SE8505859L - Forfarande och apparat for metallbeleggning av foremal - Google Patents

Forfarande och apparat for metallbeleggning av foremal

Info

Publication number
SE8505859L
SE8505859L SE8505859A SE8505859A SE8505859L SE 8505859 L SE8505859 L SE 8505859L SE 8505859 A SE8505859 A SE 8505859A SE 8505859 A SE8505859 A SE 8505859A SE 8505859 L SE8505859 L SE 8505859L
Authority
SE
Sweden
Prior art keywords
boards
copper
conveyed
articles
steps
Prior art date
Application number
SE8505859A
Other languages
English (en)
Other versions
SE463625B (sv
SE8505859D0 (sv
Inventor
D L Goffredo
W J Meyer
H Bleising
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of SE8505859D0 publication Critical patent/SE8505859D0/sv
Publication of SE8505859L publication Critical patent/SE8505859L/sv
Publication of SE463625B publication Critical patent/SE463625B/sv

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/85Coating or impregnation with inorganic materials
    • C04B41/88Metals
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/89Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1628Specific elements or parts of the apparatus
    • C23C18/163Supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1632Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
SE8505859A 1985-04-23 1985-12-11 Foerfarande och anordning foer metallbelaeggning paa plana foeremaal, bl a kretskort SE463625B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/726,049 US4576685A (en) 1985-04-23 1985-04-23 Process and apparatus for plating onto articles

Publications (3)

Publication Number Publication Date
SE8505859D0 SE8505859D0 (sv) 1985-12-11
SE8505859L true SE8505859L (sv) 1986-10-24
SE463625B SE463625B (sv) 1990-12-17

Family

ID=24917013

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8505859A SE463625B (sv) 1985-04-23 1985-12-11 Foerfarande och anordning foer metallbelaeggning paa plana foeremaal, bl a kretskort

Country Status (15)

Country Link
US (1) US4576685A (sv)
JP (1) JPS61246372A (sv)
CN (1) CN1015996B (sv)
AT (1) AT395022B (sv)
BE (1) BE903914A (sv)
BG (1) BG60260B2 (sv)
CH (1) CH668270A5 (sv)
DE (1) DE3543286A1 (sv)
FR (1) FR2580671B1 (sv)
GB (1) GB2174107B (sv)
IT (1) IT1215167B (sv)
LU (1) LU86221A1 (sv)
NL (1) NL8503147A (sv)
SE (1) SE463625B (sv)
SU (1) SU1660595A3 (sv)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3631055C1 (de) * 1986-09-12 1987-05-21 Deutsche Automobilgesellsch Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung
DE3632378A1 (de) * 1986-09-24 1988-03-31 Schering Ag Verfahren zum fuehren von plattenfoermigen gegenstaenden, sowie dazugehoerige vorrichtung
US4775449A (en) * 1986-12-29 1988-10-04 General Electric Company Treatment of a polyimide surface to improve the adhesion of metal deposited thereon
DE3703542A1 (de) * 1987-02-06 1988-08-18 Schering Ag Verfahren und anordnung zur beschickung von traggestellen in anlagen zum chemischen behandeln in baedern, insbesondere zum galvanisieren von plattenfoermigen gegenstaenden
JPH02232391A (ja) * 1988-12-21 1990-09-14 Internatl Business Mach Corp <Ibm> アデイテイブ鍍金浴および方法
US4954226A (en) * 1988-12-21 1990-09-04 International Business Machines Corporation Additive plating bath and process
US4990224A (en) * 1988-12-21 1991-02-05 International Business Machines Corporation Copper plating bath and process for difficult to plate metals
US5091218A (en) * 1989-03-06 1992-02-25 Motorola, Inc. Method for producing a metallized pattern on a substrate
US4999079A (en) * 1989-06-02 1991-03-12 Chemcut Corporation Process and apparatus for treating articles and preventing their wrap around a roller
US5002616A (en) * 1989-08-28 1991-03-26 Chemcut Corporation Process and apparatus for fliud treatment of articles
US5077176A (en) * 1990-07-30 1991-12-31 At&T Bell Laboratories Pre-plate cleaning process
US5166037A (en) * 1991-02-14 1992-11-24 International Business Machines Corporation Method of additive circuitization of circuit boards with high adhesion, voidless copper leads
US5685970A (en) * 1992-07-01 1997-11-11 Gould Electronics Inc. Method and apparatus for sequentially metalized polymeric films and products made thereby
US5441618A (en) * 1992-11-10 1995-08-15 Casio Computer Co., Ltd. Anodizing apparatus and an anodizing method
JPH06260309A (ja) * 1993-03-05 1994-09-16 Murata Mfg Co Ltd チップ状電子部品の製造方法
US5336370A (en) * 1993-12-09 1994-08-09 Chipalkatti Makarand H Pre-treatment for plating technique
WO1995016059A1 (fr) * 1993-12-10 1995-06-15 Taisho Kogyo Kabushiki Kaisha Dispositif de traitement par immersion continue du type transfert horizontal
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
US5614264A (en) 1995-08-11 1997-03-25 Atotech Usa, Inc. Fluid delivery apparatus and method
US5904773A (en) * 1995-08-11 1999-05-18 Atotech Usa, Inc. Fluid delivery apparatus
US5658441A (en) * 1995-12-18 1997-08-19 Cfc, Inc. Conveyorized spray plating machine
DE19736805A1 (de) * 1997-08-23 1999-02-25 Atotech Deutschland Gmbh Verfahren und Vorrichtung zur naßchemischen Behandlung von Teilen
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6517894B1 (en) * 1998-04-30 2003-02-11 Ebara Corporation Method for plating a first layer on a substrate and a second layer on the first layer
DE19830212A1 (de) * 1998-07-07 2000-01-20 Angew Solarenergie Ase Gmbh Verfahren und Vorrichtung zum Behandeln von Gegenständen, insbesondere scheibenförmigen Gegenständen wie Blechen, Glasplatten, Leiterplatten, Keramiksubstraten
EP0971051A1 (en) 1998-07-09 2000-01-12 Giacomo Borra A machine for the electrophoretic re-painting or re-varnishing of thin metal objects
US6773560B2 (en) 1998-07-10 2004-08-10 Semitool, Inc. Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces
US7048841B2 (en) 1998-12-07 2006-05-23 Semitool, Inc. Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
JP2003520898A (ja) * 1998-07-10 2003-07-08 セミトゥール・インコーポレイテッド 化学メッキ及び電気メッキを使って銅メッキを行うための方法及び装置
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6303010B1 (en) 1999-07-12 2001-10-16 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6110345A (en) * 1998-11-24 2000-08-29 Advanced Micro Devices, Inc. Method and system for plating workpieces
US6645356B1 (en) * 1998-12-07 2003-11-11 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6309520B1 (en) * 1998-12-07 2001-10-30 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
TW483950B (en) 1998-12-31 2002-04-21 Semitool Inc Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
JP4219562B2 (ja) * 1999-04-13 2009-02-04 セミトゥール・インコーポレイテッド ワークピースを電気化学的に処理するためのシステム
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7645366B2 (en) * 1999-07-12 2010-01-12 Semitool, Inc. Microelectronic workpiece holders and contact assemblies for use therewith
US6673216B2 (en) 1999-08-31 2004-01-06 Semitool, Inc. Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
AU2001259504A1 (en) * 2000-05-24 2001-12-03 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
WO2002023613A2 (en) * 2000-09-15 2002-03-21 Rodel Holdings, Inc. Metal cmp process with reduced dishing
JP2004536217A (ja) * 2000-10-03 2004-12-02 アプライド マテリアルズ インコーポレイテッド 金属蒸着のためのエントリーにあたって半導体基板を傾けるための方法と関連する装置
US20030010449A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Automatic wafer processing and plating system
US20030089613A1 (en) * 2001-11-15 2003-05-15 Ching Chang Yu Method of selectively electroplating by screen-plating technology
US7118658B2 (en) * 2002-05-21 2006-10-10 Semitool, Inc. Electroplating reactor
US8465469B2 (en) * 2002-09-12 2013-06-18 Medtronic Vascular, Inc. Reinforced catheter and methods of making
US20050048210A1 (en) * 2003-01-14 2005-03-03 Sam Siau Method for plating and plating solution therefor
US20040146461A1 (en) * 2003-01-29 2004-07-29 Vincenzo Giuliano Oral contrast media composition for computerized axial tomographic examinations and method
US20050123681A1 (en) * 2003-12-08 2005-06-09 Jar-Wha Lee Method and apparatus for the treatment of individual filaments of a multifilament yarn
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic
US7581551B2 (en) * 2004-09-01 2009-09-01 Sanyo Electric Co., Ltd. Cleaning apparatus
DE102006054846C5 (de) * 2006-11-20 2012-05-03 Permatecs Gmbh Produktionsanlage zur Herstellung von Solarzellen im Inline-Verfahren, sowie Verfahren zur Integration eines Batch-Prozesses in eine mehrspurige Inline-Produktionsanlage für Solarzellen
KR100856873B1 (ko) * 2007-01-05 2008-09-04 연세대학교 산학협력단 무전해도금용 촉매활성 방법
US20090238979A1 (en) * 2008-03-21 2009-09-24 William Decesare Method of Applying Catalytic Solution for Use in Electroless Deposition
FR2934609B1 (fr) * 2008-07-30 2011-07-22 Jet Metal Technologies Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede.
CN102453915B (zh) * 2010-10-27 2014-03-12 富葵精密组件(深圳)有限公司 蚀刻装置及使用该蚀刻装置蚀刻基板的方法
CN102508583B (zh) * 2011-09-30 2014-05-21 南京熊猫电子股份有限公司 电容式触摸屏金属引线的制备方法
CN102673053B (zh) * 2012-06-05 2016-05-11 深圳市五株科技股份有限公司 覆铜板、印刷电路板及其制造方法
CN103786386B (zh) * 2014-02-28 2016-08-17 厦门建霖工业有限公司 一种abs塑料表面涂层及其制备方法
CN104164689A (zh) * 2014-07-30 2014-11-26 东莞市五株电子科技有限公司 一种水平前处理垂直连续式电镀设备
CN104862760A (zh) * 2015-06-11 2015-08-26 重庆德凯覆铜板有限公司 铝板表面阳极氧化生产线
CN105018980A (zh) * 2015-07-23 2015-11-04 珠海元盛电子科技股份有限公司 一种印制电路板孔金属化离子液体镀金的电镀液及电镀方法
CN107087867B (zh) * 2017-06-29 2018-12-14 绍兴上虞文丰礼品有限公司 一种便捷珠宝镀金装置
CN114222433B (zh) * 2022-01-25 2022-08-09 东莞塘厦裕华电路板有限公司 一种印刷电路板湿化学处理设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2942719A (en) * 1956-02-06 1960-06-28 American Can Co Apparatus for treating articles
US3905827A (en) * 1971-10-18 1975-09-16 Chemcut Corp Etchant rinse method
US3801387A (en) * 1971-10-18 1974-04-02 Chemcut Corp Etchant remover apparatus and method
US4015706A (en) * 1971-11-15 1977-04-05 Chemcut Corporation Connecting modules for an etching system
US3776800A (en) * 1971-12-06 1973-12-04 Chemut Corp Etching apparatus
US3801478A (en) * 1972-01-27 1974-04-02 Cottbus Textilkombinat Process of metallizing polymeric materials
US4046248A (en) * 1974-01-15 1977-09-06 Chemcut Corporation Connecting and alignment means for modular chemical treatment system
US3954570A (en) * 1974-11-11 1976-05-04 Amp Incorporated Sensitized polyimides and circuit elements thereof
US4017982A (en) * 1975-07-28 1977-04-19 Chemcut Corporation Drying apparatus
US4402799A (en) * 1981-10-02 1983-09-06 Chemcut Corporation Apparatus and method of treating tabs of printed circuit boards and the like
US4402800A (en) * 1981-10-02 1983-09-06 Ash James J Apparatus and method of treating tabs of printed circuit boards and the like
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
US4617204A (en) * 1983-01-04 1986-10-14 The United States Of America As Represented By The United States Department Of Energy Chemical synthesis of thin films and supported crystals by oxidation of zintl anions
US4454003A (en) * 1983-01-06 1984-06-12 Systems Engineering & Manufacturing Corp. Printed circuit board component conveyor apparatus and process
US4511597A (en) * 1983-10-12 1985-04-16 Kollmorgen Technologies Corporation Method for depositing a metal on a surface
JPS60218477A (ja) * 1984-04-11 1985-11-01 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 無電解付着のための触媒化処理法
DE3423457A1 (de) * 1984-06-26 1986-01-02 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von leiterplatten

Also Published As

Publication number Publication date
BG60260B1 (bg) 1994-03-24
DE3543286C2 (sv) 1993-08-19
SU1660595A3 (ru) 1991-06-30
BG60260B2 (en) 1994-03-24
CN1015996B (zh) 1992-03-25
JPH0571665B2 (sv) 1993-10-07
NL8503147A (nl) 1986-11-17
SE463625B (sv) 1990-12-17
BE903914A (fr) 1986-04-16
IT1215167B (it) 1990-01-31
AT395022B (de) 1992-08-25
FR2580671A1 (fr) 1986-10-24
IT8567980A0 (it) 1985-11-22
GB2174107A (en) 1986-10-29
LU86221A1 (fr) 1986-04-14
SE8505859D0 (sv) 1985-12-11
US4576685A (en) 1986-03-18
CH668270A5 (de) 1988-12-15
ATA361585A (de) 1992-01-15
CN85108685A (zh) 1986-10-22
FR2580671B1 (fr) 1989-07-28
GB8531409D0 (en) 1986-02-05
JPS61246372A (ja) 1986-11-01
DE3543286A1 (de) 1986-10-23
GB2174107B (en) 1989-04-19

Similar Documents

Publication Publication Date Title
SE8505859L (sv) Forfarande och apparat for metallbeleggning av foremal
DE69027040D1 (de) Verfahren zum unmittelbaren elektroplattieren eines dielektrischen substrates
PT74959B (en) Process for the preparation of electroless plating bath for depositing gold on various substrates
ES8603532A1 (es) Metodo de recubrir con metal una superficie de un articulo de resina termoplastica que contiene carga
ES8205021A1 (es) Un procedimiento para el pretratamiento de un sustrato sus- tancialmente no conductor
DE3272286D1 (en) A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath
DE3463678D1 (en) Process for pre-treating polyamide substrates for electroless plating
US3592744A (en) Method of preventing rack plating in continuous plating cycle for nonconductive articles
DE3379843D1 (en) Apparatus and method for electroless plating
Coombes et al. Method for Selectively Plating Plastics
Blasing et al. Process and Apparatus for Conveying Plate-Like Articles(for Electroplating)
Balla Metalizing of High-Tech Conductor Plates
Fuchs Through-hole plating of printed circuit boards using the Tokron process
JPS5732398A (en) Supplying method of electricity to work in continuous electrodeposition coating
Caliaro Increasing Productivity and Quality: Complete Metallisation of Printed-Circuit Boards by Direct Plating
PL243230A1 (en) Apparatus for operating close circuit of the bath for depositing coatings in the process of electrodeposition
Dargis Uniform Satin Nickel as a Decorative Finish
Fischer Circuit Board Technology
Hupe Black Chromium Oxide as Etchresist
Hirth et al. Defects on Electroplated Components: Zinc Plating
Schultz et al. Electroless nickel plating of aluminum
IT1155903B (it) Procedimento per la deposizione continua di una placcatura metallica sulla superficie di un pezzo e substrati placcati con il procedimento
ES8307931A1 (es) Metodo para depositar de manera continua un revestimiento metalico sobre la superficie de una pieza.
Fuchs et al. Continuous Plating Method and Apparatus
Srinivasan et al. Copper Plating for Selective Case Hardening

Legal Events

Date Code Title Description
NAL Patent in force

Ref document number: 8505859-2

Format of ref document f/p: F

NUG Patent has lapsed

Ref document number: 8505859-2

Format of ref document f/p: F