SE501466C2 - Sätt att framställa en uppbyggnad av metaller i flera nivåer på ett substrat - Google Patents

Sätt att framställa en uppbyggnad av metaller i flera nivåer på ett substrat

Info

Publication number
SE501466C2
SE501466C2 SE8400592A SE8400592A SE501466C2 SE 501466 C2 SE501466 C2 SE 501466C2 SE 8400592 A SE8400592 A SE 8400592A SE 8400592 A SE8400592 A SE 8400592A SE 501466 C2 SE501466 C2 SE 501466C2
Authority
SE
Sweden
Prior art keywords
layer
silicon
metallization layer
aluminum
insulating layer
Prior art date
Application number
SE8400592A
Other languages
English (en)
Swedish (sv)
Other versions
SE8400592D0 (sv
SE8400592L (sv
Inventor
Albert Wayne Fisher
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of SE8400592D0 publication Critical patent/SE8400592D0/xx
Publication of SE8400592L publication Critical patent/SE8400592L/
Publication of SE501466C2 publication Critical patent/SE501466C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Die Bonding (AREA)
SE8400592A 1983-02-10 1984-02-06 Sätt att framställa en uppbyggnad av metaller i flera nivåer på ett substrat SE501466C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46564083A 1983-02-10 1983-02-10

Publications (3)

Publication Number Publication Date
SE8400592D0 SE8400592D0 (sv) 1984-02-06
SE8400592L SE8400592L (sv) 1984-08-11
SE501466C2 true SE501466C2 (sv) 1995-02-20

Family

ID=23848579

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8400592A SE501466C2 (sv) 1983-02-10 1984-02-06 Sätt att framställa en uppbyggnad av metaller i flera nivåer på ett substrat

Country Status (7)

Country Link
JP (1) JPH0666313B2 (fr)
KR (1) KR910008104B1 (fr)
CA (1) CA1209281A (fr)
GB (1) GB2135123B (fr)
IT (1) IT1213136B (fr)
SE (1) SE501466C2 (fr)
YU (1) YU18284A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763064B2 (ja) * 1986-03-31 1995-07-05 株式会社日立製作所 Ｉｃ素子における配線接続方法
JPH0719841B2 (ja) * 1987-10-02 1995-03-06 株式会社東芝 半導体装置
USRE36475E (en) * 1993-09-15 1999-12-28 Hyundai Electronics Industries Co., Ltd. Method of forming a via plug in a semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51112292A (en) * 1975-03-28 1976-10-04 Hitachi Ltd Semiconductor device
JPS55156365A (en) * 1979-05-24 1980-12-05 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
SE8400592D0 (sv) 1984-02-06
JPH0666313B2 (ja) 1994-08-24
IT8419546A0 (it) 1984-02-09
GB8402109D0 (en) 1984-02-29
GB2135123A (en) 1984-08-22
CA1209281A (fr) 1986-08-05
YU18284A (en) 1987-12-31
KR840008215A (ko) 1984-12-13
GB2135123B (en) 1987-05-20
IT1213136B (it) 1989-12-14
JPS59205739A (ja) 1984-11-21
KR910008104B1 (ko) 1991-10-07
SE8400592L (sv) 1984-08-11

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