SG10201503210QA - Semiconductor device and method of forming an inductor on polymermatrix composite substrate - Google Patents
Semiconductor device and method of forming an inductor on polymermatrix composite substrateInfo
- Publication number
- SG10201503210QA SG10201503210QA SG10201503210QA SG10201503210QA SG10201503210QA SG 10201503210Q A SG10201503210Q A SG 10201503210QA SG 10201503210Q A SG10201503210Q A SG 10201503210QA SG 10201503210Q A SG10201503210Q A SG 10201503210QA SG 10201503210Q A SG10201503210Q A SG 10201503210QA
- Authority
- SG
- Singapore
- Prior art keywords
- polymermatrix
- inductor
- forming
- semiconductor device
- composite substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/621,738 US8158510B2 (en) | 2009-11-19 | 2009-11-19 | Semiconductor device and method of forming IPD on molded substrate |
US12/726,880 US8791006B2 (en) | 2005-10-29 | 2010-03-18 | Semiconductor device and method of forming an inductor on polymer matrix composite substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201503210QA true SG10201503210QA (en) | 2015-06-29 |
Family
ID=44130330
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201503210QA SG10201503210QA (en) | 2009-11-19 | 2010-10-14 | Semiconductor device and method of forming an inductor on polymermatrix composite substrate |
SG201007560-4A SG171520A1 (en) | 2009-11-19 | 2010-10-14 | Semiconductor device and method of forming an inductor on polymer matrix composite substrate |
SG2013027552A SG189780A1 (en) | 2009-11-19 | 2010-10-14 | Semiconductor device and method of forming an inductor on polymer matrix composite substrate |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG201007560-4A SG171520A1 (en) | 2009-11-19 | 2010-10-14 | Semiconductor device and method of forming an inductor on polymer matrix composite substrate |
SG2013027552A SG189780A1 (en) | 2009-11-19 | 2010-10-14 | Semiconductor device and method of forming an inductor on polymer matrix composite substrate |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN102097301B (zh) |
SG (3) | SG10201503210QA (zh) |
TW (1) | TWI498983B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8809996B2 (en) | 2012-06-29 | 2014-08-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package with passive devices and method of forming the same |
CN103876432B (zh) * | 2012-12-12 | 2016-09-14 | 深圳市神达实业有限公司 | 太阳能手机充电护套 |
JP7148300B2 (ja) * | 2018-07-12 | 2022-10-05 | 上村工業株式会社 | 導電性バンプ、及び無電解Ptめっき浴 |
US10971446B2 (en) * | 2018-11-30 | 2021-04-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of manufacture |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2749489B2 (ja) * | 1992-10-29 | 1998-05-13 | 京セラ株式会社 | 回路基板 |
US6362012B1 (en) * | 2001-03-05 | 2002-03-26 | Taiwan Semiconductor Manufacturing Company | Structure of merged vertical capacitor inside spiral conductor for RF and mixed-signal applications |
JP2003101222A (ja) * | 2001-09-21 | 2003-04-04 | Sony Corp | 薄膜回路基板装置及びその製造方法 |
US8409970B2 (en) * | 2005-10-29 | 2013-04-02 | Stats Chippac, Ltd. | Semiconductor device and method of making integrated passive devices |
-
2010
- 2010-10-14 SG SG10201503210QA patent/SG10201503210QA/en unknown
- 2010-10-14 SG SG201007560-4A patent/SG171520A1/en unknown
- 2010-10-14 SG SG2013027552A patent/SG189780A1/en unknown
- 2010-10-18 TW TW099135418A patent/TWI498983B/zh active
- 2010-11-19 CN CN201010550946.7A patent/CN102097301B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
SG189780A1 (en) | 2013-05-31 |
TW201123327A (en) | 2011-07-01 |
TWI498983B (zh) | 2015-09-01 |
SG171520A1 (en) | 2011-06-29 |
CN102097301A (zh) | 2011-06-15 |
CN102097301B (zh) | 2016-06-15 |
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