SE443475B - Kylelement for halvledarelement och anvendning derav - Google Patents
Kylelement for halvledarelement och anvendning deravInfo
- Publication number
- SE443475B SE443475B SE7906190A SE7906190A SE443475B SE 443475 B SE443475 B SE 443475B SE 7906190 A SE7906190 A SE 7906190A SE 7906190 A SE7906190 A SE 7906190A SE 443475 B SE443475 B SE 443475B
- Authority
- SE
- Sweden
- Prior art keywords
- cooling
- cooling element
- heat dissipation
- elements
- element according
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH787578 | 1978-07-21 | ||
| CH1299278 | 1978-12-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7906190L SE7906190L (sv) | 1980-01-22 |
| SE443475B true SE443475B (sv) | 1986-02-24 |
Family
ID=25702383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7906190A SE443475B (sv) | 1978-07-21 | 1979-07-18 | Kylelement for halvledarelement och anvendning derav |
Country Status (8)
| Country | Link |
|---|---|
| AT (1) | AT383228B (nl) |
| BR (1) | BR7904617A (nl) |
| CA (1) | CA1138562A (nl) |
| DE (1) | DE2902771A1 (nl) |
| FR (1) | FR2431769B1 (nl) |
| GB (1) | GB2026238A (nl) |
| NL (1) | NL7905603A (nl) |
| SE (1) | SE443475B (nl) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057956A (ja) * | 1983-09-09 | 1985-04-03 | Furukawa Electric Co Ltd:The | 半導体用ヒ−トパイプ放熱器 |
| DE4131739C2 (de) * | 1991-09-24 | 1996-12-19 | Behr Industrietech Gmbh & Co | Kühleinrichtung für elektrische Bauelemente |
| JPH0637219A (ja) * | 1992-07-16 | 1994-02-10 | Fuji Electric Co Ltd | パワー半導体装置の冷却装置 |
| DE4301865A1 (de) * | 1993-01-25 | 1994-07-28 | Abb Management Ag | Kühldose |
| DE19600166A1 (de) * | 1996-01-04 | 1997-07-17 | Daimler Benz Ag | Kühlkörper mit verbessertem Strömungswiderstand |
| WO1997025741A1 (de) * | 1996-01-04 | 1997-07-17 | Daimler-Benz Aktiengesellschaft | Kühlkörper mit zapfen |
| DE19727912C1 (de) * | 1997-07-01 | 1998-10-29 | Daimler Benz Ag | Kühlkörper für Leistungsbauelemente |
| DE10102621B4 (de) * | 2001-01-20 | 2006-05-24 | Conti Temic Microelectronic Gmbh | Leistungsmodul |
| ITTO20040517A1 (it) * | 2004-07-23 | 2004-10-23 | Johnson Electric Moncalieri Srl | Struttura dissipatrice del calore per dispositivi elettronici e simili |
| DE102014102262A1 (de) * | 2014-02-21 | 2015-08-27 | Maschinenfabrik Reinhausen Gmbh | Schalteinrichtung |
| CN112338207A (zh) * | 2020-11-20 | 2021-02-09 | 佛山宇仁智能科技有限公司 | 一种增材工件点阵循环冷却机构 |
| CN116855892B (zh) * | 2023-09-05 | 2023-12-08 | 上海陛通半导体能源科技股份有限公司 | 一种高产能AlSi或AlSiCu薄膜的沉积方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1439022B2 (de) * | 1960-05-03 | 1974-03-21 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Kühlkörper für ein Halbleiterbauelement |
| DE2008800A1 (de) * | 1970-02-21 | 1971-09-16 | Licentia Gmbh | Stromrichterschrank oder gestell |
| FR2087762A5 (nl) * | 1970-05-29 | 1971-12-31 | Comp Generale Electricite | |
| CA1026013A (en) * | 1975-03-17 | 1978-02-07 | Everett C. Elgar | Heat sink |
| DE2640000C2 (de) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben |
-
1979
- 1979-01-25 DE DE19792902771 patent/DE2902771A1/de not_active Ceased
- 1979-06-18 AT AT0428579A patent/AT383228B/de not_active IP Right Cessation
- 1979-07-06 CA CA000331260A patent/CA1138562A/en not_active Expired
- 1979-07-18 SE SE7906190A patent/SE443475B/sv not_active IP Right Cessation
- 1979-07-18 FR FR7918636A patent/FR2431769B1/fr not_active Expired
- 1979-07-19 GB GB7925223A patent/GB2026238A/en not_active Withdrawn
- 1979-07-19 NL NL7905603A patent/NL7905603A/nl not_active Application Discontinuation
- 1979-07-19 BR BR7904617A patent/BR7904617A/pt unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA1138562A (en) | 1982-12-28 |
| FR2431769A1 (fr) | 1980-02-15 |
| NL7905603A (nl) | 1980-01-23 |
| ATA428579A (de) | 1986-10-15 |
| FR2431769B1 (fr) | 1985-06-28 |
| AT383228B (de) | 1987-06-10 |
| BR7904617A (pt) | 1980-04-08 |
| DE2902771A1 (de) | 1980-01-31 |
| GB2026238A (en) | 1980-01-30 |
| SE7906190L (sv) | 1980-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |
Ref document number: 7906190-9 Effective date: 19910211 Format of ref document f/p: F |