SE8303475L - Behandling av kretskort - Google Patents

Behandling av kretskort

Info

Publication number
SE8303475L
SE8303475L SE8303475A SE8303475A SE8303475L SE 8303475 L SE8303475 L SE 8303475L SE 8303475 A SE8303475 A SE 8303475A SE 8303475 A SE8303475 A SE 8303475A SE 8303475 L SE8303475 L SE 8303475L
Authority
SE
Sweden
Prior art keywords
printed circuit
solvent
circuit cards
treating
machine
Prior art date
Application number
SE8303475A
Other languages
English (en)
Other versions
SE440719B (sv
SE8303475D0 (sv
Inventor
R Holmstrand
Original Assignee
Holmstrands Plaatindustri Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Holmstrands Plaatindustri Ab filed Critical Holmstrands Plaatindustri Ab
Priority to SE8303475A priority Critical patent/SE440719B/sv
Publication of SE8303475D0 publication Critical patent/SE8303475D0/sv
Priority to US06/613,597 priority patent/US4589926A/en
Priority to DE19843422562 priority patent/DE3422562A1/de
Publication of SE8303475L publication Critical patent/SE8303475L/sv
Publication of SE440719B publication Critical patent/SE440719B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/04—Apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE8303475A 1983-06-17 1983-06-17 Sett och anordning vid rengoring av kretskort, som tidigare underkastats en lodningsoperation med flussmedel SE440719B (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE8303475A SE440719B (sv) 1983-06-17 1983-06-17 Sett och anordning vid rengoring av kretskort, som tidigare underkastats en lodningsoperation med flussmedel
US06/613,597 US4589926A (en) 1983-06-17 1984-05-23 Method and compact machine for treating printed circuit cards
DE19843422562 DE3422562A1 (de) 1983-06-17 1984-06-18 Verfahren und vorrichtung zum entfernen von verunreinigungen auf schaltplatinen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8303475A SE440719B (sv) 1983-06-17 1983-06-17 Sett och anordning vid rengoring av kretskort, som tidigare underkastats en lodningsoperation med flussmedel

Publications (3)

Publication Number Publication Date
SE8303475D0 SE8303475D0 (sv) 1983-06-17
SE8303475L true SE8303475L (sv) 1984-12-18
SE440719B SE440719B (sv) 1985-08-12

Family

ID=20351655

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8303475A SE440719B (sv) 1983-06-17 1983-06-17 Sett och anordning vid rengoring av kretskort, som tidigare underkastats en lodningsoperation med flussmedel

Country Status (3)

Country Link
US (1) US4589926A (sv)
DE (1) DE3422562A1 (sv)
SE (1) SE440719B (sv)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984597B1 (en) * 1984-05-21 1999-10-26 Cfmt Inc Apparatus for rinsing and drying surfaces
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
US4640719A (en) * 1985-07-01 1987-02-03 Petroleum Fermentations N.V. Method for printed circuit board and/or printed wiring board cleaning
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
US4769083A (en) * 1986-01-27 1988-09-06 Gould Inc. Method for removing excess solder from printed circuit boards
US4861385A (en) * 1986-10-02 1989-08-29 Aisaburo Yagishita Article washing method
SE459379B (sv) * 1986-12-29 1989-06-26 Holmstrands Products Ab Saett och apparat foer separering av vatten och loesningsmedel ur en blandning av naemnda vaetskor, vilka anvaendes i en framkallningsmaskin foer moensterkort
US4816081A (en) * 1987-02-17 1989-03-28 Fsi Corporation Apparatus and process for static drying of substrates
US4788992A (en) * 1987-04-28 1988-12-06 Lewis Corporation Ultrasonic strip cleaning apparatus
EP0290098B1 (de) * 1987-05-07 1990-11-14 Micafil Ag Verfahren und Vorrichtung zum Extrahieren von Oel oder polychloriertem Biphenyl aus imprägnierten elektrischen Teilen mittels eines Lösungsmittels sowie Destillation des Lösungsmittels
US4777804A (en) * 1987-08-26 1988-10-18 Texas Instruments Incorporated Method and apparatus for easing surface particle removal by size increase
DE3840098C1 (sv) * 1988-11-28 1989-12-21 Helmut Walter 8900 Augsburg De Leicht
FI86944C (sv) * 1989-02-02 1992-10-26 Nokia Mobira Oy Förfarande för tvättning av kretsplattor och en anordning fög användni ng i förfarandet
US5045120A (en) * 1989-03-06 1991-09-03 Electrovert Ltd. Method for cleaning electronic and other devices
DE3916693A1 (de) * 1989-05-23 1990-11-29 Schering Ag Anordnung zur behandlung und/oder reinigung von gut, insbesondere von mit bohrungen versehenen leiterplatten
CA1334505C (en) * 1989-08-21 1995-02-21 Bejrouth A. Micheletti Washing apparatus and method
US5027841A (en) * 1990-04-24 1991-07-02 Electronic Controls Design, Inc. Apparatus to clean printed circuit boards
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
DE69108169T2 (de) * 1990-10-23 1995-07-20 Tokyo Special Wire Netting Co Reinigungsapparat.
DE4103098C1 (sv) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
AU1901992A (en) * 1991-04-08 1992-11-02 Gene C. Weitz Method and system for degreasing solid objects
US5224235A (en) * 1991-06-28 1993-07-06 Digital Equipment Corporation Electronic component cleaning apparatus
WO1993006949A1 (en) * 1991-10-04 1993-04-15 Cfm Technologies, Inc. Ultracleaning of involuted microparts
US5201958A (en) * 1991-11-12 1993-04-13 Electronic Controls Design, Inc. Closed-loop dual-cycle printed circuit board cleaning apparatus and method
US5298082A (en) * 1992-04-06 1994-03-29 Gene Weitz Method for degreasing solid objects
US5483984A (en) * 1992-07-10 1996-01-16 Donlan, Jr.; Fraser P. Fluid treatment apparatus and method
EP0611625A1 (de) * 1993-02-15 1994-08-24 Meteor Ag Flux-Vorrichtung
US5534078A (en) * 1994-01-27 1996-07-09 Breunsbach; Rex Method for cleaning electronic assemblies
US5494529A (en) * 1994-02-22 1996-02-27 Atotech Usa, Inc. Treatment method for cleaning and drying printed circuit boards and the like
US5751307A (en) * 1994-04-12 1998-05-12 Moore Business Forms, Inc. Print cartridge cleaning apparatus and method using water and air
DE19502750A1 (de) * 1995-01-23 1996-07-25 Deutsche Telephonwerk Kabel Bürsteneinrichtung für Leiterplatten zum Entfernen von Verunreinigungen
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
US5795405A (en) * 1996-03-13 1998-08-18 Eric F. Harnden Machine and method for processing of printed circuit boards by immersion in transversely flowing liquid chemical
US6039059A (en) * 1996-09-30 2000-03-21 Verteq, Inc. Wafer cleaning system
WO1998035765A1 (en) * 1997-02-18 1998-08-20 Scp Global Technologies Multiple stage wet processing chamber
US6328809B1 (en) 1998-10-09 2001-12-11 Scp Global Technologies, Inc. Vapor drying system and method
DE19934300C2 (de) * 1999-07-21 2002-02-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
US6649593B1 (en) * 1999-10-13 2003-11-18 Tularik Inc. Modulators of SREBP processing
US6344106B1 (en) 2000-06-12 2002-02-05 International Business Machines Corporation Apparatus, and corresponding method, for chemically etching substrates
DE10043653A1 (de) * 2000-09-05 2002-03-14 Volkswagen Ag Anlage und Verfahren zur Entfernung von Flussmittelresten an einem gelöteten, metallischen Werkstück
US6871378B2 (en) * 2002-05-24 2005-03-29 Robert Larson Automated lap washer
WO2010030505A1 (en) * 2008-09-10 2010-03-18 Austin American Technology Corporation Cleaning and testing ionic cleanliness of electronic assemblies
DE202021002099U1 (de) 2021-06-16 2021-07-15 Mühlbauer Gmbh & Co. Kg Vorrichtung zum Reinigen von kartenförmigen Datenträgern und Kartenbearbeitungssystem mit einer Vorrichtung zum Reinigen von kartenförmigen Datenträgern

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3123083A (en) * 1964-03-03 Metal degreasing apparatus
US3079286A (en) * 1962-03-02 1963-02-26 Detrex Chem Ind Enclosed cold solvent spray cleaner
US3144872A (en) * 1963-08-16 1964-08-18 Detrex Chem Ind Trough-type solvent washer
US3292194A (en) * 1965-09-09 1966-12-13 Randall Max Machine for cleansing sheets of material
US3566429A (en) * 1968-06-20 1971-03-02 Baron Blakeslee Inc Apparatus for cleaning planar objects
SE375248B (sv) * 1973-08-08 1975-04-14 Uddeholms Ab
SE373610B (sv) * 1973-11-27 1975-02-10 Uddeholms Ab Anordning for ytrengoring av skivformiga foremal
US4210461A (en) * 1975-06-02 1980-07-01 Elecktrokemiska AB Method for recovering heat in a vapor degreasing apparatus
SE417566B (sv) * 1979-07-11 1981-03-23 Ericsson Telefon Ab L M Anordning for rengoring av kretskort serskilt for att avlegsna lod- och hartsrester
DE3015525C2 (de) * 1980-04-23 1982-07-01 Langbein-Pfanhauser Werke Ag, 4040 Neuss Anlage zum Destillieren von Flüssigkeiten mit einer Wärmepumpe
DE3015524C2 (de) * 1980-04-23 1985-05-23 LPW-Reinigungstechnik GmbH, 7024 Filderstadt Anlage zum Behandeln von Gegenständen mit Lösungsmitteln, lösungsmittelhaltigen Flüssigkeiten und mit Lösungsmitteldämpfen
US4322251A (en) * 1980-05-14 1982-03-30 Diamond Shamrock Corporation Method and apparatus for vapor treatment of metals
US4391016A (en) * 1980-10-14 1983-07-05 Kabushiki Kaisha Kobe Seiko Sho Degreasing apparatus for elongated materials
JPS60798B2 (ja) * 1981-06-09 1985-01-10 株式会社石井表記 超音波洗滌装置

Also Published As

Publication number Publication date
SE440719B (sv) 1985-08-12
US4589926A (en) 1986-05-20
DE3422562A1 (de) 1984-12-20
SE8303475D0 (sv) 1983-06-17

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