SE9801793L - Integrerad mikrovåghybridströmkrets - Google Patents

Integrerad mikrovåghybridströmkrets

Info

Publication number
SE9801793L
SE9801793L SE9801793A SE9801793A SE9801793L SE 9801793 L SE9801793 L SE 9801793L SE 9801793 A SE9801793 A SE 9801793A SE 9801793 A SE9801793 A SE 9801793A SE 9801793 L SE9801793 L SE 9801793L
Authority
SE
Sweden
Prior art keywords
pct
recess
chip
date
microwave hybrid
Prior art date
Application number
SE9801793A
Other languages
English (en)
Other versions
SE522049C2 (sv
SE9801793D0 (sv
Inventor
Viktor Anatolievich Iovdalsky
Eduard Volfovich Aizenberg
Vladimir Iliich Beil
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SE9801793D0 publication Critical patent/SE9801793D0/sv
Publication of SE9801793L publication Critical patent/SE9801793L/sv
Publication of SE522049C2 publication Critical patent/SE522049C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
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    • H01L2224/4805—Shape
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    • H01L2224/48091—Arched
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48101—Connecting bonding areas at the same height, e.g. horizontal bond
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01022—Titanium [Ti]
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    • H01L2924/01028—Nickel [Ni]
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    • H01L2924/01047—Silver [Ag]
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
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    • H01L2924/30107—Inductance
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Credit Cards Or The Like (AREA)
SE9801793A 1996-09-26 1998-05-20 Integrerad mikrovåghybridströmkrets SE522049C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1996/000276 WO1998013874A1 (fr) 1996-09-26 1996-09-26 Circuit integre hybride, de grande puissance et a frequences micro-ondes

Publications (3)

Publication Number Publication Date
SE9801793D0 SE9801793D0 (sv) 1998-05-20
SE9801793L true SE9801793L (sv) 1998-05-20
SE522049C2 SE522049C2 (sv) 2004-01-07

Family

ID=20130039

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9801793A SE522049C2 (sv) 1996-09-26 1998-05-20 Integrerad mikrovåghybridströmkrets

Country Status (6)

Country Link
US (1) US6057599A (sv)
JP (1) JP3354575B2 (sv)
KR (1) KR100420792B1 (sv)
RU (1) RU2148872C1 (sv)
SE (1) SE522049C2 (sv)
WO (1) WO1998013874A1 (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030062610A1 (en) * 2001-09-28 2003-04-03 Kovacs Alan L. Multilayer thin film hydrogen getter
KR100547709B1 (ko) * 2003-07-07 2006-01-31 삼성전자주식회사 자기 치유 파장분할다중방식 수동형 광 가입자망
DE102008026765A1 (de) 2008-04-16 2009-10-22 Rohde & Schwarz Gmbh & Co. Kg Mikrowellen-Baugruppe
RU2659752C1 (ru) * 2017-05-22 2018-07-03 Андрей Александрович Григорьев Мощная гибридная интегральная схема свч-диапазона
CN111586964A (zh) * 2020-05-25 2020-08-25 上海航天电子通讯设备研究所 基于lcp基板的高密度高频微波组件制备方法及微波组件
RU2750860C1 (ru) * 2020-09-21 2021-07-05 Акционерное общество "Научно-производственное предприятие "Исток" имени А.И. Шокина" (АО "НПП "Исток" им. Шокина") Гибридная интегральная схема свч-диапазона

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131863U (sv) * 1973-03-10 1974-11-13
DE3501710A1 (de) * 1985-01-19 1986-07-24 Allied Corp., Morristown, N.J. Leiterplatte mit integralen positioniermitteln
US4975065A (en) * 1989-09-26 1990-12-04 Avantek, Inc. Microwave circuit module connector
DE4115043A1 (de) * 1991-05-08 1997-07-17 Gen Electric Dichtgepackte Verbindungsstruktur, die eine Kammer enthält
US5073814A (en) * 1990-07-02 1991-12-17 General Electric Company Multi-sublayer dielectric layers
US5559363A (en) * 1995-06-06 1996-09-24 Martin Marietta Corporation Off-chip impedance matching utilizing a dielectric element and high density interconnect technology

Also Published As

Publication number Publication date
KR100420792B1 (ko) 2004-05-31
SE522049C2 (sv) 2004-01-07
US6057599A (en) 2000-05-02
RU2148872C1 (ru) 2000-05-10
SE9801793D0 (sv) 1998-05-20
JP3354575B2 (ja) 2002-12-09
WO1998013874A1 (fr) 1998-04-02
JP2000503482A (ja) 2000-03-21
KR19990071662A (ko) 1999-09-27

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