FR2455616A1 - INSULATING SUBSTRATE HAVING A THERMOPLASTIC POLYMERIC MATERIAL FILM FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS, AND SUBSTRATE PREPARATION - Google Patents

INSULATING SUBSTRATE HAVING A THERMOPLASTIC POLYMERIC MATERIAL FILM FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS, AND SUBSTRATE PREPARATION

Info

Publication number
FR2455616A1
FR2455616A1 FR8009783A FR8009783A FR2455616A1 FR 2455616 A1 FR2455616 A1 FR 2455616A1 FR 8009783 A FR8009783 A FR 8009783A FR 8009783 A FR8009783 A FR 8009783A FR 2455616 A1 FR2455616 A1 FR 2455616A1
Authority
FR
France
Prior art keywords
manufacture
printed circuit
circuit boards
insulating substrate
polymeric material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8009783A
Other languages
French (fr)
Other versions
FR2455616B1 (en
Inventor
David Frisch
Wilhelm Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2455616A1 publication Critical patent/FR2455616A1/en
Application granted granted Critical
Publication of FR2455616B1 publication Critical patent/FR2455616B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

MATERIAU DE BASE 10 POUR LA FABRICATION DE PANNEAUX DE CIRCUITS IMPRIMES, ET SA PREPARATION. IL COMPREND UN SUBSTRAT ISOLANT 12, PAR EXEMPLE UN STRATIFIE FORME DE FIBRES DE VERRE DE RENFORCEMENT IMPREGNEES D'UNE RESINE EPOXY, QUI PORTE SUR UNE FACE AU MOINS UNE FEUILLE ADHERENTE 14 D'UNE MATIERE POLYMERE THERMOPLASTIQUE RESTANT STABLE A DE HAUTES TEMPERATURES, D'UNE EPAISSEUR REGULIERE D'ENVIRON 10 A 500MICRONS. LA SURFACE DE LA FEUILLE THERMOPLASTIQUE PEUT ETRE TRAITEE CHIMIQUEMENT POUR ETRE ACTIVEE ET FACILITER ENSUITE LE DEPOT PAR VOIE NON GALVANIQUE D'UNE PELLICULE ADHERENTE D'UN METAL 22. LES CIRCUITS IMPRIMES QUI SONT FORMES SUR DE TELS SUBSTRATS SE CARACTERISENT PAR UNE EXCELLENTE ADHERENCE DES CONDUCTEURS A LA SURFACE DE LA FEUILLE THERMOPLASTIQUE, ILS ONT D'EXCELLENTES CARACTERISTIQUES ELECTRIQUES ET ILS RESISTENT BIEN A LA CHALEUR AU COURS D'UN EMPLOI CONTINU OU DANS LES OPERATIONS DE SOUDURE.BASIC MATERIAL 10 FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS, AND ITS PREPARATION. IT INCLUDES AN INSULATING SUBSTRATE 12, FOR EXAMPLE A LAMINATE IN THE FORM OF REINFORCING GLASS FIBERS IMPREGNATED WITH AN EPOXY RESIN, WHICH ON ONE FACE AT LEAST ONE ADHESIVE SHEET 14 OF A THERMOPLASTIC POLYMER MATERIAL REMAINING STABLE AT HIGH TEMPERATURES 'A REGULAR THICKNESS OF ABOUT 10 TO 500MICRONS. THE SURFACE OF THE THERMOPLASTIC SHEET CAN BE CHEMICALLY TREATED TO BE ACTIVATED AND THEN FACILITATE THE NON-GALVANIC DEPOSIT OF AN ADHERENT FILM OF A METAL 22. THE PRINTED CIRCUITS WHICH ARE FORMED ON SUCH SUBSTRATES DESCELLENT EXTREMELY CHARACTERIZED. CONDUCTING TO THE SURFACE OF THE THERMOPLASTIC SHEET, THEY HAVE EXCELLENT ELECTRICAL CHARACTERISTICS AND THEY ARE WELL RESISTANT TO HEAT DURING CONTINUOUS USE OR IN WELDING OPERATIONS.

FR8009783A 1979-04-30 1980-04-30 INSULATING SUBSTRATE HAVING A THERMOPLASTIC POLYMERIC MATERIAL FILM FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS, AND SUBSTRATE PREPARATION Granted FR2455616A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3481179A 1979-04-30 1979-04-30

Publications (2)

Publication Number Publication Date
FR2455616A1 true FR2455616A1 (en) 1980-11-28
FR2455616B1 FR2455616B1 (en) 1983-12-09

Family

ID=21878759

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8009783A Granted FR2455616A1 (en) 1979-04-30 1980-04-30 INSULATING SUBSTRATE HAVING A THERMOPLASTIC POLYMERIC MATERIAL FILM FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS, AND SUBSTRATE PREPARATION

Country Status (12)

Country Link
JP (1) JPS564460A (en)
AT (1) AT384144B (en)
AU (1) AU539984B2 (en)
CA (1) CA1157622A (en)
CH (1) CH657571A5 (en)
DE (2) DE3012889C2 (en)
DK (1) DK184980A (en)
FR (1) FR2455616A1 (en)
GB (1) GB2057351B (en)
IT (1) IT1146956B (en)
NL (1) NL188674C (en)
SE (1) SE454125B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2497813A1 (en) * 1981-01-12 1982-07-16 Kollmorgen Tech Corp METHOD FOR REDUCING TENSIONS AND CONSTRAINTS IN SULFONIC POLYMERS BY RADIATION TREATMENT
FR2527216A2 (en) * 1982-05-21 1983-11-25 Kollmorgen Tech Corp METHOD OF DISSIPATING, BY RADIATION TREATMENT, TENSIONS OF A POLYMER ARTICLE
EP0148379A1 (en) * 1983-12-02 1985-07-17 Siemens Aktiengesellschaft Multilayer circuits made of a thermoplastic composite
FR2587273A1 (en) * 1985-09-19 1987-03-20 Darragon Sa METHOD AND AUTOCLAVE PRESSURE FOR LAMINATING MULTI-LAYER PRINTED CIRCUITS AND / OR PLASTIFICATION OF FLAT ELEMENTS, AND DEVICE FOR CONVERTING INTO AUTOCLAVE PRESS OF THIS TYPE
EP0311970A2 (en) * 1987-10-16 1989-04-19 BASF Aktiengesellschaft Printed circuit board
FR2660671A1 (en) * 1990-04-06 1991-10-11 Thomson Csf Process for metallising polyethersulphone
FR2678468A1 (en) * 1991-06-26 1992-12-31 Set Services Tech Method of insulating a flexible electric circuit, device for implementing the said method and products thus obtained
WO2000027171A2 (en) * 1998-11-04 2000-05-11 Deutsche Thomson-Brandt Gmbh Electromechanical component

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DE3124639C2 (en) * 1981-06-23 1985-01-17 Albert-Frankenthal Ag, 6710 Frankenthal Device for lifting folded products out of a jaw cylinder
JPS58153399A (en) * 1982-03-04 1983-09-12 昭和アルミニウム株式会社 Heat sink board for electric part
JPS60121791A (en) * 1983-12-05 1985-06-29 日本写真印刷株式会社 Method of producing printed circuit board
DE3538937A1 (en) * 1984-11-02 1986-05-07 Kollmorgen Technologies Corp., Dallas, Tex. METHOD FOR PRODUCING METAL-COVERED THERMOPLASTIC CARRIER MATERIAL AND PRINTED CIRCUITS MADE THEREOF
JPH03502554A (en) * 1987-12-15 1991-06-13 オイ・パルテック　エー・ビー whetstone
JP2570283Y2 (en) * 1990-08-22 1998-05-06 三菱重工業株式会社 Three-fold winding and three-fold outer folding machine
US6495244B1 (en) * 2000-09-07 2002-12-17 Oak-Mitsui, Inc. Manufacturing fire retardant circuit boards without the use of fire retardant resin additives
JP3963662B2 (en) * 2001-05-24 2007-08-22 住友ベークライト株式会社 Laminate production method
US7105235B2 (en) * 2002-05-17 2006-09-12 Her Majesty The Queen In Right Of Canada As Represented By The Minister Of Natural Resources Isotropic zero CTE reinforced composite materials
DE102011050424B4 (en) * 2011-05-17 2017-09-28 Ksg Leiterplatten Gmbh Method for producing a semifinished product for a single-layer or multi-layer printed circuit board
KR102357563B1 (en) * 2020-12-14 2022-02-07 인탑스 주식회사 In-mold electronics structure using engineering plastic plating process and method therefor

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FR1490081A (en) * 1965-08-20 1967-07-28 Union Carbide Corp Method for increasing the adhesion of metallic coatings on aromatic polymer substrates
FR2267202A1 (en) * 1974-04-10 1975-11-07 Toa Nenryo Kogyo Kk
US4148969A (en) * 1976-03-03 1979-04-10 Exxon Research & Engineering Co. Polyparabanic acid/copper foil laminates obtained by direct solution casting

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JPS4521995Y1 (en) * 1967-07-15 1970-09-01
GB1415778A (en) * 1973-04-16 1975-11-26 Ici Ltd Increasing the molecular weight of aromatic polysulphones
JPS569420B2 (en) * 1973-09-06 1981-03-02
CH581474A5 (en) * 1974-06-27 1976-11-15 Draegerwerk Ag
JPS5125393A (en) * 1974-08-27 1976-03-01 Kyoei Steel Ltd HOKOTEIISAISEIGATAHOCHOKI
JPS5134287A (en) * 1974-09-19 1976-03-23 Hideaki Takahashi HORIKAABONEETOOSHUTAITOSHIAKURIRU MATAHA TANOJUSHITOOBURENDOSHITA GOSEIJUSHISHIITO TO KINZOKUARUIHAHITETSUKINZOKU MATAHA GURASUMATAHAKINOSUITANOKAKUSHIITOTOO RAMINEETOSHITASHIITO OYOBI SONOSEI
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Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
FR1490081A (en) * 1965-08-20 1967-07-28 Union Carbide Corp Method for increasing the adhesion of metallic coatings on aromatic polymer substrates
FR2267202A1 (en) * 1974-04-10 1975-11-07 Toa Nenryo Kogyo Kk
US4148969A (en) * 1976-03-03 1979-04-10 Exxon Research & Engineering Co. Polyparabanic acid/copper foil laminates obtained by direct solution casting

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXRV/68 *

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2497813A1 (en) * 1981-01-12 1982-07-16 Kollmorgen Tech Corp METHOD FOR REDUCING TENSIONS AND CONSTRAINTS IN SULFONIC POLYMERS BY RADIATION TREATMENT
FR2527216A2 (en) * 1982-05-21 1983-11-25 Kollmorgen Tech Corp METHOD OF DISSIPATING, BY RADIATION TREATMENT, TENSIONS OF A POLYMER ARTICLE
EP0148379A1 (en) * 1983-12-02 1985-07-17 Siemens Aktiengesellschaft Multilayer circuits made of a thermoplastic composite
FR2587273A1 (en) * 1985-09-19 1987-03-20 Darragon Sa METHOD AND AUTOCLAVE PRESSURE FOR LAMINATING MULTI-LAYER PRINTED CIRCUITS AND / OR PLASTIFICATION OF FLAT ELEMENTS, AND DEVICE FOR CONVERTING INTO AUTOCLAVE PRESS OF THIS TYPE
WO1987001651A1 (en) * 1985-09-19 1987-03-26 Darragon S.A. Press-autoclave, for example for laminating printed circuits
EP0311970A2 (en) * 1987-10-16 1989-04-19 BASF Aktiengesellschaft Printed circuit board
EP0311970A3 (en) * 1987-10-16 1989-09-13 BASF Aktiengesellschaft Printed circuit board
FR2660671A1 (en) * 1990-04-06 1991-10-11 Thomson Csf Process for metallising polyethersulphone
FR2678468A1 (en) * 1991-06-26 1992-12-31 Set Services Tech Method of insulating a flexible electric circuit, device for implementing the said method and products thus obtained
WO2000027171A2 (en) * 1998-11-04 2000-05-11 Deutsche Thomson-Brandt Gmbh Electromechanical component
WO2000027171A3 (en) * 1998-11-04 2000-06-29 Thomson Brandt Gmbh Electromechanical component
US6572954B1 (en) 1998-11-04 2003-06-03 Thomson Licensing, S.A. Electromechanical component

Also Published As

Publication number Publication date
FR2455616B1 (en) 1983-12-09
NL188674C (en) 1992-08-17
AU5777780A (en) 1980-11-06
NL8002514A (en) 1980-11-03
AU539984B2 (en) 1984-10-25
CA1157622A (en) 1983-11-29
DE3013130A1 (en) 1980-11-13
SE454125B (en) 1988-03-28
IT8048536A0 (en) 1980-04-29
GB2057351B (en) 1983-04-07
GB2057351A (en) 1981-04-01
JPS564460A (en) 1981-01-17
ATA224680A (en) 1987-02-15
AT384144B (en) 1987-10-12
IT1146956B (en) 1986-11-19
DE3012889A1 (en) 1980-11-06
DE3013130C2 (en) 1983-01-20
DE3012889C2 (en) 1984-01-12
DK184980A (en) 1980-10-31
CH657571A5 (en) 1986-09-15
NL188674B (en) 1992-03-16
SE8003203L (en) 1980-10-31

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