SE454643B - Sett och anordning for att pa ett kretskort montera elektroniska komponenter - Google Patents

Sett och anordning for att pa ett kretskort montera elektroniska komponenter

Info

Publication number
SE454643B
SE454643B SE8303330A SE8303330A SE454643B SE 454643 B SE454643 B SE 454643B SE 8303330 A SE8303330 A SE 8303330A SE 8303330 A SE8303330 A SE 8303330A SE 454643 B SE454643 B SE 454643B
Authority
SE
Sweden
Prior art keywords
components
component
mounting
circuit board
suction
Prior art date
Application number
SE8303330A
Other languages
English (en)
Swedish (sv)
Other versions
SE8303330D0 (sv
SE8303330L (sv
Inventor
A Andersen
K Bondergaard
Original Assignee
Sincotron Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sincotron Aps filed Critical Sincotron Aps
Priority to SE8303330A priority Critical patent/SE454643B/sv
Publication of SE8303330D0 publication Critical patent/SE8303330D0/xx
Priority to EP84850172A priority patent/EP0128888B1/de
Priority to AT84850172T priority patent/ATE36799T1/de
Priority to DE8484850172T priority patent/DE3473723D1/de
Priority to DE198484850172T priority patent/DE128888T1/de
Priority to US06/619,201 priority patent/US4617728A/en
Priority to CA000456299A priority patent/CA1216373A/en
Priority to FI842354A priority patent/FI842354A7/fi
Priority to NO842341A priority patent/NO842341L/no
Priority to ES533335A priority patent/ES8604710A1/es
Priority to DK287684A priority patent/DK287684A/da
Priority to JP59121646A priority patent/JPS6068699A/ja
Publication of SE8303330L publication Critical patent/SE8303330L/
Publication of SE454643B publication Critical patent/SE454643B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0053—Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Credit Cards Or The Like (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Detergent Compositions (AREA)
  • Die Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE8303330A 1983-06-13 1983-06-13 Sett och anordning for att pa ett kretskort montera elektroniska komponenter SE454643B (sv)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE8303330A SE454643B (sv) 1983-06-13 1983-06-13 Sett och anordning for att pa ett kretskort montera elektroniska komponenter
EP84850172A EP0128888B1 (de) 1983-06-13 1984-06-07 Verfahren und Vorrichtung für die Montage von elektronischen Bauteilen auf einer Leiterplatte
AT84850172T ATE36799T1 (de) 1983-06-13 1984-06-07 Verfahren und vorrichtung fuer die montage von elektronischen bauteilen auf einer leiterplatte.
DE8484850172T DE3473723D1 (en) 1983-06-13 1984-06-07 Method and device for mounting electronic components on a printed circuit card
DE198484850172T DE128888T1 (de) 1983-06-13 1984-06-07 Verfahren und vorrichtung fuer die montage von elektronischen bauteilen auf einer leiterplatte.
FI842354A FI842354A7 (fi) 1983-06-13 1984-06-11 Saett och anordning foer att pao ett kretskort montera elektroniska komponenter.
CA000456299A CA1216373A (en) 1983-06-13 1984-06-11 Method and device for mounting electronics components on a printed circuit card
US06/619,201 US4617728A (en) 1983-06-13 1984-06-11 Method and device for mounting electronic components on a printed circuit card
NO842341A NO842341L (no) 1983-06-13 1984-06-12 Fremgangsmaate og anordning for aa montere elektroniske komponenter paa et kretskort
ES533335A ES8604710A1 (es) 1983-06-13 1984-06-12 Metodo de montar componentes electronicos en una placa de circuito impreso
DK287684A DK287684A (da) 1983-06-13 1984-06-12 Fremgangsmaade og apparat til montage af elektroniske komponenter paa et kredsloebskort
JP59121646A JPS6068699A (ja) 1983-06-13 1984-06-13 プリント基板への電気部品の取付け方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8303330A SE454643B (sv) 1983-06-13 1983-06-13 Sett och anordning for att pa ett kretskort montera elektroniska komponenter

Publications (3)

Publication Number Publication Date
SE8303330D0 SE8303330D0 (sv) 1983-06-13
SE8303330L SE8303330L (sv) 1984-12-14
SE454643B true SE454643B (sv) 1988-05-16

Family

ID=20351561

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8303330A SE454643B (sv) 1983-06-13 1983-06-13 Sett och anordning for att pa ett kretskort montera elektroniska komponenter

Country Status (11)

Country Link
US (1) US4617728A (de)
EP (1) EP0128888B1 (de)
JP (1) JPS6068699A (de)
AT (1) ATE36799T1 (de)
CA (1) CA1216373A (de)
DE (2) DE3473723D1 (de)
DK (1) DK287684A (de)
ES (1) ES8604710A1 (de)
FI (1) FI842354A7 (de)
NO (1) NO842341L (de)
SE (1) SE454643B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3303951A1 (de) * 1983-02-05 1984-08-09 Standard Elektrik Lorenz Ag, 7000 Stuttgart Bestueckungstisch zum manuellen bestuecken von schaltungstraegern
DE3544526A1 (de) * 1985-12-17 1987-06-19 Telefunken Electronic Gmbh Montagegeraet zum einkleben von bauteilen in ein gehaeuse
SE458084B (sv) * 1986-11-19 1989-02-20 Gilbert Andersson Anordning foer halvautomatiskt ytmontage av smaa komponenter
DE3803324A1 (de) * 1988-02-04 1989-08-17 Molter Gmbh Dr Einrichtung zur temporaeren kennzeichnung von bestimmten bearbeitungspositionen innerhalb eines arbeitsfeldes
DE3813097A1 (de) * 1988-04-19 1989-11-02 Adalbert Fritsch Geraet zum bestuecken und/oder verloeten bzw. verkleben von elektronischen bauelementen auf leiterplatten
JPH0810795B2 (ja) * 1989-09-06 1996-01-31 松下電器産業株式会社 電子部品の実装装置及び実装方法
US5426361A (en) * 1991-09-09 1995-06-20 Simmons; Selwyn D. Electronic reconfigurable interconnect system
US5339939A (en) * 1992-08-31 1994-08-23 Cna Manufacturing Systems, Inc. Pocket tape feeder system

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA968439A (en) * 1971-05-26 1975-05-27 Western Electric Company, Incorporated Video controlled positioning method and apparatus
US3933187A (en) * 1974-03-05 1976-01-20 Stromberg-Carlson Corporation Controlled epoxy dispensing technique as related to transistor chip bonding
US3958740A (en) * 1974-07-08 1976-05-25 Dixon Automation, Inc. Automatic component assembly machine and method relating thereto
JPS52124168A (en) * 1976-04-12 1977-10-18 Matsushita Electric Industrial Co Ltd Method of assembling electronic device circuit
US4116348A (en) * 1976-07-19 1978-09-26 Deval Industries, Inc. Component locating apparatus
US4135630A (en) * 1977-12-08 1979-01-23 Universal Instruments Corporation Centering device for automatic placement of chip components in hybrid circuits
US4292116A (en) * 1978-04-18 1981-09-29 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on a printed circuit board
GB2034613B (en) * 1978-11-09 1983-01-19 Tokyo Shibaura Electric Co Method and apparatus for mounting electronic components
FR2446582A1 (fr) * 1979-01-12 1980-08-08 Rech Const Electro Et Positionnement de microcomposants, notamment pour les circuits a couches epaisses ou a couches minces
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Industrial Co Ltd Device for mounting electronic part
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Industrial Co Ltd Device for mounting electronic part
JPS55118690A (en) * 1979-03-05 1980-09-11 Matsushita Electric Industrial Co Ltd Device for carrying electronic part
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system
US4527324A (en) * 1981-05-06 1985-07-09 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
GB2108015B (en) * 1981-08-24 1985-03-06 Tdk Electronics Co Ltd Apparatus for mounting chip type circuit elements on printed circuit boards
JPS5954292A (ja) * 1982-09-21 1984-03-29 松下電器産業株式会社 印刷配線板の製造法および加熱装置
US4528747A (en) * 1982-12-02 1985-07-16 At&T Technologies, Inc. Method and apparatus for mounting multilead components on a circuit board

Also Published As

Publication number Publication date
FI842354A7 (fi) 1984-12-14
JPS6068699A (ja) 1985-04-19
NO842341L (no) 1984-12-14
ES8604710A1 (es) 1986-02-01
SE8303330D0 (sv) 1983-06-13
EP0128888B1 (de) 1988-08-24
US4617728A (en) 1986-10-21
DE128888T1 (de) 1987-01-15
DK287684A (da) 1984-12-14
DK287684D0 (da) 1984-06-12
CA1216373A (en) 1987-01-06
SE8303330L (sv) 1984-12-14
ATE36799T1 (de) 1988-09-15
EP0128888A3 (en) 1985-12-11
FI842354A0 (fi) 1984-06-11
EP0128888A2 (de) 1984-12-19
ES533335A0 (es) 1986-02-01
DE3473723D1 (en) 1988-09-29

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