SG101933A1 - System and method for the real time determination of the in situ emissivity of a workplace during processing - Google Patents
System and method for the real time determination of the in situ emissivity of a workplace during processingInfo
- Publication number
- SG101933A1 SG101933A1 SG200001799A SG200001799A SG101933A1 SG 101933 A1 SG101933 A1 SG 101933A1 SG 200001799 A SG200001799 A SG 200001799A SG 200001799 A SG200001799 A SG 200001799A SG 101933 A1 SG101933 A1 SG 101933A1
- Authority
- SG
- Singapore
- Prior art keywords
- real time
- during processing
- time determination
- workplace during
- emissivity
- Prior art date
Links
- 238000011065 in-situ storage Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D43/00—Lids or covers for rigid or semi-rigid containers
- B65D43/02—Removable lids or covers
- B65D43/0202—Removable lids or covers without integral tamper element
- B65D43/0204—Removable lids or covers without integral tamper element secured by snapping over beads or projections
- B65D43/021—Removable lids or covers without integral tamper element secured by snapping over beads or projections only on the inside, or a part turned to the inside, of the mouth
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/50—Containers, packaging elements or packages, specially adapted for particular articles or materials for living organisms, articles or materials sensitive to changes of environment or atmospheric conditions, e.g. land animals, birds, fish, water plants, non-aquatic plants, flower bulbs, cut flowers or foliage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Zoology (AREA)
- Evolutionary Biology (AREA)
- Toxicology (AREA)
- Marine Sciences & Fisheries (AREA)
- Radiation Pyrometers (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/280,308 US6183127B1 (en) | 1999-03-29 | 1999-03-29 | System and method for the real time determination of the in situ emissivity of a workpiece during processing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG101933A1 true SG101933A1 (en) | 2004-02-27 |
Family
ID=23072533
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200105019A SG109461A1 (en) | 1999-03-29 | 2000-03-28 | System and method for determining stray light in a thermal processing system |
SG200001799A SG101933A1 (en) | 1999-03-29 | 2000-03-28 | System and method for the real time determination of the in situ emissivity of a workplace during processing |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200105019A SG109461A1 (en) | 1999-03-29 | 2000-03-28 | System and method for determining stray light in a thermal processing system |
Country Status (8)
Country | Link |
---|---|
US (2) | US6183127B1 (nl) |
EP (1) | EP1041619B1 (nl) |
JP (1) | JP4736007B2 (nl) |
KR (1) | KR100483903B1 (nl) |
CN (1) | CN1311226C (nl) |
DE (1) | DE60040253D1 (nl) |
SG (2) | SG109461A1 (nl) |
TW (1) | TW452910B (nl) |
Families Citing this family (41)
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---|---|---|---|---|
US6561694B1 (en) * | 1998-07-28 | 2003-05-13 | Steag Rtp Systems Gmbh | Method and device for calibrating measurements of temperatures independent of emissivity |
US6461036B1 (en) * | 1999-03-29 | 2002-10-08 | Axcelis Technologies, Inc. | System and method for determining stray light in a thermal processing system |
AU3455300A (en) * | 1999-03-30 | 2000-10-16 | Tokyo Electron Limited | Temperature measuring system |
US6303411B1 (en) * | 1999-05-03 | 2001-10-16 | Vortek Industries Ltd. | Spatially resolved temperature measurement and irradiance control |
US6594446B2 (en) * | 2000-12-04 | 2003-07-15 | Vortek Industries Ltd. | Heat-treating methods and systems |
US6840671B2 (en) | 2001-04-09 | 2005-01-11 | William R. Barron, Jr. | System and method for non-contact temperature sensing |
US20060190211A1 (en) * | 2001-07-23 | 2006-08-24 | Schietinger Charles W | In-situ wafer parameter measurement method employing a hot susceptor as radiation source for reflectance measurement |
US20030036877A1 (en) * | 2001-07-23 | 2003-02-20 | Schietinger Charles W. | In-situ wafer parameter measurement method employing a hot susceptor as a reflected light source |
US6753506B2 (en) | 2001-08-23 | 2004-06-22 | Axcelis Technologies | System and method of fast ambient switching for rapid thermal processing |
AU2002341370A1 (en) * | 2001-10-15 | 2003-04-28 | Bezalel Urban | Fire hazard prevention system |
KR101067902B1 (ko) * | 2001-12-26 | 2011-09-27 | 맷슨 테크날러지 캐나다 인코퍼레이티드 | 온도 측정 및 열처리 방법과 시스템 |
JP2004020337A (ja) * | 2002-06-14 | 2004-01-22 | Komatsu Ltd | 温度測定装置 |
US6695886B1 (en) | 2002-08-22 | 2004-02-24 | Axcelis Technologies, Inc. | Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of RTP tool |
US6768084B2 (en) | 2002-09-30 | 2004-07-27 | Axcelis Technologies, Inc. | Advanced rapid thermal processing (RTP) using a linearly-moving heating assembly with an axisymmetric and radially-tunable thermal radiation profile |
KR100512005B1 (ko) * | 2002-11-28 | 2005-09-02 | 삼성전자주식회사 | 이온주입된 웨이퍼의 오염 탐지 방법 및 장치 |
US9627244B2 (en) | 2002-12-20 | 2017-04-18 | Mattson Technology, Inc. | Methods and systems for supporting a workpiece and for heat-treating the workpiece |
US6971793B2 (en) * | 2003-03-21 | 2005-12-06 | Asm Assembly Automation Ltd. | Test handler temperature monitoring system |
JP4618705B2 (ja) * | 2003-09-18 | 2011-01-26 | 大日本スクリーン製造株式会社 | 熱処理装置 |
US20080090309A1 (en) * | 2003-10-27 | 2008-04-17 | Ranish Joseph M | Controlled annealing method |
US7127367B2 (en) | 2003-10-27 | 2006-10-24 | Applied Materials, Inc. | Tailored temperature uniformity |
US8536492B2 (en) * | 2003-10-27 | 2013-09-17 | Applied Materials, Inc. | Processing multilayer semiconductors with multiple heat sources |
US6855916B1 (en) | 2003-12-10 | 2005-02-15 | Axcelis Technologies, Inc. | Wafer temperature trajectory control method for high temperature ramp rate applications using dynamic predictive thermal modeling |
JP5630935B2 (ja) * | 2003-12-19 | 2014-11-26 | マトソン テクノロジー、インコーポレイテッド | 工作物の熱誘起運動を抑制する機器及び装置 |
TWI255921B (en) * | 2004-03-26 | 2006-06-01 | Terry B J Kuo | Biochip analyzing system and method thereof |
US20050275880A1 (en) * | 2004-06-09 | 2005-12-15 | Roland Korst | Apparatus and method for controlling and managing an RFID printer system |
JP2006005148A (ja) * | 2004-06-17 | 2006-01-05 | Sharp Corp | 半導体薄膜の製造方法および製造装置 |
US7205231B2 (en) * | 2004-10-29 | 2007-04-17 | Axcelis Technologies, Inc. | Method for in-situ uniformity optimization in a rapid thermal processing system |
US7275861B2 (en) * | 2005-01-31 | 2007-10-02 | Veeco Instruments Inc. | Calibration wafer and method of calibrating in situ temperatures |
JP5967859B2 (ja) * | 2006-11-15 | 2016-08-10 | マトソン テクノロジー、インコーポレイテッド | 熱処理中の被加工物を支持するシステムおよび方法 |
US8222574B2 (en) * | 2007-01-15 | 2012-07-17 | Applied Materials, Inc. | Temperature measurement and control of wafer support in thermal processing chamber |
JP4263761B1 (ja) * | 2008-01-17 | 2009-05-13 | トヨタ自動車株式会社 | 減圧式加熱装置とその加熱方法および電子製品の製造方法 |
JP5718809B2 (ja) | 2008-05-16 | 2015-05-13 | マトソン テクノロジー、インコーポレイテッド | 加工品の破壊を防止する方法および装置 |
US8111978B2 (en) * | 2008-07-11 | 2012-02-07 | Applied Materials, Inc. | Rapid thermal processing chamber with shower head |
WO2012009636A1 (en) * | 2010-07-15 | 2012-01-19 | Despatch Industries Limited Partnership | Firing furnace configuration for thermal processing system |
DE102011116243B4 (de) * | 2011-10-17 | 2014-04-17 | Centrotherm Photovoltaics Ag | Vorrichtung zum Bestimmen der Temperatur eines Substrats |
TWI628730B (zh) * | 2011-11-10 | 2018-07-01 | 應用材料股份有限公司 | 透過雷射繞射測量3d半導體結構之溫度的設備及方法 |
CN103898449B (zh) * | 2012-12-27 | 2017-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 用于调节托盘温度的腔室及半导体加工设备 |
CN104726837B (zh) * | 2013-12-18 | 2018-05-25 | 北京北方华创微电子装备有限公司 | 反应腔室及等离子体加工设备 |
JP6295674B2 (ja) * | 2014-01-20 | 2018-03-20 | ウシオ電機株式会社 | 熱処理装置およびランプ制御方法 |
JP6164097B2 (ja) * | 2014-01-20 | 2017-07-19 | ウシオ電機株式会社 | 熱処理装置 |
CN114927395B (zh) * | 2022-04-24 | 2023-05-19 | 电子科技大学 | 一种实时控制NEA GaN电子源反射率的方法 |
Family Cites Families (35)
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US584110A (en) * | 1897-06-08 | Charles h | ||
US4120582A (en) | 1976-10-27 | 1978-10-17 | Donnelly Mirrors, Inc. | Light reflectivity and transmission testing apparatus and method |
JPS6154184A (ja) * | 1984-08-22 | 1986-03-18 | 株式会社チノー | 加熱処理装置 |
US4647774A (en) | 1985-03-04 | 1987-03-03 | Quantum Logic Corporation | Pyrometer #2 |
US4647775A (en) | 1985-03-04 | 1987-03-03 | Quantum Logic Corporation | Pyrometer 1 |
DD254114A3 (de) | 1985-07-30 | 1988-02-17 | Univ Dresden Tech | Pyrometrisches messverfahren |
US4708493A (en) | 1986-05-19 | 1987-11-24 | Quantum Logic Corporation | Apparatus for remote measurement of temperatures |
US4919542A (en) | 1988-04-27 | 1990-04-24 | Ag Processing Technologies, Inc. | Emissivity correction apparatus and method |
US4956538A (en) | 1988-09-09 | 1990-09-11 | Texas Instruments, Incorporated | Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors |
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DE19513749B4 (de) * | 1995-04-11 | 2004-07-01 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Bestimmung des Emissionsfaktors von Halbleitermaterialien durch Bestrahlung mit elektromagnetischen Wellen |
US5830277A (en) * | 1995-05-26 | 1998-11-03 | Mattson Technology, Inc. | Thermal processing system with supplemental resistive heater and shielded optical pyrometry |
US5597237A (en) | 1995-05-30 | 1997-01-28 | Quantum Logic Corp | Apparatus for measuring the emissivity of a semiconductor wafer |
US5704712A (en) | 1996-01-18 | 1998-01-06 | Quantum Logic Corporation | Method for remotely measuring temperatures which utilizes a two wavelength radiometer and a computer |
US5938335A (en) * | 1996-04-08 | 1999-08-17 | Applied Materials, Inc. | Self-calibrating temperature probe |
US5937142A (en) * | 1996-07-11 | 1999-08-10 | Cvc Products, Inc. | Multi-zone illuminator for rapid thermal processing |
KR100234366B1 (ko) * | 1997-01-30 | 1999-12-15 | 윤종용 | 급속 열 처리 설비의 웨이퍼 온도 측정장치 및 이를 이용한 온도측정방법 |
DE19737802A1 (de) * | 1997-08-29 | 1999-03-11 | Steag Ast Elektronik Gmbh | Verfahren und Vorrichtung zum thermischen Behandeln von Substraten |
US6056434A (en) * | 1998-03-12 | 2000-05-02 | Steag Rtp Systems, Inc. | Apparatus and method for determining the temperature of objects in thermal processing chambers |
-
1999
- 1999-03-29 US US09/280,308 patent/US6183127B1/en not_active Expired - Fee Related
-
2000
- 2000-03-22 TW TW089105222A patent/TW452910B/zh not_active IP Right Cessation
- 2000-03-28 DE DE60040253T patent/DE60040253D1/de not_active Expired - Lifetime
- 2000-03-28 SG SG200105019A patent/SG109461A1/en unknown
- 2000-03-28 EP EP00302508A patent/EP1041619B1/en not_active Expired - Lifetime
- 2000-03-28 SG SG200001799A patent/SG101933A1/en unknown
- 2000-03-29 JP JP2000091502A patent/JP4736007B2/ja not_active Expired - Fee Related
- 2000-03-29 CN CNB001179519A patent/CN1311226C/zh not_active Expired - Fee Related
- 2000-03-29 KR KR10-2000-0016099A patent/KR100483903B1/ko not_active IP Right Cessation
- 2000-11-13 US US09/711,646 patent/US6375348B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP4736007B2 (ja) | 2011-07-27 |
US6375348B1 (en) | 2002-04-23 |
EP1041619A2 (en) | 2000-10-04 |
US6183127B1 (en) | 2001-02-06 |
EP1041619A3 (en) | 2003-01-15 |
KR100483903B1 (ko) | 2005-04-15 |
TW452910B (en) | 2001-09-01 |
CN1272556A (zh) | 2000-11-08 |
SG109461A1 (en) | 2005-03-30 |
KR20000071502A (ko) | 2000-11-25 |
DE60040253D1 (de) | 2008-10-30 |
CN1311226C (zh) | 2007-04-18 |
EP1041619B1 (en) | 2008-09-17 |
JP2000323544A (ja) | 2000-11-24 |
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