SE9900525D0 - Spark gap for hermetically packaged integrated circuits - Google Patents

Spark gap for hermetically packaged integrated circuits

Info

Publication number
SE9900525D0
SE9900525D0 SE9900525A SE9900525A SE9900525D0 SE 9900525 D0 SE9900525 D0 SE 9900525D0 SE 9900525 A SE9900525 A SE 9900525A SE 9900525 A SE9900525 A SE 9900525A SE 9900525 D0 SE9900525 D0 SE 9900525D0
Authority
SE
Sweden
Prior art keywords
spark gap
integrated circuits
packaged integrated
hermetically packaged
gap
Prior art date
Application number
SE9900525A
Other languages
English (en)
Other versions
SE9900525A0 (sv
SE9900525L (sv
Inventor
Jonathan Harry Orchard-Webb
Original Assignee
Mitel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of SE9900525L publication Critical patent/SE9900525L/xx
Application filed by Mitel Corp filed Critical Mitel Corp
Publication of SE9900525D0 publication Critical patent/SE9900525D0/sv
Publication of SE9900525A0 publication Critical patent/SE9900525A0/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00—Overvoltage arresters using spark gaps
    • H01T4/08—Overvoltage arresters using spark gaps structurally associated with protected apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Generation Of Surge Voltage And Current (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
SE9900525A 1998-02-20 1999-02-17 Gnistgap för hermetiskt inpackade integrerade kretsar SE9900525A0 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9803482A GB2334626B (en) 1998-02-20 1998-02-20 Spark gap for hermetically packaged integrated circuits

Publications (3)

Publication Number Publication Date
SE9900525L SE9900525L (sv) 1900-01-01
SE9900525D0 true SE9900525D0 (sv) 1999-02-17
SE9900525A0 SE9900525A0 (sv) 1999-08-21

Family

ID=10827232

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9900525A SE9900525A0 (sv) 1998-02-20 1999-02-17 Gnistgap för hermetiskt inpackade integrerade kretsar

Country Status (6)

Country Link
US (1) US6355958B1 (sv)
CA (1) CA2262043A1 (sv)
DE (1) DE19906856A1 (sv)
FR (1) FR2776127B1 (sv)
GB (1) GB2334626B (sv)
SE (1) SE9900525A0 (sv)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7508644B2 (en) * 2004-06-30 2009-03-24 Research In Motion Limited Spark gap apparatus and method for electrostatic discharge protection
US7161784B2 (en) * 2004-06-30 2007-01-09 Research In Motion Limited Spark gap apparatus and method for electrostatic discharge protection
FR2879348A1 (fr) * 2004-12-14 2006-06-16 St Microelectronics Sa Protection d'un condensateur integre
US7349189B2 (en) * 2005-05-06 2008-03-25 Finisar Corporation Electrical surge protection using in-package gas discharge system
DE102005022665A1 (de) * 2005-05-17 2006-11-23 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
TWI283381B (en) * 2006-05-26 2007-07-01 Au Optronics Corp Active device array substrate
US7948726B2 (en) * 2008-09-25 2011-05-24 Panasonic Automotive Systems Company Of America, Division Of Panasonic Corporation Of North America Electrostatic discharge (ESD) protection circuit and method
GB2487338B (en) * 2009-12-23 2014-10-22 Skyworks Solutions Inc Surface mount spark gap
US9281683B1 (en) * 2015-02-25 2016-03-08 La-Z-Boy Incorporated Electrostatic discharge protection and method in power supply
US11477881B2 (en) * 2019-06-26 2022-10-18 Sandisk Technologies Llc Spark gap electrostatic discharge (ESD) protection for memory cards

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676742A (en) * 1971-05-24 1972-07-11 Signetics Corp Means including a spark gap for protecting an integrated circuit from electrical discharge
DE2508183A1 (de) 1975-02-26 1976-09-16 Bosch Gmbh Robert Funkenstrecke
JPS55126983A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Discharge gap
US4295176A (en) * 1979-09-04 1981-10-13 Bell Telephone Laboratories, Incorporated Semiconductor integrated circuit protection arrangement
JPS5830297U (ja) * 1981-08-25 1983-02-26 株式会社村田製作所 チツプ形放電素子
US4586105A (en) * 1985-08-02 1986-04-29 General Motors Corporation High voltage protection device with a tape covered spark gap
US4794437A (en) * 1986-08-11 1988-12-27 General Electric Company ARC gap for integrated circuits
US4809044A (en) * 1986-08-22 1989-02-28 Energy Conversion Devices, Inc. Thin film overvoltage protection devices
DE3829650A1 (de) 1988-09-01 1990-03-15 Telefunken Systemtechnik Kombinierte loeschfunkenstrecke
US5436183A (en) * 1990-04-17 1995-07-25 National Semiconductor Corporation Electrostatic discharge protection transistor element fabrication process
US5357397A (en) * 1993-03-15 1994-10-18 Hewlett-Packard Company Electric field emitter device for electrostatic discharge protection of integrated circuits
JPH07122568A (ja) 1993-10-25 1995-05-12 Omron Corp 半導体装置及びその製造方法
CA2115477A1 (en) * 1994-02-11 1995-08-12 Jonathan H. Orchard-Webb Esd input protection arrangement
FR2717308B1 (fr) * 1994-03-14 1996-07-26 Sgs Thomson Microelectronics Dispositif de protection contre des surtensions dans des circuits intégrés.
US5610790A (en) * 1995-01-20 1997-03-11 Xilinx, Inc. Method and structure for providing ESD protection for silicon on insulator integrated circuits
DE19601650A1 (de) 1996-01-18 1997-07-24 Telefunken Microelectron Anordnung zum Schutz elektrischer und elektronischer Bauelemente vor elektrostatischen Entladungen
US5933307A (en) * 1996-02-16 1999-08-03 Thomson Consumer Electronics, Inc. Printed circuit board sparkgap
US5992326A (en) * 1997-01-06 1999-11-30 The Ensign-Bickford Company Voltage-protected semiconductor bridge igniter elements
GB2335084B (en) * 1998-02-21 2003-04-02 Mitel Corp Spark gap for high voltage integrated circuit electrostatic discharge protection
US6245600B1 (en) * 1999-07-01 2001-06-12 International Business Machines Corporation Method and structure for SOI wafers to avoid electrostatic discharge

Also Published As

Publication number Publication date
FR2776127A1 (fr) 1999-09-17
FR2776127B1 (fr) 2001-10-19
SE9900525A0 (sv) 1999-08-21
GB2334626B (en) 2003-01-29
GB9803482D0 (en) 1998-04-15
CA2262043A1 (en) 1999-08-20
DE19906856A1 (de) 1999-09-02
SE9900525L (sv) 1900-01-01
GB2334626A (en) 1999-08-25
US6355958B1 (en) 2002-03-12

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