CA1209281A - Metallisation en couches a l'aluminium pour dispositif semiconducteur - Google Patents

Metallisation en couches a l'aluminium pour dispositif semiconducteur

Info

Publication number
CA1209281A
CA1209281A CA000446407A CA446407A CA1209281A CA 1209281 A CA1209281 A CA 1209281A CA 000446407 A CA000446407 A CA 000446407A CA 446407 A CA446407 A CA 446407A CA 1209281 A CA1209281 A CA 1209281A
Authority
CA
Canada
Prior art keywords
layer
silicon
aluminum
level
metallization layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000446407A
Other languages
English (en)
Inventor
Albert W. Fisher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Application granted granted Critical
Publication of CA1209281A publication Critical patent/CA1209281A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
CA000446407A 1983-02-10 1984-01-31 Metallisation en couches a l'aluminium pour dispositif semiconducteur Expired CA1209281A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46564083A 1983-02-10 1983-02-10
US465,640 1983-02-10

Publications (1)

Publication Number Publication Date
CA1209281A true CA1209281A (fr) 1986-08-05

Family

ID=23848579

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000446407A Expired CA1209281A (fr) 1983-02-10 1984-01-31 Metallisation en couches a l'aluminium pour dispositif semiconducteur

Country Status (7)

Country Link
JP (1) JPH0666313B2 (fr)
KR (1) KR910008104B1 (fr)
CA (1) CA1209281A (fr)
GB (1) GB2135123B (fr)
IT (1) IT1213136B (fr)
SE (1) SE501466C2 (fr)
YU (1) YU18284A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763064B2 (ja) * 1986-03-31 1995-07-05 株式会社日立製作所 Ｉｃ素子における配線接続方法
JPH0719841B2 (ja) * 1987-10-02 1995-03-06 株式会社東芝 半導体装置
USRE36475E (en) * 1993-09-15 1999-12-28 Hyundai Electronics Industries Co., Ltd. Method of forming a via plug in a semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51112292A (en) * 1975-03-28 1976-10-04 Hitachi Ltd Semiconductor device
JPS55156365A (en) * 1979-05-24 1980-12-05 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
SE8400592D0 (sv) 1984-02-06
SE501466C2 (sv) 1995-02-20
IT8419546A0 (it) 1984-02-09
GB2135123A (en) 1984-08-22
IT1213136B (it) 1989-12-14
JPS59205739A (ja) 1984-11-21
KR840008215A (ko) 1984-12-13
JPH0666313B2 (ja) 1994-08-24
GB8402109D0 (en) 1984-02-29
KR910008104B1 (ko) 1991-10-07
GB2135123B (en) 1987-05-20
YU18284A (en) 1987-12-31
SE8400592L (sv) 1984-08-11

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Legal Events

Date Code Title Description
MKEX Expiry