FR2580671B1 - Procede et appareil pour deposer un metal sur des surfaces d'articles globalement plats - Google Patents
Procede et appareil pour deposer un metal sur des surfaces d'articles globalement platsInfo
- Publication number
- FR2580671B1 FR2580671B1 FR8518956A FR8518956A FR2580671B1 FR 2580671 B1 FR2580671 B1 FR 2580671B1 FR 8518956 A FR8518956 A FR 8518956A FR 8518956 A FR8518956 A FR 8518956A FR 2580671 B1 FR2580671 B1 FR 2580671B1
- Authority
- FR
- France
- Prior art keywords
- depositing metal
- flat articles
- globally flat
- globally
- articles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000151 deposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/726,049 US4576685A (en) | 1985-04-23 | 1985-04-23 | Process and apparatus for plating onto articles |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2580671A1 FR2580671A1 (fr) | 1986-10-24 |
FR2580671B1 true FR2580671B1 (fr) | 1989-07-28 |
Family
ID=24917013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8518956A Expired FR2580671B1 (fr) | 1985-04-23 | 1985-12-20 | Procede et appareil pour deposer un metal sur des surfaces d'articles globalement plats |
Country Status (15)
Country | Link |
---|---|
US (1) | US4576685A (fr) |
JP (1) | JPS61246372A (fr) |
CN (1) | CN1015996B (fr) |
AT (1) | AT395022B (fr) |
BE (1) | BE903914A (fr) |
BG (1) | BG60260B2 (fr) |
CH (1) | CH668270A5 (fr) |
DE (1) | DE3543286A1 (fr) |
FR (1) | FR2580671B1 (fr) |
GB (1) | GB2174107B (fr) |
IT (1) | IT1215167B (fr) |
LU (1) | LU86221A1 (fr) |
NL (1) | NL8503147A (fr) |
SE (1) | SE463625B (fr) |
SU (1) | SU1660595A3 (fr) |
Families Citing this family (78)
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DE3631055C1 (de) * | 1986-09-12 | 1987-05-21 | Deutsche Automobilgesellsch | Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung |
DE3632378A1 (de) * | 1986-09-24 | 1988-03-31 | Schering Ag | Verfahren zum fuehren von plattenfoermigen gegenstaenden, sowie dazugehoerige vorrichtung |
US4775449A (en) * | 1986-12-29 | 1988-10-04 | General Electric Company | Treatment of a polyimide surface to improve the adhesion of metal deposited thereon |
DE3703542A1 (de) * | 1987-02-06 | 1988-08-18 | Schering Ag | Verfahren und anordnung zur beschickung von traggestellen in anlagen zum chemischen behandeln in baedern, insbesondere zum galvanisieren von plattenfoermigen gegenstaenden |
US4990224A (en) * | 1988-12-21 | 1991-02-05 | International Business Machines Corporation | Copper plating bath and process for difficult to plate metals |
US4954226A (en) * | 1988-12-21 | 1990-09-04 | International Business Machines Corporation | Additive plating bath and process |
JPH02232391A (ja) * | 1988-12-21 | 1990-09-14 | Internatl Business Mach Corp <Ibm> | アデイテイブ鍍金浴および方法 |
US5091218A (en) * | 1989-03-06 | 1992-02-25 | Motorola, Inc. | Method for producing a metallized pattern on a substrate |
US4999079A (en) * | 1989-06-02 | 1991-03-12 | Chemcut Corporation | Process and apparatus for treating articles and preventing their wrap around a roller |
US5002616A (en) * | 1989-08-28 | 1991-03-26 | Chemcut Corporation | Process and apparatus for fliud treatment of articles |
US5077176A (en) * | 1990-07-30 | 1991-12-31 | At&T Bell Laboratories | Pre-plate cleaning process |
US5166037A (en) * | 1991-02-14 | 1992-11-24 | International Business Machines Corporation | Method of additive circuitization of circuit boards with high adhesion, voidless copper leads |
US5685970A (en) * | 1992-07-01 | 1997-11-11 | Gould Electronics Inc. | Method and apparatus for sequentially metalized polymeric films and products made thereby |
US5441618A (en) * | 1992-11-10 | 1995-08-15 | Casio Computer Co., Ltd. | Anodizing apparatus and an anodizing method |
JPH06260309A (ja) * | 1993-03-05 | 1994-09-16 | Murata Mfg Co Ltd | チップ状電子部品の製造方法 |
US5336370A (en) * | 1993-12-09 | 1994-08-09 | Chipalkatti Makarand H | Pre-treatment for plating technique |
WO1995016059A1 (fr) * | 1993-12-10 | 1995-06-15 | Taisho Kogyo Kabushiki Kaisha | Dispositif de traitement par immersion continue du type transfert horizontal |
US5720813A (en) | 1995-06-07 | 1998-02-24 | Eamon P. McDonald | Thin sheet handling system |
US5904773A (en) * | 1995-08-11 | 1999-05-18 | Atotech Usa, Inc. | Fluid delivery apparatus |
US5614264A (en) * | 1995-08-11 | 1997-03-25 | Atotech Usa, Inc. | Fluid delivery apparatus and method |
US5658441A (en) * | 1995-12-18 | 1997-08-19 | Cfc, Inc. | Conveyorized spray plating machine |
DE19736805A1 (de) * | 1997-08-23 | 1999-02-25 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zur naßchemischen Behandlung von Teilen |
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US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
KR100654413B1 (ko) * | 1998-04-30 | 2006-12-05 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판의 도금방법 |
DE19830212A1 (de) * | 1998-07-07 | 2000-01-20 | Angew Solarenergie Ase Gmbh | Verfahren und Vorrichtung zum Behandeln von Gegenständen, insbesondere scheibenförmigen Gegenständen wie Blechen, Glasplatten, Leiterplatten, Keramiksubstraten |
EP0971051A1 (fr) | 1998-07-09 | 2000-01-12 | Giacomo Borra | Dispositif pour renouveler la teinture ou vernis d'objets métalliques minces |
US6773560B2 (en) | 1998-07-10 | 2004-08-10 | Semitool, Inc. | Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces |
US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
US7048841B2 (en) | 1998-12-07 | 2006-05-23 | Semitool, Inc. | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
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US7585398B2 (en) * | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
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US7264698B2 (en) * | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7645366B2 (en) * | 1999-07-12 | 2010-01-12 | Semitool, Inc. | Microelectronic workpiece holders and contact assemblies for use therewith |
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KR100659544B1 (ko) * | 1999-11-12 | 2006-12-19 | 에바라 유지라이토 코포레이션 리미티드 | 비아 필링 방법 |
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US20030089613A1 (en) * | 2001-11-15 | 2003-05-15 | Ching Chang Yu | Method of selectively electroplating by screen-plating technology |
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DE102006054846C5 (de) * | 2006-11-20 | 2012-05-03 | Permatecs Gmbh | Produktionsanlage zur Herstellung von Solarzellen im Inline-Verfahren, sowie Verfahren zur Integration eines Batch-Prozesses in eine mehrspurige Inline-Produktionsanlage für Solarzellen |
KR100856873B1 (ko) * | 2007-01-05 | 2008-09-04 | 연세대학교 산학협력단 | 무전해도금용 촉매활성 방법 |
US20090238979A1 (en) * | 2008-03-21 | 2009-09-24 | William Decesare | Method of Applying Catalytic Solution for Use in Electroless Deposition |
FR2934609B1 (fr) * | 2008-07-30 | 2011-07-22 | Jet Metal Technologies | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
CN102453915B (zh) * | 2010-10-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 蚀刻装置及使用该蚀刻装置蚀刻基板的方法 |
CN102508583B (zh) * | 2011-09-30 | 2014-05-21 | 南京熊猫电子股份有限公司 | 电容式触摸屏金属引线的制备方法 |
CN102673053B (zh) * | 2012-06-05 | 2016-05-11 | 深圳市五株科技股份有限公司 | 覆铜板、印刷电路板及其制造方法 |
CN103786386B (zh) * | 2014-02-28 | 2016-08-17 | 厦门建霖工业有限公司 | 一种abs塑料表面涂层及其制备方法 |
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CN105018980A (zh) * | 2015-07-23 | 2015-11-04 | 珠海元盛电子科技股份有限公司 | 一种印制电路板孔金属化离子液体镀金的电镀液及电镀方法 |
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CN114222433B (zh) * | 2022-01-25 | 2022-08-09 | 东莞塘厦裕华电路板有限公司 | 一种印刷电路板湿化学处理设备 |
CN114672792A (zh) * | 2022-04-20 | 2022-06-28 | 深圳市恒博智造有限公司 | 一种具有负载及镀镍时间控制功能的镀镍用镍缸装置 |
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US2942719A (en) * | 1956-02-06 | 1960-06-28 | American Can Co | Apparatus for treating articles |
US3905827A (en) * | 1971-10-18 | 1975-09-16 | Chemcut Corp | Etchant rinse method |
US3801387A (en) * | 1971-10-18 | 1974-04-02 | Chemcut Corp | Etchant remover apparatus and method |
US4015706A (en) * | 1971-11-15 | 1977-04-05 | Chemcut Corporation | Connecting modules for an etching system |
US3776800A (en) * | 1971-12-06 | 1973-12-04 | Chemut Corp | Etching apparatus |
US3801478A (en) * | 1972-01-27 | 1974-04-02 | Cottbus Textilkombinat | Process of metallizing polymeric materials |
US4046248A (en) * | 1974-01-15 | 1977-09-06 | Chemcut Corporation | Connecting and alignment means for modular chemical treatment system |
US3954570A (en) * | 1974-11-11 | 1976-05-04 | Amp Incorporated | Sensitized polyimides and circuit elements thereof |
US4017982A (en) * | 1975-07-28 | 1977-04-19 | Chemcut Corporation | Drying apparatus |
US4402800A (en) * | 1981-10-02 | 1983-09-06 | Ash James J | Apparatus and method of treating tabs of printed circuit boards and the like |
US4402799A (en) * | 1981-10-02 | 1983-09-06 | Chemcut Corporation | Apparatus and method of treating tabs of printed circuit boards and the like |
US4385967A (en) * | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
US4617204A (en) * | 1983-01-04 | 1986-10-14 | The United States Of America As Represented By The United States Department Of Energy | Chemical synthesis of thin films and supported crystals by oxidation of zintl anions |
US4454003A (en) * | 1983-01-06 | 1984-06-12 | Systems Engineering & Manufacturing Corp. | Printed circuit board component conveyor apparatus and process |
US4511597A (en) * | 1983-10-12 | 1985-04-16 | Kollmorgen Technologies Corporation | Method for depositing a metal on a surface |
JPS60218477A (ja) * | 1984-04-11 | 1985-11-01 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 無電解付着のための触媒化処理法 |
DE3423457A1 (de) * | 1984-06-26 | 1986-01-02 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von leiterplatten |
-
1985
- 1985-04-23 US US06/726,049 patent/US4576685A/en not_active Expired - Fee Related
- 1985-11-15 NL NL8503147A patent/NL8503147A/nl not_active Application Discontinuation
- 1985-11-22 IT IT8567980A patent/IT1215167B/it active
- 1985-11-29 CN CN85108685.3A patent/CN1015996B/zh not_active Expired
- 1985-11-29 JP JP60267569A patent/JPS61246372A/ja active Granted
- 1985-12-07 DE DE19853543286 patent/DE3543286A1/de active Granted
- 1985-12-11 SE SE8505859A patent/SE463625B/sv not_active IP Right Cessation
- 1985-12-16 BG BG72728A patent/BG60260B2/xx unknown
- 1985-12-16 AT AT0361585A patent/AT395022B/de not_active IP Right Cessation
- 1985-12-18 SU SU853990693A patent/SU1660595A3/ru active
- 1985-12-20 BE BE0/216039A patent/BE903914A/fr not_active IP Right Cessation
- 1985-12-20 GB GB8531409A patent/GB2174107B/en not_active Expired
- 1985-12-20 FR FR8518956A patent/FR2580671B1/fr not_active Expired
- 1985-12-20 LU LU86221A patent/LU86221A1/fr unknown
- 1985-12-20 CH CH5467/85A patent/CH668270A5/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
BG60260B1 (bg) | 1994-03-24 |
BG60260B2 (en) | 1994-03-24 |
DE3543286A1 (de) | 1986-10-23 |
GB2174107B (en) | 1989-04-19 |
CN1015996B (zh) | 1992-03-25 |
SE8505859D0 (sv) | 1985-12-11 |
IT8567980A0 (it) | 1985-11-22 |
SE8505859L (sv) | 1986-10-24 |
BE903914A (fr) | 1986-04-16 |
NL8503147A (nl) | 1986-11-17 |
AT395022B (de) | 1992-08-25 |
ATA361585A (de) | 1992-01-15 |
US4576685A (en) | 1986-03-18 |
DE3543286C2 (fr) | 1993-08-19 |
GB2174107A (en) | 1986-10-29 |
CH668270A5 (de) | 1988-12-15 |
SE463625B (sv) | 1990-12-17 |
CN85108685A (zh) | 1986-10-22 |
SU1660595A3 (ru) | 1991-06-30 |
JPH0571665B2 (fr) | 1993-10-07 |
LU86221A1 (fr) | 1986-04-14 |
JPS61246372A (ja) | 1986-11-01 |
GB8531409D0 (en) | 1986-02-05 |
IT1215167B (it) | 1990-01-31 |
FR2580671A1 (fr) | 1986-10-24 |
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