SG10201500455QA - Polishing method and polishing apparatus - Google Patents
Polishing method and polishing apparatusInfo
- Publication number
- SG10201500455QA SG10201500455QA SG10201500455QA SG10201500455QA SG10201500455QA SG 10201500455Q A SG10201500455Q A SG 10201500455QA SG 10201500455Q A SG10201500455Q A SG 10201500455QA SG 10201500455Q A SG10201500455Q A SG 10201500455QA SG 10201500455Q A SG10201500455Q A SG 10201500455QA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- polishing apparatus
- polishing method
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014010800A JP6374169B2 (ja) | 2014-01-23 | 2014-01-23 | 研磨方法および研磨装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201500455QA true SG10201500455QA (en) | 2015-08-28 |
Family
ID=53687476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201500455QA SG10201500455QA (en) | 2014-01-23 | 2015-01-21 | Polishing method and polishing apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US9524913B2 (ja) |
JP (1) | JP6374169B2 (ja) |
KR (1) | KR101998453B1 (ja) |
CN (1) | CN104802069B (ja) |
SG (1) | SG10201500455QA (ja) |
TW (1) | TWI689373B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9505101B1 (en) * | 2015-06-24 | 2016-11-29 | The Boeing Company | Automated sanding system and method |
US11400563B2 (en) * | 2018-12-07 | 2022-08-02 | Disco Corporation | Processing method for disk-shaped workpiece |
KR20210041654A (ko) * | 2019-10-07 | 2021-04-16 | 삼성전자주식회사 | 반도체 기판 측정 장치, 이를 이용한 반도체 기판 처리 장치 및 반도체 소자 형성 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5885138A (en) * | 1993-09-21 | 1999-03-23 | Ebara Corporation | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
KR100253085B1 (ko) * | 1997-07-10 | 2000-04-15 | 윤종용 | 측정장치를구비한웨이퍼폴리싱장치및폴리싱방법 |
US7097534B1 (en) * | 2000-07-10 | 2006-08-29 | Applied Materials, Inc. | Closed-loop control of a chemical mechanical polisher |
US6447370B1 (en) * | 2001-04-17 | 2002-09-10 | Speedfam-Ipec Corporation | Inline metrology device |
US6967715B2 (en) * | 2002-12-06 | 2005-11-22 | International Business Machines Corporation | Method and apparatus for optical film measurements in a controlled environment |
US7118451B2 (en) * | 2004-02-27 | 2006-10-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMP apparatus and process sequence method |
JP2006093180A (ja) * | 2004-09-21 | 2006-04-06 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2006231471A (ja) * | 2005-02-25 | 2006-09-07 | Speedfam Co Ltd | 両面ポリッシュ加工機とその定寸制御方法 |
ITBO20070504A1 (it) * | 2007-07-20 | 2009-01-21 | Marposs Spa | Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione |
JP2009050944A (ja) * | 2007-08-24 | 2009-03-12 | Disco Abrasive Syst Ltd | 基板の厚さ測定方法および基板の加工装置 |
JP5305729B2 (ja) * | 2008-05-12 | 2013-10-02 | 株式会社荏原製作所 | 研磨方法及び研磨装置、並びに研磨装置制御用プログラム |
US20140141694A1 (en) * | 2012-11-21 | 2014-05-22 | Applied Materials, Inc. | In-Sequence Spectrographic Sensor |
-
2014
- 2014-01-23 JP JP2014010800A patent/JP6374169B2/ja active Active
-
2015
- 2015-01-20 KR KR1020150009142A patent/KR101998453B1/ko active IP Right Grant
- 2015-01-21 SG SG10201500455QA patent/SG10201500455QA/en unknown
- 2015-01-21 TW TW104101917A patent/TWI689373B/zh active
- 2015-01-21 US US14/602,254 patent/US9524913B2/en active Active
- 2015-01-22 CN CN201510032404.3A patent/CN104802069B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN104802069B (zh) | 2018-09-28 |
JP2015136775A (ja) | 2015-07-30 |
CN104802069A (zh) | 2015-07-29 |
US9524913B2 (en) | 2016-12-20 |
US20150221562A1 (en) | 2015-08-06 |
KR101998453B1 (ko) | 2019-07-09 |
JP6374169B2 (ja) | 2018-08-15 |
TW201536477A (zh) | 2015-10-01 |
TWI689373B (zh) | 2020-04-01 |
KR20150088193A (ko) | 2015-07-31 |
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