SE454125B - SUBSTRATE MATERIALS FOR PREPARING PRINTED CIRCUITS - Google Patents

Description

.in 10 15 20 25 5U 454 125 2 h-methylpentene is applied to the laminate. This coating is then roughened with carbon sulfuric acid or the like, so that finally the metal line image can be applied to the roughened surface. The adhesion of the acrylic-butdione-styrene polymer and also of the poly-methylpenylene is low and the heat resistance is not sufficient for the usual soldering conditions. In addition, the surface resilience is too low, so that this known material is not good enough for the production of printed couplings.

Known techniques for promoting adhesion can also be better understood if one considers the type of substrate used. Organic coatings and materials, the surfaces of which can be provided with electroless metal coatings, which how commercially acceptable adhesion, i.e. the peeling strength is at least 1.2 newtons per mm wide, has so far ended up in distinct classes according to the tram sealing method and the necessary chemical treatment to ensure sufficiently adherently electrolessly deposited metal coatings on these.

Materials of the first type used to form an adhesive coating on a suitable substrate usually comprise a dispersed phase of synthetic rubber, e.g. butadiene or acrylonitrile butdicine polymers in a matrix of materials, e.g. mixtures of epoxide and phenolic resins.

The material of the dispersed phase of these substrates is easily degraded by oxidizing agents, e.g. chromium or permanganate-containing etching solutions, while the matrix phase is less reactive towards these agents. After the oxidation treatment, the substrate surface is micro-pink and hydrophilic and is suitable for further treatment in known electroless metal coating processes in combination with or without electroplating steps. fn other common type nv hnrtshaltign underlag, l.ex. certain epnxi- uvh pnlysnlfunmntnrinl, which are sometimes denoted enfa fi malerial, erfnrdrnr ell obligatory step before etsjngsuteget for formation mikrnpnrösa ytnr: pnlära and tense nmràdnn or ylnr, \ ilkn selective nngripun in nxidatinns- u. 25 25. must be created, usually by contacting a surface solvent with a surface solvent, so that permissible calls are preferably made in this area at knntnkl months vtsmrdlnt. This procedure has become known as the "swelling and excision technique".

In the swelling and etching technique, the surface of a laminate impregnated with glass-reinforced epoxy resin is treated with a solvent and then with a strong oxidizing agent, e.g. chromic acid, for removing parts of the surface and producing a microporous, hydrophilic surface suitable for adhering electrolessly deposited metal deposits. This technology did not in itself provide acceptable surface resilience, as the nxidine could not penetrate deep enough to allow contamination of the nlasduknet lminate core. To avoid this problem, special grades of laminate have been suggested with the use of "butter coatings" of epoxy resin over the glass fibers. Using these grades of laminate, it has been possible to produce printed circuits with an insulation resistance of 100,000 meganhm. However, variations in the cure of the "butter coating" from one manufacturer to the next and from batch to batch by the same manufacturer require that the process be defined for each batch. For this reason and due to the difficulties of reliably obtaining uniform "butter coatings", attempts at industrial production have not been successful. Another disadvantage of this method is the frequent poor bonding in large areas of exposed metal during soldering.

It is also well known that certain plastic materials are metallised for decorative applications by the fact that the former are diluted in strong oxidizing oxygen. Plastic materials, which are rich in plastics, include acrylonitrile butadione exudates, nnlyphenylene oxide, pnlysulns, nucleic carbons and nylon. Acrylonitrile-bntadiene styrene has been proposed for use as a film in the initialization of printed powdered granules, but it has been suggested that they may be suitable; dnsn Uindninnshüllfnuthvt was only 1 nnwlnn / mm nvh mut- 454 125 lU 20 4 s \ n'undv tryvkta krntsknrl kundv intv mntntñ lüdninqntvmpv- i ': il |||' i ~ ii. lnrmndc pnlysulfnnor has been used in myvkut beqrñn »sudv menqdur as a basmnlurial for printed circuits nch vndnst 1 hüqtrvkvunstillämpningnr, where pnlysulfnnvns low divlnktrl- citvtsknnntnnt and lossfaktvt is of sufficient bln.

The equipment used for polysulfone circuits has not been widely used, in particular because of the extreme difficulty in processing and also because of the high format of the material. When spraying powder sulphon material for use as a pressure cooker, it is necessary to run out or reduce voltage for at least 2 - A hours: 6 - 8 hours is preferred. Thus, two steps are required during a typical cycle to produce printed circuit boards. Excessively rough expiration of the pntysullnn materials must also be avoided to prevent brittle and other harmful effects from occurring.

It is an object of the present invention to provide a better method for forming substrates for adhesive mutallation and better substrates for downstream electrolyte insertion thereon.

A better object of the present invention is to provide a new surface-free material having the ability to receive electroless bit metal attachments without providing robust and durable emulsifying objects of these insulating materials.

The sole object of the present invention is to provide a critical source for the use of such substances. whereby krvtsurnu has a high external resistance. excellent hindninnuhntl- t "n:; tl1vt inn-llzin yt url rzrll k11 \ t:; P | i Livti tlvri (1íir |> ü v idliüt't: | n | lv ntrömtñst allocated mvlnllvn, excellent stnhilitvt at lñdtvmpn_ rm mvd rvprndnrcrbaru förfn'nnd0n nrh kun rvpurvrnn undvr tällmänninn forhñllnndnn. l'tt nnnnt: zyflv nnwl tippfilinirigvn är: att tlllliznidn- hnlln vlt llvrukiklsknrt mvd styrd impvdt n u | kv | \ :. 5U 55454125 LNX wool achieve dv | dvl lürvqñvndv nnqxvnu svllvnu xnnv_ lnllnr lürrlxnqnndo upplxnnxng yl hüllrv ümnv. Dvl lrnmqür nl Följandv buukrxvningcn all bnsmulvrinlvl ullvr ümnvl vnlu al uppfinnxnnun. SNM is appropriale Sat frmmslällnxnn of lryrkln krnlsknrl. xnnvlnllnr cII substrate llll vilkvl on mxnsl rn yla hällur vn in advance bjldud lxlm vllvr fulin nl vn lrxmn ~ plusllsk nrgnniuk höglompnralurpnlymvr, which polymvr how ell aromnllskl skclull, which inlv blxr llylnnde cllnr lvlvldr- delx : nxde.

In addition, the present invention provides substances for the development of wrinkles required by the present invention. sun ixnuxfnllar all nuux försvx'xnxnsl nn av ylxnwxn av çll undvr- l fl q. which is selected from mvlaller nrh xsnlrrundv mnlvrzul. mvd ell pälugl sklkl av en förformad fxlm vllvr fnlxn av en énrmn- plasljsk pnlymer med ell aromaljskl skvlvll. som inlr hlxr flylandv cllvr sündurdelas vid masslödninqslörfarandrn; nrh all man unite the parts lill a nnhel qvnnm värmnjng nndvr lrxck.

U fl l is Pll nnnal syflc with lörvllggandv invention all anvxsa vn nammansall cnhcl invvande ell melalljskl or xsnlvrnndv underlag and on at least vn of ylnrnu ax nndvx- lagel un lörlormad lulie of dun lermoplaslxska pnlymvrls pnlymvrls pnlymvrls pnlymvrls.

He has found, all such summnnsalla vnhnlvr xnlc Försprödns nndvr benrbulnjng and benotzennxnq and qvr llrkln krvlsknrl mvd ulmarkla values of) lrPnislnn fi. l.xx zlxxxxxxxx: xxx víjxx ulnylljnn är lryrkln krulsknrl mvd llvr än ull krrlnmönulvr på nn sida ul nndvrluqvl och lrnmnlällnxnn nv dvssu kn fl ull nlqänqsmulvrxul mvd vn försln mvd vn försln. xnnvfullnr lüruür vll som mun mxnnl vn ylu uv krvln. lnmplxnl lryvkl nvh ull mun förnur Ölmxnulnnn vl fl rvun unm är nl-. f ruulud mvd krvlnmönnlrvl. mvd ull skxkl hr fi lüvndv av vn lüx- lurmnd lnlxv nx den lwrmnplnnlxukn nnlymvrvn, nvh ull mun hn- hnndlnr ylnn nx lnl | vn mvd vll lñunxnnnmndvl nvh nvdnn mndal means 454 125 6 and providing the treated surface of the finline with a second printed circuit pattern; and that the sequence is repeated with the application of preformed polymer foil and the formation of conductor patterns as many times as desired to connect selected conductors at different levels can b. holes which pass through the conductors and have metallized walls. be used.

In another embodiment, the conductor scores are kept at one level. which are to be prevented by conductors of a later arranged level, free from the polymer foil or released after application of the foil therefrom, and the respective conductors in the second level being formed so that the formed metal deposit covers the free (exposed) surface areas of the respective conductors in the first level. Other embodiments of the present invention will become apparent from the following description.

By the "B-state" as used throughout the specification is meant that the state of a composition, in which some but not all of the active molecules are crosslinked, and which can still be softened by heat.

By the "C-state" used throughout the specification is meant the state in which a composition has reached its substantially final state of polymerization, where crosslinking is common and the composition is a thermoset, and is substantially insoluble and indigestible. .

The laminated blanks of the present invention represent an improvement over the substrates used heretofore. In the present invention, thermoplastic, high temperature organic polymers are used as a surface layer for a substance. Surface layer has a thickness of preferably at least 10 μm, e.g. more than 25 μm and preferably more than 50 μm: 1 in general the thickness of the polymer surface is less than 500 μm, preferably less than 125 μm and in particular less than 35 μm. One or more layers of a thermoplastic polymer are glazed in each other and laminated in one or more layers of reinforcement. which is impregnated with hnrts of "B-lill- 10 15 20 25 454 125 7 stand", e.g. glass film, fabric or paper, under heat and pressure to form a rigid substrate for lyrical pattern cards.

The present invention relates to a simple and economical method for producing blanks with substantially flat surfaces, which can be adapted to receive or layer a pattern of conductive metal by electroless flour deposition.

The invention relates to an insulating substrate which is suitable for use in printed circuits. The backing material can be prepared by any means: - produces clay-plastic films or sheets with a substantially uniform thickness of between about 10 and about 500 μm, which thermoplastic material has an aromatic skeleton which does not become liquid or decompose at a temperature of, for example, 2 ° C five seconds at this temperature; provides a fibrous sheet or fibrous web impregnated with a curable resin or layers of impregnated fibrous sheets or fibrous webs; n - placing at least one of the films or sheets on at least one of the layers of hardenable impregnated fiber sheets or webs; consolidates, preferably between flat pressure plates, the object thus produced and hardens the part of the curable resin by heating under pressure.

The present invention relates to a substance suitable for use in printed circuits, which substance comprises: - an insulating substrate which has on its one side or on opposite sides an thermoplastic organic high temperature polymer with a thickness of between about 10 and about 500 microns, which polymer has an oral skeleton which does not become liquid or decompose at a temperature of ZASOC upon exposure at this temperature for 5 seconds.

Substrate materials according to the invention can be used to produce a laminate comprising the substance described above and in addition an electrically conductive ilietallza layer, which is iiverlzigrzil and liiiftni 'want ytziii of iinly- 454 125 "Un 10 20 25 50 8 multilayer and skíkten. The polymeric oil coil acts as a binder between the mutal layer and the hardenable substrate. For all laminating a metal on an reinforced polyester backing, for example, a metal film and a thin thermoplastic film can be compressed with an armored polyester backing to join these three or the thermoplastic film surface of the blank can be treated with an oxidizing film. agent or a plasma to form a hydrophilic surface susceptible to subsequent metallization and provided with an electrolessly formed metal coating.

Substrate material according to the invention can also be used to produce a multilayer printed circuit board. Procedure comprises providing an insulating substrate with a circuit pattern attached to at least one of its surfaces; - applying a layer of, for example, a polysulfone foil over the circuit pattern and the circuit patterns, respectively; - treating the polysulfon surface (s) with a solvent and oxidizing agent to make the surface (s) microporous and hydrophilic; - electrolessly deposits a metal on the treated surface (s).

Any known curable resin for use in the manufacture of insulated substrates for printed circuits that the material (s) used together with others provide the desired properties can be used in the present subject, provided the properties of the finished substrate. Examples are allyl phthalate, Furan, allyl resins, glyceryl phthalates, silicones, polyacrylic acids, phenol-normaldehyde and tri-furfural copolymers, alone or mixed with buladivnacrylonilrile copolymers or acrylonilrile-butadiene-styrene-formaldehyde copolymers, carlylnilrylformamide. modified melacrylic resin, polyester and epoxy resin. Phenul formaldehyde can be used if the requirements are not restrictive.

Phoxide resins are preferred when stringent properties are required. for the impregnation of fibrous tapes or fibrous sheets, which harden in the present process, it can be used in any convenient form or manner, but a non-fibrous film is preferably no. Inst 1 vit Ihmplnnt modlum. The weight of solid resin substances 1 lnrkvl n: | nltmänhvl: utv krttlsk, but it chooses to crhàlln vpnxld-qlastyqknmposldvr nnnohållande about 55-70%, l.v \. rlrku 55 to 55 tlktprocnnl fnul resin.

The rsolvrnndv houses according to the present invention need not be original. It can thus be made of non-primitive insulating material, e.g. inorganic terns and milled, such as ceramics, ferrlt, carborundum, glass, glass bondal, glitter. steatlt and others.

In addition, metal sheets can be used as a substrate to be covered with the preferred clay-topsheet with resin or of one or without intermediate layers of a curable material impregnated with such a resin.

Suitable thermoplastic materials for foils are: thermoplastic high-temperature polymers with an aromatic backbone and which do not become liquid or decompose at a soldering temperature, e.g. 2b5OC, after five seconds force this temperature. Examples include polycarbonate, polysulfone having the following repeating unit: @ '= (fl = CJ polyotene sulfone with the following repeating unit: f' l lÛ ° rt L \ .: ~ ._. / And polysulfone.

As can be seen from the above structural code, each aromatic unit in the polysulfone is bonded to its QFGHHO with RH-502 sulfonylene, called a sulfon bridge. Similarly, each aromatic unit in the polysulfone is bonded to a neighbor with a -SÜ2_5ub5 | J an endp ooh nch a -0-ßuhslitucnt 1 a second end, hvtvcknad otvrhjnd- 454 125 ef: 10 15 20 25 30 10 ning. In addition, it appears that each substituent is supernatant of four carbon atoms in the aromatic moiety, e.g. para- substitution.

Certain grades of these thermoplastics in cast sheets, rods and / or foil form can be treated to make the surfaces of these materials susceptible to adhesive metal coating.

These materials have been widely used for, for example, decorative purposes for cars, electrical components, medical tools, food processing and for dairy equipment.

For illustrative purposes, the following discussion is directed to certain qualities of polysulfone. It is known that various grades of polysulfone are characterized by toughness, low creep and thermal and hydrulytic stability over a long period of time, including several years of continuous use in boiling water or steam and air over a TSÛOC with little change in properties. Polysulfones meet Underwriters' Taboratories ïermal Index requirements for t5ÛoC; they retain their properties within a temperature range of -1Ü0GC to more than t5U0C. They have a thermal deflection temperature of about 17 ° C at 1.8 MPa (264 psi) and about 181 ° C at 61 MPa (6 psi). thermal aging for a long time at 150-ZÛOOC has little effect on the physical or electrical properties of polysulfones. Pulysulfones can be prepared by the nucleophilic substitution reaction between the sodium salt of 2,2-bis- (α-hydroxyphenyl) propane and H-4'-dichlorodiphenylsulfone. The sodium phenoxide end groups are reacted with methyl chloride to terminate the polymerization and this regulates the molecular weight of the polymer and contributes to thermal stability.

The chemical structure of polysulfone is characterized by diarylsyltin groups. This is a structure with strong resonance, in which the sulfone group tends to draw electrons from the tenyl rings. The resonance is enhanced by the present pairing to Excellent by the oxygen atom in the sulfone group. resistance to oxidation is obtained in polysulphones when electrons are bound by resonance. Likewise, the sulfur content at its highest nitrogen concentration increases, which increases the strength of the windings included and fixes these groups to a planar configuration. Della gives the polymer chain a charter. which are maintained at high temperatures.

The ether bond provides some flexibility to the polymer chain, which imparts internal toughness to the material. The sulfone and ether bonds connecting the benzene rings are hydrolytically stable. Therefore, as shown above. polysulphones resistant to hydrolysis and to aqueous acidic and alkaline environments.

Suitable grades of polysulfine according to the present invention include, for example, a grade without filler, e.g. P-1700 series used for injection molding or extrusion; a higher molecular weight series P-3500 series: and a mineral-filled polysulfone, which is useful for extrusion applications, e.g. laying applications, e.g. The P-6050 series (the P-1700, P-3500 and P-6050 series are all commercial Union Carbide Corporation, 270 Park Avenue, New York, NY 10017).

Polycarbonates are linear, available from low molecular weight low-crystalline polymers (about 18 ÜÜÜ), in which the crosslinked groups are carbonate groups. Polycarbonates have a combination of very valuable properties, which include: (1) very high impact strength (87 kp .cm / about notch) together with good ductility; (2) excellent dimensional stability together with low water absorption (0.35% immersed in water at room temperature; immersion in boiling water does not change the dimensions more than 0.001 cm / cm); (3) large thermal deflection temperature clock possibly about TJSUC; (5) superior heat reselens that exhibit excellent resistance to thermal oxidative degradation; (5) good electrical resistance.

The present laminated lermoplastic polymer foils provide high performance bonding model, suitable for pattern applications with low performance properties. which are superior, i.e., obtainable with 454,125 in prior art resinous and rubbery curable adjuvant mixtures. The surface (s) of the thermoplastic foils of the present blank have a substantially uniform thickness and can be chemically treated with known techniques to obtain excellent adhesion to later electrolessly deposited metal coatings during the production of printed circuit boards.

It is known that these high temperature polymers, especially polysulfones, when used alone require long secondary annealing to prevent stress fractures.

Typical recommendations for expiration conditions are 2 - 6 hours and up to 9 hours at 170 ° C before processing. Yt-. an additional long run-out cycle is required after machining the material before etching the surface for later metal coatings. As can be seen from the following, the material and / or the laminate are annealed and produced according to the fact that when the present thermoplastic polymer foils e.g. of the invention simultaneously in one step. It has been found that polysulfone is laminated to an insulating substrate according to the present invention, the thermoplastic polymer foils are relaxed during the lamination cycle. This eliminates the need for the previously stated laborious and time consuming secondary expiration steps.

According to an embodiment of the present invention, blank is formed by arranging impregnated layers of the insulating substrate and preformed thermoplastic foils or sheets in the form of a laminate and laminating it under heat and pressure, e.g. at 1600C and 1.4 MPa for a maximum of 60 minutes. The lamination step can be performed in a conventional press using known conditions for producing impregnated laminate with curable resin with substantially flat surfaces. Suitable curing cycles are, for example, 10-60 minutes at 120-18ÜUC and 1.5-10 MPa.

Other methods of preparing the present substance may be used. For example, a laminorate insulating substrate may be dipped in a polysulfone, which prevents the thermoplastic fouling. It is well known that all on 2 - 5% solution of polysulfone in methylene chloride can be used to obtain strong bonding at room temperature. A polysulphone foil, for example, may be bonded to, for example, an insulating substrate by dipping the foil and the substrate in a polysulfone methylene chloride solution, drying in air for 15 seconds and then assembling them in a jig and placing them under a pressure of about 5. & MPa l S minutes.

After removal from the press plates or the like, which is used in the described lamination step, the blank formed in this way can be used in the production of printed printed circuit boards. In another preferred embodiment, a thin metal oil may be superimposed on one or more surfaces of the blank and adhered to form a laminate. Blanks of the type described above can be used for the production of printed circuit boards with ctt; two and more layers, with or without metallized holes in the manner described below.

In a way of producing printed circuit boards, the so-called "semi-additive" technology. The present insulating material is cut to size and holes are made by drilling, punching or the like. The surface of the substance is exposed to attack by an etching solution or abrasive treatment. It is assumed that the surface of the substance can be mechanically roughened before the oxidation treatment to replace the pretreatment with the solvent. The term "solvent pretreatment", which includes terms used herein, also refers to the reversal of a mechanical roughening step instead of the solvent treatment. A typical mechanical roughening is sandblasting of the surface of the substance with a slurry of abrasive particulate material, such as sand, alumina, quartz, carborundum and the like. which passes a screen with a mesh size of 0,15 mm (100 USA Sieve Series mesh).

The solvent-treated resin is then chemically and mechanically treated with an oxidation solution to activate the surface of the substance. 454 125 conventional conventional electroless coating method was used to deposit a thin layer of copper on the activated surface of the blank and, if and when desired, on the hollow walls. A temporary, protective coating or resistive v-layer was used to fabric print a circuit pattern with 0.35 mm lines. The temporary resistance is heat cured. The circuit pattern is built up by electroplating metal on the unhealed areas of the substrate. The temporary resistor is removed and the thin layer of electrolessly deposited metal, t0, which was covered by the mask, is etched away with an acid. Alternatively, the temporary protective coating may be a photoresist.

In another method of producing printed circuit boards, known as the "fully additive" technique, a suitable insulating substance is prepared according to the present invention. wherein a polysulfone, polyether sulfone or polycarbonate surface layer is laminated on a suitable substrate, e.g. a npnxid resin and fiberglass reinforced card. Holes are made in the blank at predetermined positions. The blank and the walls of the holes are surface-treated in the manner described above. A foot imaging technique was then used. The substance and the holes are completely covered with an aqueous copper compound, which is reduced by ultraviolet light, and 'orkas. An ultraviolet photo image is formed by projection or contact printing on the sensitized substrate and a metal, such as copper, is deposited without current on the exposed pattern and in the holes until a circuit is built up to the desired thickness. In general, it is desirable to pre-treat the surface with an agent, e.g. dimethylformamide or dimethylsulfoxide before or during the oxidation process in an oxidizing agent. Suitable solvents and mixtures thereof for ca: L .. swelling of polysulfone include especially dimethylformamide, arntophenone, chlorine form, cyclhexanone, chlorobenzene, dioxane, methylene chloride and tetrahydrinfuran.

Depending on the particular surface of the substance, other exchange-inducing materials may be used to effect the above-mentioned temporary reaction. Lxnmprlvin has acidic sodium chloride, hydrochloric acid nrh ya 20 25 åh 55: Q 454 125 tb hydrochloric acid, hydrochloric acid, boralcr, flnorohnratvr orh sodium hydroxide as well as mixtures thereof, have been found to be vftuktlvn to describe the different types of visuals. .

The acidic oxidizing agents typically used to decrypt the acrylonitrile-bentadiene-styrene substrate have been found to be satisfactory for polysulfone substrates. A typical composition consists of 60% by weight of H2SQA, 10% by weight of CrO3 and 30% by weight of water.

During etching, the chromium that comes into contact with the pretreated polysulfone surface is reduced from Cr + 6 to Cr + 3. When most of the chromium is reduced, the acid is no longer as effective in improving adhesion to metal bulb deposits. For this reason, it is desirable. that you have as much fl kct chromium as possible in the acidic conditioner.

With dimctylformamide as the preconditioning bath, high chromic acid contents of more than about 5% lead to macro-cracks and poor adhesion. A preferred acidic conditioner for polysulfonic surfaces is therefore, with respect to the weight: 55.9% H 2 SO 4 (96%), tU, &% H 3 PO 3 (85-87%}, 30.7% water and 5.0 CrO 3.

In an alternative "fully additive" technique, the substance and the cavity walls are activated after exposure of the surface to make it polar and microporous using known inoculants and sensitizers, e.g. tin (II) chloride - palladium chloride.

A permanent protective coating or racist is applied to produce a permanent base substrate which leaves the desired circuit pattern exposed. The hard core and copper are deposited without current on the exponoradv patterned and in half. lüreliqqandv substance may alternatively be catalytic. t.ox. kalalytic food vrul is distributed on dfiltu. l dvn in dot förngâunde specified technique for production nv tryrktn mönntnrkurt climinrrar this hohovnt for »tt separate ymp_ r fi txqn- ollxvr sieruazbi lisserifiguz fl og.

Among the materials used as substitute pigs as the lumber for the purpose of a pressure gauge number 454 125 10 15 20 25 50 lb are mentioned insulating curable resins, thermosetting resins and mixtures thereof, including fibers, e.g. fiberglass, impregnated embodiments of the foregoing.

An adhesive layer comprising metal substrates may be present on the blank. The subject can e.g. aluminum or steel. which preformed foils of shells etc. are coated with insulating layers of thermoplastic polymers. If the conductive pattern includes metallized holes, it is preferred to first provide metal blanks with holes and coat the blank with putter melting techniques, e.g. fluidized bed, with a suitable insulating layer.

Among its embodiments, the present invention relates to metallized substances on which the electrolessly deposited metal, e.g. copper, nickel and gold, have been further built up by connecting the electrolessly deposited metal to an electrode and electrolytic deposit thereon of the same or another metal, e.g. copper, nickel, silver, gold, rhodium, tin and alloys thereof. Electrolytic coating methods are well known and conventional.

The present invention is further described by: reference to the drawings, which illustrate certain embodiments of the invention, and together with the description, illustrate the principles of the invention. Fig. production of printed circuit boards 1-3 shows the method which can be used for from insulating blanks prepared according to the present invention. tig. 4 shows an apparatus for producing a substance according to the invention. fiq. 5 shows an apparatus for producing an iron, in which the solid sulfur is applied to a solid substrate. Fig. 1A shows an insulating substance 10 according to the present invention. The insulating material 10 comprises an inner core 12 of thermoset and outer surface layer of the aforementioned plastic film. The core 12 is catalytic for electroless deposition of metal. Polystyrene life is also kutalytic for electroless deposition of metal. l lig. lß is hole 16 nvh l fl hnrrndn through the substance. The substance IU is immersed in a tür- 10 20 30 454 125 17 hchandlingshad and then treated comically with an acid- Crüšó 350 mg / l H25U¿, 50 g / 1 - 65 C to expose cat- 10, tig. solution of, for example, 20 g / l Nat, the lysator and activating the surface of the substance at a temperature of δ as shown in 1D) on a tig. 1C. A Fntorcsist 26 is applied (shown in the surface of the blank to mask areas which would not later be coated with copper. Copper is then electrolessly deposited in a known manner on the walls of the holes 16 and 18 and on the exposed surfaces of the blank 10 to a conductive copper pattern 22. , as Fig. 1E.

A solder mask 50 can be applied is about 55 μm thick, shown in Photorcist 2A is then removed, shown in fig. 1h. over the circuit pattern leaving holes 16 and 18 exposed tfiu- tel ..

I tig. 2 shows an additive procedure For manufacturing. insulating substance 100. ning of a multilayer printed circuit board. In 2As printed circuit patterns 102 are attached to a preformed polysulfone foil 104 is superimposed and bonded to the printed cts pattern 102 (FIG. ZB). A hole 106 is then drilled through the polysulfone foil 104, the printed circuit pattern 102 and the 100 (FIG. ZC). The surface of the polysulfone film 104 is adhesion tightening using the insulating material previously described. The surface of the polysulfone foil 104 is activated by immersion in a palladium and tin solution.

In Fig. 2D, a photoresist image 110 is superimposed on the outer surface of the polysulfone foil 106. The free foil surface 104 and the holes 106 are electrolessly coated with copper 112 to a thickness of about 55 μm (Fig. ZE). In Fig. ZF 110 has been removed due to the fact that the layer storage card has been retained, the photoresist image has been kept. a method of Fig. 3A is a blank 200 coated on molar side sides with copper 201. ttt 202 is mad to hole J tig. 5 shows a semi-additive production of selected multilayer printed circuit boards. In the first or inner circuit pattern made with conventional sulfonic life 200 (e.g. etaning and covered zu). The blank 200. The blank 200 is adhvuionshufrämjandv and kntnlysH ~ layer of dry-shaped poly- 216 is drilled by turn for receiving ntrömlönl hildadv mntnllskayter and vn 454 125 u. 10 15 20 50 18 electrolessly deposited copper film 211 is applied to the polysulfone and to a thickness of, for example, 2 μm (Fig. 3C). A photoresist image 210 is applied and additional copper 212 is electrolytically deposited into a copper layer having a thickness of about 35 microns (Fig. 50). l tig. 5L, the totoresist image 210 is removed and the copper film 211 below the photoresist 210 is etched with a suitable etchant.

Fig. 0 shows a method of producing an insulating substance. This figure shows feed rollers 100, 102 and 104. Thickness of about 1.6 mm, which carrier is woven glass, not Around the roller 100 is laid a carrier 106 with a woven glass, dakron, raven, cellulose paper and the like, impregnated with resin . preferably thermosets such as epoxy plastic, but high temperature thermoplastics, e.g. polyimides and polycarbonates, can also be used. A thermoplastic foil 108 with a thickness of 1 - 5 mm is wrapped around the food exchange 102. Wrapped around the roll 104 is also a thermoplastic foil with a thickness of 1 - 5 mm. The thermoplastic film may, for example, be a polysulphone. polyether sulfone or polycarbonate film. The figure also shows combined take-up rollers 110, which apply heat and pressure to the laminate passing through them. A temperature of about 160-200 ° C and a pressure of about 30-400 N / mm are typically applied between the rollers 110. A flexible laminated base material 10 according to the present invention leaves the tube. 1 tig. 5 shows a roll application on a rigid substrate 12, e.g. 8 mm thick epoxy glass fabric reinforced laminate. The figures show the feed rollers 100, 102 and 10A.

Around the rollers 102 and 104, thermoplastic sheets 108 with a thickness of 1 - b mm are wound. The figures also show combined extension number 100, which applies heat and pressure to lominatvl. passing metlnn them. A temperature of about 160-ZÜÜUU and a pressure of about 30-400 N / mm roll lnrnn 111). It piitörc fi typically: of insulating iron fidr »iinrlcrlaciet 12, as puusnrnr mnllnn vnlnnrnn 110, and dn tcrmnplnstiskn lU 20 50 55 454 125 19 tnliernn laminated on mntutäende surface nr of 12 under heat orh pressure for formation of the substance 10, the rollers 110. Optionally, the 12 is coated with an insulating substrate polysulfone binder comprising nolysulfone dissolved in a solvent prior to application of the thermoplastic film.

The following examples illustrate the invention.

Example 1 Eight layers of glass fabric impregnated with high 55% by weight epoxy resin were placed in a laminating press with a sheet of preformed silicone foil, 50 μm thick, both above and below. The polysulfone oil was prepared from Udel P-177 (R) a pressure of 4.1 mPa without residence time in the hot press of After 15 0 polysulfone resin. A lamination temperature of 175 ° C, 15 minutes was used. minutes, the press was cooled to room temperature and the blank was taken out. The workpiece was processed into a printed circuit board using the following steps: (1) Through holes in the workpiece; (2) the substance was brushed to remove the hurray fragment (it should be noted that no baking or baking was required after drilling) (5) the substance was dipped in a dimethylformamide aqueous solution (density 0.955 - 0.965) for 5 - 6 minutes. (4) the substance was rinsed 1 hot water for 45 seconds; (5) the surface of the substance was adhesion-protected at a temperature of ESOC for a period of 7 minutes with the following solution: Crüš 2U g / 1 Hšrnà inn ml / 1 ltzfitla (itltl fl ll / l FC-98 * 0.5 q / l * tf-98 is vtt unjnniskt pnrtlunrnntkylnultnnnt; tóš subject nkötjdvu 1 dvstillernt water; (7) Cr (Vl) nvnlrnlisnrndvs with a solution containing 10% H70, uvn ts m H, sn Z 6: v- 10 _ »u »20 BU V: 454 125 2U (8) - (11) the substance is rinsed J vnttvn, dnppadvs successively 1 2.5 HHCJ, an implant solution, described in Example 1 of pntvntskriftvn 7áÜ97t7-I, nch en accvlvrutor (5% Hßfal; (12) knppnr was deposited without current on the substance to a torklvk of 2.5 pm; (15) - (lä) the copper-coated substance was rinsed iv atlcn and tnrkadns at 125nC for 10 minutes. [tt pattern cards were prepared using the copper-plated blank and prior art, for example, a background resist was printed; If a copper circuit pattern was formed by electrolytic precipitation, the resistance was removed and the expanded copper was exposed hard. A peel strength of 1.7 N / mm measured ps For the printed circuit board.7 A flow solder test was also performed. A copper pattern, 6.25 cm is the printed printed circuit board (made according to this example) kept liquid on molten solder at 26 ° C for 10 seconds.

The sample was removed for examination of potential blisters and / or delamination of the copper pattern from the substance. No blisters or delamination were detected.

Example 2 Example 1 was repeated except that a laminating ring pressure of 2.8 MPa and a residence time of 1 laminating principle of 1 .mu.m were used. A final peeling strength of 2.4 N / mm measured and a copper pattern, 6.25 cm, was kept floating on a solder bath at 260 ° C for more than 10 seconds without any scratches or delamination.

Example 3 Example 1 was repeated except that a laminating pressure of 1, u HPu and a leaching time in l 'rt t-t-lmminrningsprssn of 5 minutes were used. lnminnrinq stahilisrcadcs the subject at IGÜUC 1 1 hour 1 vn uqn with rirkulernndc hot air to prevent shrinkage of krympnlnn nch sknvninq during hvarbvtnjnq. fn final nvsknlnjnqshällfasthnt nv 1.9 N / mm was measured. [xvmpel b "“ ““ __ "“ ”H) ln 'l: 1: lr': sm ml (tjtt vptrxímt-g; lzmlznulnnt, tïltl YR SH um tjnvk knppnrlnlin på üvvr nch unnvrsldnn_ ln knpnur- 'IU 15 454 125 21 krvla; írznnnlšillrh- text with kunvunlxunm-LL-vlzzlc knlk. puly H "sulfonic Fnnlnncinnnwivl lrgnnslâilldcs gvmnu upplijnuinq of pvlvllmfr of Udvl-P-1700 NI pulysulfnnhnxíß 1 mvlylvnklnrld. the elszuic- SKU un cioppmlvs 1 [wlysaulFunlíizvxrnjrnqvrn NRH lufilfnrkznhës. fn 75 pm íjurk förfurmud pnlysulfnnfuljn lnminerndcs pä de mvd hindvmvdvl hvluqdu sidorna nv skxvun i en pr fi ss vnd 175UE I 1 IÜ miuulur xld 1.4 HPU. ßunumqüvndv häl burrades i sklvnn och fraqmnlvv avlnrslnvv. i wxumpul 1.

Fxcmpcl 5 Fit onkcllagvr of upoxidimprvgnvrnd glustyq plavv- radvs mnlluu two sheets of 25 um pulynulfnnfulxc and Inmjnnrudvu j en prvßu at 2.8 MPa at 17bOC in IÜ mxnulcr. Della gave nt! topics, which is useful! böjljgl för Framstäilning av lrycktn mönslerkorl.

Claims (2)

10 15 454 125 22 PATENT REQUIREMENTS Substrate material for the production of printed circuit boards consisting of a substrate provided with an organic, thermoplastic material, characterized in that the material is an organic polymer in the form of a foil, which is applied to the metallic or insulating substrate. with a thickness between 20 and 500 μm, the foil consisting of a polymer with an aromatic skeleton, which is so temperature-resistant that it does not decompose or change shape at the temperatures occurring in soldering processes and that the polymer consists of polysulfone, poly carbonate and / or polyether sulfone groups. Substrate material according to claim 1, characterized in that the carrier material consists of insulating material, metal or fiber-reinforced, resin-impregnated hard paper. /hrs