SE515831C2 - Halvledaranordning med induktor och förfarande vid framställning av en sådan halvledaranordning - Google Patents

Halvledaranordning med induktor och förfarande vid framställning av en sådan halvledaranordning

Info

Publication number
SE515831C2
SE515831C2 SE9900498A SE9900498A SE515831C2 SE 515831 C2 SE515831 C2 SE 515831C2 SE 9900498 A SE9900498 A SE 9900498A SE 9900498 A SE9900498 A SE 9900498A SE 515831 C2 SE515831 C2 SE 515831C2
Authority
SE
Sweden
Prior art keywords
layer
active components
substrate
inductor
integrated circuit
Prior art date
Application number
SE9900498A
Other languages
English (en)
Swedish (sv)
Other versions
SE9900498D0 (sv
SE9900498L (sv
Inventor
Kjell Bohlin
Ulf Magnusson
Ola Tylstedt
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9900498A priority Critical patent/SE515831C2/sv
Publication of SE9900498D0 publication Critical patent/SE9900498D0/xx
Priority to TW088103755A priority patent/TW432710B/zh
Priority to CA002362920A priority patent/CA2362920A1/en
Priority to KR1020017010182A priority patent/KR100581269B1/ko
Priority to EP00908177A priority patent/EP1171917A1/en
Priority to PCT/SE2000/000263 priority patent/WO2000048253A1/en
Priority to JP2000599083A priority patent/JP2002536849A/ja
Priority to AU29547/00A priority patent/AU2954700A/en
Priority to CNB008038120A priority patent/CN1197166C/zh
Priority to US09/503,346 priority patent/US20020140050A1/en
Publication of SE9900498L publication Critical patent/SE9900498L/
Publication of SE515831C2 publication Critical patent/SE515831C2/sv
Priority to HK02106631.0A priority patent/HK1045216A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0921—Means for preventing a bipolar, e.g. thyristor, action between the different transistor regions, e.g. Latchup prevention
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823878—Complementary field-effect transistors, e.g. CMOS isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
SE9900498A 1999-02-15 1999-02-15 Halvledaranordning med induktor och förfarande vid framställning av en sådan halvledaranordning SE515831C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE9900498A SE515831C2 (sv) 1999-02-15 1999-02-15 Halvledaranordning med induktor och förfarande vid framställning av en sådan halvledaranordning
TW088103755A TW432710B (en) 1999-02-15 1999-03-11 Semiconductor device and method
CNB008038120A CN1197166C (zh) 1999-02-15 2000-02-10 一种高频应用的集成电路及其制造方法
EP00908177A EP1171917A1 (en) 1999-02-15 2000-02-10 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
KR1020017010182A KR100581269B1 (ko) 1999-02-15 2000-02-10 래치 업 방지 인덕터를 포함하는 집적 회로 및, 그 제조 방법
CA002362920A CA2362920A1 (en) 1999-02-15 2000-02-10 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
PCT/SE2000/000263 WO2000048253A1 (en) 1999-02-15 2000-02-10 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
JP2000599083A JP2002536849A (ja) 1999-02-15 2000-02-10 ラッチアップを防ぐためのインダクタを含む集積回路とその製造方法
AU29547/00A AU2954700A (en) 1999-02-15 2000-02-10 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
US09/503,346 US20020140050A1 (en) 1999-02-15 2000-02-14 Semiconductor device having an inductor with low loss
HK02106631.0A HK1045216A1 (zh) 1999-02-15 2002-09-09 包含防閉鎖電感器的集成電路及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9900498A SE515831C2 (sv) 1999-02-15 1999-02-15 Halvledaranordning med induktor och förfarande vid framställning av en sådan halvledaranordning

Publications (3)

Publication Number Publication Date
SE9900498D0 SE9900498D0 (sv) 1999-02-15
SE9900498L SE9900498L (sv) 2000-08-16
SE515831C2 true SE515831C2 (sv) 2001-10-15

Family

ID=20414472

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9900498A SE515831C2 (sv) 1999-02-15 1999-02-15 Halvledaranordning med induktor och förfarande vid framställning av en sådan halvledaranordning

Country Status (11)

Country Link
US (1) US20020140050A1 (ja)
EP (1) EP1171917A1 (ja)
JP (1) JP2002536849A (ja)
KR (1) KR100581269B1 (ja)
CN (1) CN1197166C (ja)
AU (1) AU2954700A (ja)
CA (1) CA2362920A1 (ja)
HK (1) HK1045216A1 (ja)
SE (1) SE515831C2 (ja)
TW (1) TW432710B (ja)
WO (1) WO2000048253A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9520486B2 (en) 2009-11-04 2016-12-13 Analog Devices, Inc. Electrostatic protection device
US10199482B2 (en) 2010-11-29 2019-02-05 Analog Devices, Inc. Apparatus for electrostatic discharge protection
WO2015145507A1 (ja) * 2014-03-28 2015-10-01 株式会社ソシオネクスト 半導体集積回路
CN103956362A (zh) * 2014-05-20 2014-07-30 中国工程物理研究院电子工程研究所 基于图形化高能离子注入的低衬底损耗硅基集成电路及其制作方法
CN103972053A (zh) * 2014-05-29 2014-08-06 中国工程物理研究院电子工程研究所 一种图形化高能重离子注入的低损耗硅基射频无源器件的制作方法
US10181719B2 (en) 2015-03-16 2019-01-15 Analog Devices Global Overvoltage blocking protection device
EP3382678B1 (en) * 2017-03-27 2019-07-31 Ecole Polytechnique Federale De Lausanne (Epfl) An electromagnetic actuator

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931052A (ja) * 1982-08-13 1984-02-18 Hitachi Ltd 半導体集積回路装置の製造方法
US5559349A (en) * 1995-03-07 1996-09-24 Northrop Grumman Corporation Silicon integrated circuit with passive devices over high resistivity silicon substrate portion, and active devices formed in lower resistivity silicon layer over the substrate
TW392392B (en) * 1997-04-03 2000-06-01 Lucent Technologies Inc High frequency apparatus including a low loss substrate
DE19821726C1 (de) * 1998-05-14 1999-09-09 Texas Instruments Deutschland Ingegrierte CMOS-Schaltung für die Verwendung bei hohen Frequenzen

Also Published As

Publication number Publication date
WO2000048253A1 (en) 2000-08-17
SE9900498D0 (sv) 1999-02-15
TW432710B (en) 2001-05-01
CA2362920A1 (en) 2000-08-17
SE9900498L (sv) 2000-08-16
JP2002536849A (ja) 2002-10-29
AU2954700A (en) 2000-08-29
CN1197166C (zh) 2005-04-13
KR20020020872A (ko) 2002-03-16
CN1340214A (zh) 2002-03-13
HK1045216A1 (zh) 2002-11-15
KR100581269B1 (ko) 2006-05-17
US20020140050A1 (en) 2002-10-03
EP1171917A1 (en) 2002-01-16

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