SE459832B - Flerskikts kretskkonfiguration - Google Patents

Flerskikts kretskkonfiguration

Info

Publication number
SE459832B
SE459832B SE8501635A SE8501635A SE459832B SE 459832 B SE459832 B SE 459832B SE 8501635 A SE8501635 A SE 8501635A SE 8501635 A SE8501635 A SE 8501635A SE 459832 B SE459832 B SE 459832B
Authority
SE
Sweden
Prior art keywords
paths
circuit configuration
connection
multilayer circuit
circuit
Prior art date
Application number
SE8501635A
Other languages
English (en)
Swedish (sv)
Other versions
SE8501635D0 (sv
SE8501635L (sv
Inventor
M T Caton
F A Balash
R Meleard
Original Assignee
Mektron France Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mektron France Sa filed Critical Mektron France Sa
Publication of SE8501635D0 publication Critical patent/SE8501635D0/xx
Publication of SE8501635L publication Critical patent/SE8501635L/xx
Publication of SE459832B publication Critical patent/SE459832B/sv

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/0939Curved pads, e.g. semi-circular or elliptical pads or lands
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/063Lamination of preperforated insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
SE8501635A 1984-04-03 1985-04-02 Flerskikts kretskkonfiguration SE459832B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8405220A FR2562335B1 (fr) 1984-04-03 1984-04-03 Circuit multicouche flexible avec connexions entre couches soudees par voie ultrasonique

Publications (3)

Publication Number Publication Date
SE8501635D0 SE8501635D0 (sv) 1985-04-02
SE8501635L SE8501635L (sv) 1985-10-04
SE459832B true SE459832B (sv) 1989-08-07

Family

ID=9302775

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8501635A SE459832B (sv) 1984-04-03 1985-04-02 Flerskikts kretskkonfiguration

Country Status (7)

Country Link
JP (1) JPS60227497A (ja)
DE (1) DE3512237A1 (ja)
ES (1) ES295813Y (ja)
FR (1) FR2562335B1 (ja)
GB (1) GB2157085B (ja)
IT (1) IT1183552B (ja)
SE (1) SE459832B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999004453A1 (de) * 1997-07-16 1999-01-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Kontakt sowie verfahren zur herstellung eines kontaktes

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535008C2 (de) * 1985-10-01 1994-09-29 Telefunken Microelectron Folienschaltung mit zwei sich überdeckenden Leitungsträgern
DE3704498A1 (de) * 1987-02-13 1988-08-25 Aristo Graphic Systeme Verfahren zur herstellung eines digitalisiertabletts
DE3704497A1 (de) * 1987-02-13 1988-08-25 Aristo Graphic Systeme Verfahren zur herstellung eines digitalisiertabletts
GB2227887A (en) * 1988-12-24 1990-08-08 Technology Applic Company Limi Making printed circuits
GB2233157B (en) * 1989-06-13 1992-10-21 British Aerospace Printed circuit board
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
US5347710A (en) * 1993-07-27 1994-09-20 International Business Machines Corporation Parallel processor and method of fabrication
JP3587748B2 (ja) 1999-10-18 2004-11-10 ソニーケミカル株式会社 多層フレキシブル配線板及び多層フレキシブル配線板製造方法
DE10035175C1 (de) * 2000-07-19 2002-01-03 Fraunhofer Ges Forschung Verfahren zur Herstellung einer elektrischen und/oder mechanischen Verbindung von flexiblen Dünnfilmsubstraten
DE102005033218A1 (de) * 2005-07-15 2007-01-18 Printed Systems Gmbh Dreidimensionale Schaltung
DE102011109992A1 (de) * 2011-08-11 2013-02-14 Eppendorf Ag Leiterplattenkabelvorrichtung für ein Laborprobengerät und Laborprobengerät

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1456994A (en) * 1973-06-28 1976-12-01 Marconi Co Ltd Methods for forming electrical internconnection between metal layers for printed circuit assembly
FR2380686A1 (fr) * 1977-02-15 1978-09-08 Lomerson Robert Procede pour etablir une connexion electrique a travers une plaque de matiere isolante

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999004453A1 (de) * 1997-07-16 1999-01-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Kontakt sowie verfahren zur herstellung eines kontaktes
US6428908B1 (en) 1997-07-16 2002-08-06 Fraunhofer Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Contact and method for producing a contact

Also Published As

Publication number Publication date
IT1183552B (it) 1987-10-22
IT8520190A0 (it) 1985-04-02
ES295813U (es) 1987-06-16
GB2157085B (en) 1987-06-24
DE3512237A1 (de) 1985-12-12
GB2157085A (en) 1985-10-16
GB8508567D0 (en) 1985-05-09
FR2562335A1 (fr) 1985-10-04
JPS60227497A (ja) 1985-11-12
JPH0564880B2 (ja) 1993-09-16
FR2562335B1 (fr) 1988-11-25
ES295813Y (es) 1987-12-16
SE8501635D0 (sv) 1985-04-02
SE8501635L (sv) 1985-10-04

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