SG10201700932TA - Water discharge system, water discharge method, water discharge control apparatus, water discharge control method, substrate processing apparatus and water discharge control program - Google Patents

Water discharge system, water discharge method, water discharge control apparatus, water discharge control method, substrate processing apparatus and water discharge control program

Info

Publication number
SG10201700932TA
SG10201700932TA SG10201700932TA SG10201700932TA SG10201700932TA SG 10201700932T A SG10201700932T A SG 10201700932TA SG 10201700932T A SG10201700932T A SG 10201700932TA SG 10201700932T A SG10201700932T A SG 10201700932TA SG 10201700932T A SG10201700932T A SG 10201700932TA
Authority
SG
Singapore
Prior art keywords
water discharge
discharge control
substrate processing
processing apparatus
control program
Prior art date
Application number
SG10201700932TA
Other languages
English (en)
Inventor
Hiromitsu Watanabe
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201700932TA publication Critical patent/SG10201700932TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Weting (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG10201700932TA 2016-02-10 2017-02-06 Water discharge system, water discharge method, water discharge control apparatus, water discharge control method, substrate processing apparatus and water discharge control program SG10201700932TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016023844A JP6654457B2 (ja) 2016-02-10 2016-02-10 基板処理装置用排水システム、排水方法及び排水制御装置並びに記録媒体

Publications (1)

Publication Number Publication Date
SG10201700932TA true SG10201700932TA (en) 2017-09-28

Family

ID=59497892

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201700932TA SG10201700932TA (en) 2016-02-10 2017-02-06 Water discharge system, water discharge method, water discharge control apparatus, water discharge control method, substrate processing apparatus and water discharge control program

Country Status (3)

Country Link
US (1) US11141832B2 (ja)
JP (1) JP6654457B2 (ja)
SG (1) SG10201700932TA (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6654457B2 (ja) * 2016-02-10 2020-02-26 株式会社荏原製作所 基板処理装置用排水システム、排水方法及び排水制御装置並びに記録媒体
JP6956578B2 (ja) 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
US10468270B2 (en) * 2017-11-30 2019-11-05 Taiwan Semiconductor Manufacturing Co., Ltd. Performing planarization process controls in semiconductor fabrication
JP7101083B2 (ja) * 2018-08-23 2022-07-14 東京エレクトロン株式会社 基板液処理装置、基板液処理方法および記憶媒体
US20220076967A1 (en) * 2020-09-10 2022-03-10 Changxin Memory Technologies, Inc. Wet etching control system, wet etching machine and wet etching control method
US11798800B2 (en) * 2021-06-25 2023-10-24 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for solvent recycling
US20240077890A1 (en) * 2022-09-01 2024-03-07 Applied Materials, Inc. Smart manufacturing solutions for wastewater treatment

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5791970A (en) * 1997-04-07 1998-08-11 Yueh; William Slurry recycling system for chemical-mechanical polishing apparatus
JPH1110540A (ja) * 1997-06-23 1999-01-19 Speedfam Co Ltd Ｃｍｐ装置のスラリリサイクルシステム及びその方法
JPH11277434A (ja) * 1998-03-30 1999-10-12 Speedfam Co Ltd Ｃｍｐ装置のスラリリサイクルシステム及びその方法
JPH11347940A (ja) 1998-06-05 1999-12-21 Sumitomo Metal Ind Ltd 研磨スラリー再生装置及びこれを用いた研磨システム
JP2000286224A (ja) * 1999-03-30 2000-10-13 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001269868A (ja) 2000-03-28 2001-10-02 Ebara Corp 純水回収・再生・供給装置
JP2001287163A (ja) * 2000-04-06 2001-10-16 Nec Corp 研磨用スラリー再生装置
US6866784B2 (en) * 2000-06-27 2005-03-15 Nymtech, Co., Ltd. Slurry recycling system and method for CMP apparatus
US7479205B2 (en) * 2000-09-22 2009-01-20 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP4386561B2 (ja) * 2000-10-27 2009-12-16 大日本スクリーン製造株式会社 洗浄液の分離再利用装置
US6908512B2 (en) * 2002-09-20 2005-06-21 Blue29, Llc Temperature-controlled substrate holder for processing in fluids
US7383723B2 (en) * 2005-05-24 2008-06-10 Intel Corporation Detecting particle agglomeration in chemical mechanical polishing slurries
JP5297695B2 (ja) * 2008-05-30 2013-09-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
JP2011011307A (ja) * 2009-07-03 2011-01-20 Sumco Corp ウェーハ研磨用スラリーのリサイクル方法およびそのリサイクル装置
US20120042575A1 (en) * 2010-08-18 2012-02-23 Cabot Microelectronics Corporation Cmp slurry recycling system and methods
US8696404B2 (en) * 2011-12-21 2014-04-15 WD Media, LLC Systems for recycling slurry materials during polishing processes
JP2013219307A (ja) 2012-04-12 2013-10-24 Japan Cabot Microelectronics Corp Ｃｍｐスラリー再生装置およびｃｍｐスラリー再生方法
US9339914B2 (en) * 2012-09-10 2016-05-17 Applied Materials, Inc. Substrate polishing and fluid recycling system
JP6295107B2 (ja) * 2014-03-07 2018-03-14 株式会社荏原製作所 基板処理システムおよび基板処理方法
JP6654457B2 (ja) * 2016-02-10 2020-02-26 株式会社荏原製作所 基板処理装置用排水システム、排水方法及び排水制御装置並びに記録媒体

Also Published As

Publication number Publication date
US20170229323A1 (en) 2017-08-10
JP6654457B2 (ja) 2020-02-26
US11141832B2 (en) 2021-10-12
JP2017143190A (ja) 2017-08-17

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