SE9403575D0 - Benram för kapslad optokomponent - Google Patents

Benram för kapslad optokomponent

Info

Publication number
SE9403575D0
SE9403575D0 SE9403575A SE9403575A SE9403575D0 SE 9403575 D0 SE9403575 D0 SE 9403575D0 SE 9403575 A SE9403575 A SE 9403575A SE 9403575 A SE9403575 A SE 9403575A SE 9403575 D0 SE9403575 D0 SE 9403575D0
Authority
SE
Sweden
Prior art keywords
optocomponent
leadframe
flag
portions
mold
Prior art date
Application number
SE9403575A
Other languages
English (en)
Other versions
SE9403575L (sv
Inventor
Odd Steijer
Paul Eriksen
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9403575A priority Critical patent/SE9403575L/sv
Publication of SE9403575D0 publication Critical patent/SE9403575D0/sv
Priority to AU38201/95A priority patent/AU3820195A/en
Priority to US08/817,421 priority patent/US6072229A/en
Priority to CNB951966766A priority patent/CN1149670C/zh
Priority to DE69520073T priority patent/DE69520073T2/de
Priority to JP51383196A priority patent/JP3703839B2/ja
Priority to PCT/SE1995/001234 priority patent/WO1996013065A1/en
Priority to KR1019970702590A priority patent/KR100265478B1/ko
Priority to CA002203113A priority patent/CA2203113C/en
Priority to ES95936161T priority patent/ES2153903T3/es
Priority to EP95936161A priority patent/EP0792521B1/en
Publication of SE9403575L publication Critical patent/SE9403575L/sv
Priority to FI971658A priority patent/FI971658A/sv
Priority to US09/573,820 priority patent/US6338983B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)
SE9403575A 1994-10-19 1994-10-19 Benram för kapslad optokomponent SE9403575L (sv)

Priority Applications (13)

Application Number Priority Date Filing Date Title
SE9403575A SE9403575L (sv) 1994-10-19 1994-10-19 Benram för kapslad optokomponent
EP95936161A EP0792521B1 (en) 1994-10-19 1995-10-19 Method for encapsulating an optocompnent using a leadframe adapted therefore
PCT/SE1995/001234 WO1996013065A1 (en) 1994-10-19 1995-10-19 Leadframe for an encapsulated optocomponent
US08/817,421 US6072229A (en) 1994-10-19 1995-10-19 Leadframe for an encapsulated optocomponent
CNB951966766A CN1149670C (zh) 1994-10-19 1995-10-19 密封光学元件的引线框架
DE69520073T DE69520073T2 (de) 1994-10-19 1995-10-19 Verfahren zur Einkapselung eines optischen Bauelements unter Verwendung eines dafür angepassten Leiterrrahmens
JP51383196A JP3703839B2 (ja) 1994-10-19 1995-10-19 封止された光部品用のリードフレーム
AU38201/95A AU3820195A (en) 1994-10-19 1995-10-19 Leadframe for an encapsulated optocomponent
KR1019970702590A KR100265478B1 (ko) 1994-10-19 1995-10-19 캡슐화된 광소자용 리드프레임
CA002203113A CA2203113C (en) 1994-10-19 1995-10-19 Leadframe for an encapsulated optocomponent
ES95936161T ES2153903T3 (es) 1994-10-19 1995-10-19 Metodo para encapsular un optocomponente utilizando un cuadro de conductores impresos adaptado para este fin.
FI971658A FI971658A (sv) 1994-10-19 1997-04-18 Ledningshållare för inkapslad optokomponent
US09/573,820 US6338983B1 (en) 1994-10-19 2000-05-18 Leadframe for an encapsulated optocomponent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9403575A SE9403575L (sv) 1994-10-19 1994-10-19 Benram för kapslad optokomponent

Publications (2)

Publication Number Publication Date
SE9403575D0 true SE9403575D0 (sv) 1994-10-19
SE9403575L SE9403575L (sv) 1996-04-20

Family

ID=20395669

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9403575A SE9403575L (sv) 1994-10-19 1994-10-19 Benram för kapslad optokomponent

Country Status (12)

Country Link
US (2) US6072229A (sv)
EP (1) EP0792521B1 (sv)
JP (1) JP3703839B2 (sv)
KR (1) KR100265478B1 (sv)
CN (1) CN1149670C (sv)
AU (1) AU3820195A (sv)
CA (1) CA2203113C (sv)
DE (1) DE69520073T2 (sv)
ES (1) ES2153903T3 (sv)
FI (1) FI971658A (sv)
SE (1) SE9403575L (sv)
WO (1) WO1996013065A1 (sv)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9403575L (sv) 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent
SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
EP0826997B1 (en) * 1996-08-26 2003-07-23 Sumitomo Electric Industries, Ltd. Optoelectronic module and method of manufacturing the same
US6354747B1 (en) 1996-08-26 2002-03-12 Sumitomo Electric Industries, Ltd. Optical module
DE60304390T2 (de) * 2002-05-15 2007-02-01 Tyco Electronics Amp Gmbh Elektronikmodul
US7371616B2 (en) * 2006-01-05 2008-05-13 Fairchild Semiconductor Corporation Clipless and wireless semiconductor die package and method for making the same
JP4740765B2 (ja) * 2006-02-24 2011-08-03 エルピーダメモリ株式会社 半導体装置及びその製造方法
US9008766B2 (en) 2008-06-02 2015-04-14 Physio-Control, Inc. Medical device adjusting operation when used with non-authenticated patient parameter collecting accessory
US7728548B2 (en) * 2008-06-02 2010-06-01 Physio-Control, Inc. Defibrillator battery authentication system
US9916436B2 (en) 2014-10-24 2018-03-13 Physio-Control, Inc. Intelligent accessories for medical devices

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3914786A (en) * 1974-04-19 1975-10-21 Hewlett Packard Co In-line reflective lead-pair for light-emitting diodes
DE3617302A1 (de) 1986-05-23 1987-11-26 Amazonen Werke Dreyer H Schleuderstreuer mit vorratsbehaelter
US4803540A (en) * 1986-11-24 1989-02-07 American Telephone And Telegraph Co., At&T Bell Labs Semiconductor integrated circuit packages
JPS63148670A (ja) * 1986-12-12 1988-06-21 Texas Instr Japan Ltd リ−ドフレ−ム材
US5150193A (en) * 1987-05-27 1992-09-22 Hitachi, Ltd. Resin-encapsulated semiconductor device having a particular mounting structure
JPH0294657A (ja) * 1988-09-30 1990-04-05 Nec Corp リードフレーム
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
EP0446410B1 (en) * 1990-03-13 1999-12-22 Sumitomo Electric Industries, Ltd. Optical module and process of producing the same
EP0452634B1 (en) * 1990-03-16 1997-05-02 Sumitomo Electric Industries, Ltd. Lead frame for semiconductor device
CA2079964C (en) * 1992-01-22 1997-12-16 Mitsutoshi Kamakura Apparatus and method for manufacturing optical module
EP0582992B1 (en) * 1992-08-11 1998-06-03 Sumitomo Electric Industries, Ltd Optical module with improved grounding of an optical element
SE513183C2 (sv) 1994-03-18 2000-07-24 Ericsson Telefon Ab L M Förfarande för framställning av en optokomponent samt kapslad optokomponent
SE9403574L (sv) * 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Optokomponentkapsel med optiskt gränssnitt
SE9403575L (sv) 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent

Also Published As

Publication number Publication date
ES2153903T3 (es) 2001-03-16
US6072229A (en) 2000-06-06
EP0792521B1 (en) 2001-02-07
AU3820195A (en) 1996-05-15
SE9403575L (sv) 1996-04-20
EP0792521A1 (en) 1997-09-03
DE69520073D1 (de) 2001-03-15
CN1149670C (zh) 2004-05-12
CA2203113C (en) 2005-03-22
FI971658A (sv) 1997-06-19
JP3703839B2 (ja) 2005-10-05
CA2203113A1 (en) 1996-05-02
WO1996013065A1 (en) 1996-05-02
JPH10507874A (ja) 1998-07-28
DE69520073T2 (de) 2001-06-13
CN1169208A (zh) 1997-12-31
US6338983B1 (en) 2002-01-15
KR100265478B1 (ko) 2000-09-15
FI971658A0 (sv) 1997-04-18

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