) Gözlem ci̇hazi, pi̇şi̇ri̇ci̇ ve gözlem yöntemi̇
NZ729931A (en) Liquid analyser
MY179815A (en) Air-flushing method, air-flushing device, and recording medium
EE201600012A (et) Seade ja meetod vedelikuvooluga seotud parameetrite määramiseks
MX2017009167A (es) Aparato para mantener la exactitud de sensor.
SG10201802767VA (en) Liquid supplying device and liquid supplying method
MX2019000587A (es) Cabezal de bombeo, asi como dispositivo dosificador.
SG10201807414RA (en) Method of inspecting flow rate measuring system
GB2547174A (en) Mechanical downhole pressure maintenance system
GB2539583A (en) Flow monitoring using distributed strain measurement
MX2015015402A (es) Prueba de impulso de cámara cerrada con mediciónde caudal de fondo de pozo.
MY182747A (en) Downhole pressure maintenance system using a controller
IN2013CH06209A (ko)
GB2557139A (en) A method of assessing the condition of a tubular member