SG10201406877WA - Method for chemical mechanical polishing silicon wafers - Google Patents

Method for chemical mechanical polishing silicon wafers

Info

Publication number
SG10201406877WA
SG10201406877WA SG10201406877WA SG10201406877WA SG10201406877WA SG 10201406877W A SG10201406877W A SG 10201406877WA SG 10201406877W A SG10201406877W A SG 10201406877WA SG 10201406877W A SG10201406877W A SG 10201406877WA SG 10201406877W A SG10201406877W A SG 10201406877WA
Authority
SG
Singapore
Prior art keywords
mechanical polishing
chemical mechanical
silicon wafers
polishing silicon
wafers
Prior art date
Application number
SG10201406877WA
Other languages
English (en)
Inventor
Itai Yasuyuki
Qian Bainian
Nakano Hiroyuki
B James David
Kawai Naoko
Kawabata Katsumasa
Yoshida Koichi
Miyamoto Kazutaka
Murnane James
Yeh Fengji
W Degroot Marty
Original Assignee
Rohm & Haas Elect Mat
Nitta Haas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat, Nitta Haas Inc filed Critical Rohm & Haas Elect Mat
Publication of SG10201406877WA publication Critical patent/SG10201406877WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
SG10201406877WA 2013-10-24 2014-10-23 Method for chemical mechanical polishing silicon wafers SG10201406877WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/062,060 US8980749B1 (en) 2013-10-24 2013-10-24 Method for chemical mechanical polishing silicon wafers

Publications (1)

Publication Number Publication Date
SG10201406877WA true SG10201406877WA (en) 2015-05-28

Family

ID=52632216

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201406877WA SG10201406877WA (en) 2013-10-24 2014-10-23 Method for chemical mechanical polishing silicon wafers

Country Status (8)

Country Link
US (1) US8980749B1 (zh)
JP (1) JP6463618B2 (zh)
KR (1) KR102359116B1 (zh)
CN (1) CN104551977B (zh)
DE (1) DE102014015664A1 (zh)
MY (1) MY172804A (zh)
SG (1) SG10201406877WA (zh)
TW (1) TWI621166B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9314897B2 (en) * 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6697931B2 (ja) * 2016-04-01 2020-05-27 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法及び研磨方法
US20180281149A1 (en) 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7113626B2 (ja) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 研磨パッド
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
CN110528287B (zh) * 2019-08-08 2022-03-08 安徽安利材料科技股份有限公司 一种毛刷式高耐用化学机械抛光聚氨酯材料及其制备方法
CN110977756B (zh) * 2019-12-27 2021-09-07 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其应用
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN113214741B (zh) * 2021-04-24 2022-03-11 深圳市撒比斯科技有限公司 一种高稳定的cmp抛光液

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JPH05283515A (ja) 1992-03-31 1993-10-29 Nec Kansai Ltd 半導体装置製造方法
JP3055471B2 (ja) 1996-10-03 2000-06-26 日本電気株式会社 半導体基板の製造方法及びその製造装置
JPH11277408A (ja) 1998-01-29 1999-10-12 Shin Etsu Handotai Co Ltd 半導体ウエーハの鏡面研磨用研磨布、鏡面研磨方法ならびに鏡面研磨装置
GB2334205B (en) 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
KR100685010B1 (ko) 1999-08-31 2007-02-20 신에쯔 한도타이 가부시키가이샤 반도체 웨이퍼용 연마포 및 연마방법
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JP2002292556A (ja) 2001-03-29 2002-10-08 Sumitomo Osaka Cement Co Ltd シリコンウエハ鏡面研磨用スラリー、砥石、パッド及び研磨液、並びにこれらを用いたシリコンウエハの鏡面研磨方法
JP2003037089A (ja) * 2001-07-26 2003-02-07 Shin Etsu Handotai Co Ltd ウェーハの研磨方法
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JP5019417B2 (ja) * 2006-06-22 2012-09-05 東洋ゴム工業株式会社 研磨パッドの製造方法及び研磨パッド
US7371160B1 (en) * 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
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JP4986129B2 (ja) * 2007-01-15 2012-07-25 東洋ゴム工業株式会社 研磨パッド
JP5297096B2 (ja) 2007-10-03 2013-09-25 富士紡ホールディングス株式会社 研磨布
JP5484145B2 (ja) * 2010-03-24 2014-05-07 東洋ゴム工業株式会社 研磨パッド
JP5534907B2 (ja) * 2010-03-31 2014-07-02 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
CN102310366B (zh) * 2010-07-08 2014-03-05 罗门哈斯电子材料Cmp控股股份有限公司 具有低缺陷整体窗的化学机械抛光垫
US20120264303A1 (en) 2011-04-15 2012-10-18 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing slurry, system and method
CN103648718A (zh) * 2011-07-15 2014-03-19 东丽株式会社 研磨垫
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad

Also Published As

Publication number Publication date
CN104551977A (zh) 2015-04-29
CN104551977B (zh) 2018-01-09
JP6463618B2 (ja) 2019-02-06
DE102014015664A1 (de) 2015-04-30
JP2015109437A (ja) 2015-06-11
TW201535496A (zh) 2015-09-16
US8980749B1 (en) 2015-03-17
KR102359116B1 (ko) 2022-02-08
KR20150047444A (ko) 2015-05-04
MY172804A (en) 2019-12-12
TWI621166B (zh) 2018-04-11

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