NL188674C - METHOD FOR MANUFACTURING A PRINTED CIRCUIT PLATE AND BASIC MATERIAL SUITABLE FOR MANUFACTURING IT - Google Patents

METHOD FOR MANUFACTURING A PRINTED CIRCUIT PLATE AND BASIC MATERIAL SUITABLE FOR MANUFACTURING IT

Info

Publication number
NL188674C
NL188674C NLAANVRAGE8002514,A NL8002514A NL188674C NL 188674 C NL188674 C NL 188674C NL 8002514 A NL8002514 A NL 8002514A NL 188674 C NL188674 C NL 188674C
Authority
NL
Netherlands
Prior art keywords
manufacturing
printed circuit
circuit plate
material suitable
basic material
Prior art date
Application number
NLAANVRAGE8002514,A
Other languages
Dutch (nl)
Other versions
NL8002514A (en
NL188674B (en
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of NL8002514A publication Critical patent/NL8002514A/en
Publication of NL188674B publication Critical patent/NL188674B/en
Application granted granted Critical
Publication of NL188674C publication Critical patent/NL188674C/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
NLAANVRAGE8002514,A 1979-04-30 1980-04-29 METHOD FOR MANUFACTURING A PRINTED CIRCUIT PLATE AND BASIC MATERIAL SUITABLE FOR MANUFACTURING IT NL188674C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3481179A 1979-04-30 1979-04-30
US3481179 1979-04-30

Publications (3)

Publication Number Publication Date
NL8002514A NL8002514A (en) 1980-11-03
NL188674B NL188674B (en) 1992-03-16
NL188674C true NL188674C (en) 1992-08-17

Family

ID=21878759

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE8002514,A NL188674C (en) 1979-04-30 1980-04-29 METHOD FOR MANUFACTURING A PRINTED CIRCUIT PLATE AND BASIC MATERIAL SUITABLE FOR MANUFACTURING IT

Country Status (12)

Country Link
JP (1) JPS564460A (en)
AT (1) AT384144B (en)
AU (1) AU539984B2 (en)
CA (1) CA1157622A (en)
CH (1) CH657571A5 (en)
DE (2) DE3012889C2 (en)
DK (1) DK184980A (en)
FR (1) FR2455616A1 (en)
GB (1) GB2057351B (en)
IT (1) IT1146956B (en)
NL (1) NL188674C (en)
SE (1) SE454125B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339303A (en) * 1981-01-12 1982-07-13 Kollmorgen Technologies Corporation Radiation stress relieving of sulfone polymer articles
DE3124639C2 (en) * 1981-06-23 1985-01-17 Albert-Frankenthal Ag, 6710 Frankenthal Device for lifting folded products out of a jaw cylinder
JPS58153399A (en) * 1982-03-04 1983-09-12 昭和アルミニウム株式会社 Heat sink board for electric part
ZA823981B (en) * 1982-05-21 1983-06-29 Kollmorgen Tech Corp Radiation stress relieving of polymer articles
DE3343745A1 (en) * 1983-12-02 1985-06-13 Siemens AG, 1000 Berlin und 8000 München MULTI-LAYER CIRCUITS MADE OF THERMOPLAST COPPER
JPS60121791A (en) * 1983-12-05 1985-06-29 日本写真印刷株式会社 Method of producing printed circuit board
DE3538937A1 (en) * 1984-11-02 1986-05-07 Kollmorgen Technologies Corp., Dallas, Tex. METHOD FOR PRODUCING METAL-COVERED THERMOPLASTIC CARRIER MATERIAL AND PRINTED CIRCUITS MADE THEREOF
FR2587273B1 (en) * 1985-09-19 1988-04-08 Darragon Sa METHOD AND AUTOCLAVE PRESSURE FOR LAMINATING MULTI-LAYER PRINTED CIRCUITS AND / OR PLASTIFICATION OF FLAT ELEMENTS, AND DEVICE FOR CONVERTING INTO AUTOCLAVE PRESS OF THIS TYPE
DE3735109A1 (en) * 1987-10-16 1989-05-03 Basf Ag PCB
JPH03502554A (en) * 1987-12-15 1991-06-13 オイ・パルテック　エー・ビー whetstone
FR2660671B1 (en) * 1990-04-06 1993-05-07 Thomson Csf PROCESS FOR METALLIZING POLYETHERSULFONE.
JP2570283Y2 (en) * 1990-08-22 1998-05-06 三菱重工業株式会社 Three-fold winding and three-fold outer folding machine
FR2678468A1 (en) * 1991-06-26 1992-12-31 Set Services Tech Method of insulating a flexible electric circuit, device for implementing the said method and products thus obtained
DE19952246A1 (en) 1998-11-04 2000-05-31 Thomson Brandt Gmbh Electromechanical component includes covering and support layers composed of inflammable plastic material
US6495244B1 (en) * 2000-09-07 2002-12-17 Oak-Mitsui, Inc. Manufacturing fire retardant circuit boards without the use of fire retardant resin additives
JP3963662B2 (en) * 2001-05-24 2007-08-22 住友ベークライト株式会社 Laminate production method
US7105235B2 (en) * 2002-05-17 2006-09-12 Her Majesty The Queen In Right Of Canada As Represented By The Minister Of Natural Resources Isotropic zero CTE reinforced composite materials
DE102011050424B4 (en) * 2011-05-17 2017-09-28 Ksg Leiterplatten Gmbh Method for producing a semifinished product for a single-layer or multi-layer printed circuit board
KR102357563B1 (en) * 2020-12-14 2022-02-07 인탑스 주식회사 In-mold electronics structure using engineering plastic plating process and method therefor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1490081A (en) * 1965-08-20 1967-07-28 Union Carbide Corp Method for increasing the adhesion of metallic coatings on aromatic polymer substrates
DE1590305A1 (en) * 1966-06-08 1970-06-04 Dynamit Nobel Ag Process for applying printed circuits to laminates
JPS4521995Y1 (en) * 1967-07-15 1970-09-01
GB1415778A (en) * 1973-04-16 1975-11-26 Ici Ltd Increasing the molecular weight of aromatic polysulphones
JPS569420B2 (en) * 1973-09-06 1981-03-02
JPS5531741B2 (en) * 1974-04-10 1980-08-20
CH581474A5 (en) * 1974-06-27 1976-11-15 Draegerwerk Ag
JPS5125393A (en) * 1974-08-27 1976-03-01 Kyoei Steel Ltd HOKOTEIISAISEIGATAHOCHOKI
JPS5134287A (en) * 1974-09-19 1976-03-23 Hideaki Takahashi HORIKAABONEETOOSHUTAITOSHIAKURIRU MATAHA TANOJUSHITOOBURENDOSHITA GOSEIJUSHISHIITO TO KINZOKUARUIHAHITETSUKINZOKU MATAHA GURASUMATAHAKINOSUITANOKAKUSHIITOTOO RAMINEETOSHITASHIITO OYOBI SONOSEI
US4148969A (en) * 1976-03-03 1979-04-10 Exxon Research & Engineering Co. Polyparabanic acid/copper foil laminates obtained by direct solution casting
JPS5735950Y2 (en) * 1976-06-24 1982-08-09

Also Published As

Publication number Publication date
FR2455616B1 (en) 1983-12-09
AU5777780A (en) 1980-11-06
NL8002514A (en) 1980-11-03
AU539984B2 (en) 1984-10-25
CA1157622A (en) 1983-11-29
DE3013130A1 (en) 1980-11-13
SE454125B (en) 1988-03-28
IT8048536A0 (en) 1980-04-29
GB2057351B (en) 1983-04-07
GB2057351A (en) 1981-04-01
JPS564460A (en) 1981-01-17
ATA224680A (en) 1987-02-15
AT384144B (en) 1987-10-12
IT1146956B (en) 1986-11-19
DE3012889A1 (en) 1980-11-06
DE3013130C2 (en) 1983-01-20
DE3012889C2 (en) 1984-01-12
FR2455616A1 (en) 1980-11-28
DK184980A (en) 1980-10-31
CH657571A5 (en) 1986-09-15
NL188674B (en) 1992-03-16
SE8003203L (en) 1980-10-31

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Free format text: IN PAT.BUL.16/92, PAGES 2387 AND 2388 THE NAME OF THE PROPRIETOR OF THE PATENT CORR.:OCI COMMUNICATIONS INC. TE SAN DIEGO, CALIFORNIE, VER. ST. V. AM.

V1 Lapsed because of non-payment of the annual fee