SE9901866L - - Google Patents

Info

Publication number
SE9901866L
SE9901866L SE9901866A SE9901866A SE9901866L SE 9901866 L SE9901866 L SE 9901866L SE 9901866 A SE9901866 A SE 9901866A SE 9901866 A SE9901866 A SE 9901866A SE 9901866 L SE9901866 L SE 9901866L
Authority
SE
Sweden
Application number
SE9901866A
Other versions
SE9901866A0 (en
SE9901866D0 (sv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication of SE9901866L publication Critical patent/SE9901866L/xx
Application filed filed Critical
Priority to SE9901866A priority Critical patent/SE9901866A0/sv
Publication of SE9901866D0 publication Critical patent/SE9901866D0/xx
Priority to KR1020017014744A priority patent/KR100770100B1/ko
Priority to US09/979,148 priority patent/US6883158B1/en
Priority to PCT/SE2000/001030 priority patent/WO2000072090A2/en
Priority to AU52612/00A priority patent/AU5261200A/en
Priority to JP2000620420A priority patent/JP2003500847A/ja
Priority to CNB008078327A priority patent/CN1196031C/zh
Publication of SE9901866A0 publication Critical patent/SE9901866A0/sv
Priority to US10/827,530 priority patent/US7444616B2/en
Priority to US10/987,589 priority patent/US7328425B2/en
Priority to US12/232,742 priority patent/US20090104549A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/001—Phase modulating patterns, e.g. refractive index patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G03F7/70504—Optical system modelling, e.g. lens heating models
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706839—Modelling, e.g. modelling scattering or solving inverse problems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G03F1/144—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
SE9901866A 1999-01-18 1999-05-20 A method for error reduction in lithography SE9901866A0 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE9901866A SE9901866A0 (en) 1999-01-18 1999-05-20 A method for error reduction in lithography
CNB008078327A CN1196031C (zh) 1999-05-20 2000-05-22 在平版印刷中用于减少误差的方法
JP2000620420A JP2003500847A (ja) 1999-05-20 2000-05-22 リソグラフィに於ける誤差低減方法
PCT/SE2000/001030 WO2000072090A2 (en) 1999-05-20 2000-05-22 A method for error reduction in lithography
US09/979,148 US6883158B1 (en) 1999-05-20 2000-05-22 Method for error reduction in lithography
KR1020017014744A KR100770100B1 (ko) 1999-01-18 2000-05-22 리소그래피에서 에러 감소를 위한 방법
AU52612/00A AU5261200A (en) 1999-05-20 2000-05-22 A method for error reduction in lithography
US10/827,530 US7444616B2 (en) 1999-05-20 2004-04-20 Method for error reduction in lithography
US10/987,589 US7328425B2 (en) 1999-05-20 2004-11-12 Method and device for correcting SLM stamp image imperfections
US12/232,742 US20090104549A1 (en) 1999-05-20 2008-09-23 Method for error reduction in lithography

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9900114A SE517345C2 (sv) 1999-01-18 1999-01-18 Metod och system för tillverkande av stora skärmpaneler med förbättrad precision
SE9901866A SE9901866A0 (en) 1999-01-18 1999-05-20 A method for error reduction in lithography

Publications (3)

Publication Number Publication Date
SE9901866L true SE9901866L (ko)
SE9901866D0 SE9901866D0 (sv) 1999-05-20
SE9901866A0 SE9901866A0 (en) 2000-07-19

Family

ID=20414113

Family Applications (2)

Application Number Title Priority Date Filing Date
SE9900114A SE517345C2 (sv) 1999-01-18 1999-01-18 Metod och system för tillverkande av stora skärmpaneler med förbättrad precision
SE9901866A SE9901866A0 (en) 1999-01-18 1999-05-20 A method for error reduction in lithography

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SE9900114A SE517345C2 (sv) 1999-01-18 1999-01-18 Metod och system för tillverkande av stora skärmpaneler med förbättrad precision

Country Status (6)

Country Link
US (1) US6844123B1 (ko)
JP (1) JP2002535710A (ko)
KR (2) KR100710970B1 (ko)
AU (1) AU2338200A (ko)
SE (2) SE517345C2 (ko)
WO (1) WO2000042630A1 (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7444616B2 (en) * 1999-05-20 2008-10-28 Micronic Laser Systems Ab Method for error reduction in lithography
JP3572053B2 (ja) * 2001-05-31 2004-09-29 株式会社東芝 露光マスクの製造方法、マスク基板情報生成方法、半導体装置の製造方法およびサーバー
SE0104131D0 (sv) * 2001-12-10 2001-12-10 Micronic Laser Systems Ab Improved method and apparatus for image formation
SE0200547D0 (sv) * 2002-02-25 2002-02-25 Micronic Laser Systems Ab An image forming method and apparatus
US7588869B2 (en) * 2003-12-30 2009-09-15 Lg Display Co., Ltd. Divided exposure method for making a liquid crystal display
WO2006021406A2 (en) * 2004-08-23 2006-03-02 Micronic Laser Systems Ab Pupil improvement of incoherent imaging systems for enhanced cd linearity
US7221434B2 (en) * 2005-03-01 2007-05-22 Canon Kabushiki Kaisha Exposure method and apparatus
KR100674964B1 (ko) * 2005-03-14 2007-01-26 삼성전자주식회사 포토마스크 교정 방법 및 시스템 장치
JP4336671B2 (ja) * 2005-07-15 2009-09-30 キヤノン株式会社 露光パラメータの決定をコンピュータに実行させるプログラム、露光パラメータを決定する決定方法、露光方法及びデバイス製造方法。
JP2009175276A (ja) * 2008-01-22 2009-08-06 Toshiba Corp フォトマスク作製方法、フォトマスク作製システムおよび半導体デバイス
US20090199152A1 (en) * 2008-02-06 2009-08-06 Micronic Laser Systems Ab Methods and apparatuses for reducing mura effects in generated patterns
US8725477B2 (en) 2008-04-10 2014-05-13 Schlumberger Technology Corporation Method to generate numerical pseudocores using borehole images, digital rock samples, and multi-point statistics
EP2263107A4 (en) * 2008-04-10 2016-12-28 Services Petroliers Schlumberger METHOD FOR CHARACTERIZING A GEOLOGICAL FORMATION THROUGH A DRILLING OXYGEN
US8311788B2 (en) 2009-07-01 2012-11-13 Schlumberger Technology Corporation Method to quantify discrete pore shapes, volumes, and surface areas using confocal profilometry
US10996573B2 (en) * 2017-01-31 2021-05-04 Asml Netherlands B.V. Method and system for increasing accuracy of pattern positioning
JP6963967B2 (ja) * 2017-10-30 2021-11-10 Hoya株式会社 パターン描画方法、フォトマスクの製造方法、及び表示装置用デバイスの製造方法
CA3147927C (en) 2019-08-14 2023-01-24 Ceramic Data Solutions GmbH Method for long-term storage of information and storage medium therefor
KR20230034237A (ko) 2020-07-03 2023-03-09 세라믹 데이터 솔루션즈 게엠베하 멀티-비트 코딩에 의해 저장 밀도가 증가된 정보 저장 방법 및 정보 저장 매체
AU2020456046B2 (en) 2020-07-03 2024-01-25 Ceramic Data Solutions GmbH Increased storage capacity for a method for long-term storage of information and storage medium therefor
EP3955248A1 (en) * 2020-08-11 2022-02-16 Christian Pflaum Data recording on ceramic material
WO2022194354A1 (en) 2021-03-16 2022-09-22 Ceramic Data Solutions GmbH Data carrier, reading method and system utilizing super resolution techniques
US20230305385A1 (en) * 2022-03-25 2023-09-28 Photronics, Inc. System, method and program product for photomask surface treatment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6474547A (en) * 1987-09-14 1989-03-20 Motorola Inc Manufacture of semiconductor for compensating strain between pattern on semiconductor body and mask for obtaining pattern
DE4022732A1 (de) 1990-07-17 1992-02-20 Micronic Laser Systems Ab Auf einem lichtempfindlich beschichteten substrat durch fokussierte laserstrahlung hergestellte struktur sowie verfahren und vorrichtung zu ihrer herstellung
JPH08297692A (ja) * 1994-09-16 1996-11-12 Mitsubishi Electric Corp 光近接補正装置及び方法並びにパタン形成方法
AU6601996A (en) * 1995-07-31 1997-02-26 Lsi Logic Corporation Lithography systems employing programmable reticles
JP2000066367A (ja) * 1998-08-21 2000-03-03 Sony Corp フォトマスクおよびレジストパターン形成方法

Also Published As

Publication number Publication date
SE9900114L (sv) 2000-07-19
SE517345C2 (sv) 2002-05-28
SE9901866A0 (en) 2000-07-19
AU2338200A (en) 2000-08-01
WO2000042630A1 (en) 2000-07-20
KR20010101570A (ko) 2001-11-14
SE9901866D0 (sv) 1999-05-20
KR100710970B1 (ko) 2007-05-16
KR100770100B1 (ko) 2007-10-24
JP2002535710A (ja) 2002-10-22
SE9900114D0 (sv) 1999-01-18
KR20010112497A (ko) 2001-12-20
US6844123B1 (en) 2005-01-18

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