CA1138562A - Cooling apparatus for semiconductor elements - Google Patents
Cooling apparatus for semiconductor elementsInfo
- Publication number
- CA1138562A CA1138562A CA000331260A CA331260A CA1138562A CA 1138562 A CA1138562 A CA 1138562A CA 000331260 A CA000331260 A CA 000331260A CA 331260 A CA331260 A CA 331260A CA 1138562 A CA1138562 A CA 1138562A
- Authority
- CA
- Canada
- Prior art keywords
- cooling
- elements
- heat conducting
- flow
- cooling element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
6414 INVENTORS: PETER KNAPP and XAVER VOGEL
CAN
INVENTION: COOLING APPARATUS FOR SEMICONDUCTOR ELEMENTS
ABSTRACT OF THE DISCLOSURE
A cooling apparatus for high-power semiconductors with fluid cooling, especially for track-bound vehicles or railroads and for generator excitation. The disk-shaped semi-conductor elements to be cooled are in pressure contact with metallic cooling elements and are arranged, in conjunction therewith, in flow channels. The flow of the cooling agent predominantly is conducted through such cooling elements.
Within the cooling elements there are arranged, perpendicular to their contact surface with the semiconductor elements, heat conducting elements in a plug or plate configuration. These heat conducting or dissipation elements produce a turbulent fluid flow. The cooling element base or floor can have a non-uniform or irregular wall thickness. Two substantially identical cooling elements can be in heat conducting contact with one an-other by means of their heat conducting elements, and a flow conducting plate, arranged between such cooling elements, simultaneously can be employed as electrical contact.
CAN
INVENTION: COOLING APPARATUS FOR SEMICONDUCTOR ELEMENTS
ABSTRACT OF THE DISCLOSURE
A cooling apparatus for high-power semiconductors with fluid cooling, especially for track-bound vehicles or railroads and for generator excitation. The disk-shaped semi-conductor elements to be cooled are in pressure contact with metallic cooling elements and are arranged, in conjunction therewith, in flow channels. The flow of the cooling agent predominantly is conducted through such cooling elements.
Within the cooling elements there are arranged, perpendicular to their contact surface with the semiconductor elements, heat conducting elements in a plug or plate configuration. These heat conducting or dissipation elements produce a turbulent fluid flow. The cooling element base or floor can have a non-uniform or irregular wall thickness. Two substantially identical cooling elements can be in heat conducting contact with one an-other by means of their heat conducting elements, and a flow conducting plate, arranged between such cooling elements, simultaneously can be employed as electrical contact.
Description
BACKGROUND OF THE INVENTION
The present invention relates to a new and improved construction of cooling apparatus for electrical components, especially semiconductor elements, of the power electronics art.
Generally speaking, the cooling apparatus of the invention is of the type comprising at least one assembly or group of structural components containing at least one semi-conductor element and at least one cooling element. These elements are operatively connected with one another in mutual, heat conducting and electrical pressure contact, the assembly having a heat absorbing cooling fluid circulating thereabout.
During the operation of semiconductor components or elements, such as for instance high-current diodes and thyristors, electrical power losses arise which lead to temperature increases at the semiconductor body. With increasing power for each semi-conductor element and with increasing frequency there is an in-crease of the electrical power losses which have been converted into heat. It amounts to approximately one percent of the trans-mitted electrical power. With infrequent overloads manufacturers of semiconductor components permit, for instance, barrier layer-temperatures up to 250 C for silicon rectifiers. Prior to des-
The present invention relates to a new and improved construction of cooling apparatus for electrical components, especially semiconductor elements, of the power electronics art.
Generally speaking, the cooling apparatus of the invention is of the type comprising at least one assembly or group of structural components containing at least one semi-conductor element and at least one cooling element. These elements are operatively connected with one another in mutual, heat conducting and electrical pressure contact, the assembly having a heat absorbing cooling fluid circulating thereabout.
During the operation of semiconductor components or elements, such as for instance high-current diodes and thyristors, electrical power losses arise which lead to temperature increases at the semiconductor body. With increasing power for each semi-conductor element and with increasing frequency there is an in-crease of the electrical power losses which have been converted into heat. It amounts to approximately one percent of the trans-mitted electrical power. With infrequent overloads manufacturers of semiconductor components permit, for instance, barrier layer-temperatures up to 250 C for silicon rectifiers. Prior to des-
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truction such lose their blocking capability in the forward direction at approximately 160C. For safety reasons the tem-perature should not exceed about 125 C. The build-up of heat in the semiconductor is dependent upon the power loss as a function of time and the thermal conductlvity or dissipation and heat storage capabilities of the s~miconductor elements.
Cooling agents are employed when working with current intensities exceeding 100 amperes. Both air and also liquid coolants are conventionally utilized. Liquid cooling systems, owing to the danger of corrosion, are designed to work in a closed circulation system with recooling by untreated water or air. The semiconductor bodies are in heat conducting relation-ship with cooling bodies having cooling ribs and formed of al-uminum, aluminum alloys, copper or copper alloys or another suitable metal, having a low thermal resistance.
Cooling devices for semiconductor elements are es-pecially used in high-power or high-performance current rec-tifiers in the field of energy generation, energy distribution, in industrial applications and at vehicles. In this respect there are employed thyristors having a continuous limiting current of ~ 700 amperes and a peak blocking voltage of ~ 3200 volts.
Further developments in current rectifier installations has u~
resulted in the production of current rectifier arrays or groups operating at increasingly greater power and at the same time of more space-saving configuration, there being attained power outputs exceeding 50 MW. Such requires good heat dissipation or conduction within very narrow space require-ments.
Air cooling is the simplest type of cooling in terms of preparing and monitoring the cooling agent and the access-ibility to the semiconductor components or elements. Such frequentlyrequires air filters which, during periodic service or maintenance times, must be dismantled, cleaned, dried and again installed. In the case or current rectifiers having power outputs exceeding 2 MW and for the operation of semi-conductor elements, for instance in current rectifier banks or arrays at railroad vehicles, requiring special protection against contamination by metallic braking dust and so forth and also against moisture attack from fog, rain and snow, liquid cooling systems can be more suitable than air cooling systems.
Since liquids have much smaller heat transfer co-efficients than air, it is possible to get by with much smaller heat transmitting services when using liquid coolers. Water possesses more favorable heat transfer coefficients than, for instance, oil. Due to the danger of frost and the electrical con-~13aS62 ductivity of the water there is preferably employed an electrically insulating coolant, such as transformer oil.
Now in ~erman Patent Publication ~ ~ it is known to employ internally cooled heat transfer elements, so-called cooling cells or cans, having an oil circulation cooling for heat conduction or dissipation. In the flow path of the cooling liquid there are arranged, essentially erpen-dicular to the cell floors, plugs connected by their or a sim-ilar material with such cell floors. These plugs possess a square cross-section and have a diagonal thereof extending transversely with respect to the flow direction. Due to this arrangement of the plug-diagonals transversely with respect to the flow direction turbulence phenomena arises, leading to an improved transfer of the heat which is to be withdrawn from the cell floors to the liquid. Such type cooling cells do how-ever require a relatively high pressure for the liquid circu-lation, since the openings for the influx and efflux of the cooling liquid have a small cross-section. Sealing problems particularly arise by virtue of the hose connections needed for the liquid infeed and outfeed lines.
C~ qf'~ c,~
In~German Patent Publication No. 2,160,997~ there is furthermore known to the art to arrange externally cooled, large surface heat transfer elements between neighboring semi-conductor elements in heat conducting relationship and to accommodate such in a liquid container or vessel filled with oil.
SUMMARY OF THE INVENTION
It is a primary object of the present invention to provide a new and improved construction of cooling apparatus for electrical components which is not afflicted with the draw-backs and shortcoming of the prior art cooling systems.
Another and more specific object of the present in-vention aims at providing a new and improved construction of cooling apparatus for semiconductor elements of the power electronics art, possessing a relatively simple construction which is favorable as concerns the fabrication economies and rendering possible an improved heat dissipation or removal in relation to heretofore known cooling devices.
Now in order to implement these and still further objects of the invention, which will become more readily appar-ent as the description proceeds, the cooling apparatus of the present invention is manifested by the features that the semi-conductor element and the cooling element are arranged within a heat absorbing cooling fluid in a flow channel and surrounded in an areal manner by walls or longitudinal partitions of the flow channel.
5~2 The cooling fluid or coolant can be gaseous or vaporous, especially can be SF6-gas or a hydrogen-air mixture.
A particularly noteworthy advantage of the inventive cooling apparatus resides in the fact that the arrangement of the group of structuxal components containing the cooling and semiconductor elements within the flow channels affords high cooling efficiency both for liquid and also gaseous coolants.
With this cooling apparatus it is possible to attain, with li~uid cooling, comparatively small thermal resistances of less than 0.03 K/W using aluminum cooling elements and less than 0.02 K/W with copper cooling elements, and with air cool-ing there can be obtained thermal resistances of less than 0.05 K/W with aluminum cooling elements and less than 0.04 K/W
with copper cooling elements. A further advantage of the in-vention is in terms of the fact that within a flow channel there is afforded an improved heat dissipation or conductance from the cooling elements to the cooling fluid.
An advantage of the employed elements, which in their construction are similar to the heretofore known cooling cells or cans, resides in the ~act that they do not require any special cooling element encapsulation. Therefore, they are easier and simpler to fabricate than such cooling cells. The inlet and outlet openings for the cooling fluid in the cooling ~ 562 element can be designed to be larger than with the cooling cells, so that the pressure gradient for each cooling element is smaller. Consequently, the fluid pressure and the power output which must be expended by the circulating pump or ventilator, as the case may be, are smaller. Sealing prob-lems at the cooling elements do not arise, since such are immersed in the fluid or the fluid circulates thereabout. Due to short line paths for the heat which is to be dissipated within the cooling elements there is obtained, within very small space, a high cooling efficiency. A particular advantage of the cooling elements resides in the fact that they can be stacked upon one another. The cooling apparatus does not re-quire special maintenance and, with small space requirements of the group of structural components, insures for their easy exchangeability and hlgh longevity or service life.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be better understood and objects other than those set forth above, will become apparent when consideration is given to the following detailed description thereof. Such description makes reference to the annexed drawings wherein:
Figure 1 illustrates in vertical sectional view a cooling apparatus containing a number of groups of structural components containing semiconductor elements and cooling ele-ments within a cooling fluid container;
Figure 2 is a horizontal sectional view, according to the sectional line II-II of Figure 1, illustrating the prin-ciple of a clamping system having two groups of structural components;
Figure 3 is a horizontal sectional view, taken sub-stantially along the line III-III of Figure 2~ showing a par-titioned cooling element having square heat conduction or dissipation elements;
Figure 4 shows a cooling element in sectional view, taken substantially along the line IV-IV of Figure 3;
Figure 5 is a bottom plan view of a cooling element shown in the arrangements of Figures 3 and 4;
Figure 6 is a schematic horizontal sectional view of a cooling element having rhomboid heat conduction or dissipation elements;
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Figure 7 is a sectional view, taken substantially along the line VII-VII of Figure 6 of the cooling element thereof;
Figures 8 and 9 are respective schematic horizontal sectional views of two further constructions of cooling elements having plate-shaped heat conduction elements; and Figure 10 illustrates in schematic horizontal sectional view a cooling element having zig-zag shaped heat conduction or dissipation elements.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Describing now the drawings, the exemplary embodi-ment of inventive cooling apparatus shown in Figure 1 will be seen to comprise a container 13 filled with a suitable cooling : fluid or medium or fluid coolant 14, for instance transformer oil, SF6-gas, air or a hydrogen-air mixture. Within such con-tainer 13 there are arranged adjacent and above one another a number of groups of structural components orelements 6 which are to be cooled. These component groups 6 are located in flow channels 23 or equivalent structure which are bounded by ver-tical lengthwise partitions or walls 20 and connected with horizontal transverse partitions 21. The group of structural components 6, best seen by referring to Figure 2, are to be con-ceived as arranged, together with their clamping device of Figure 1, perpendicular to the plane of the drawing towards the rear. The cooling fluid 14 flows, in the direction of the arrow A,from below towards the top through such flow channels or ducts 23. Between superimposed arranged longitudinal par-titions 20 there are provided seallng elements 26 formed of any suitable elastic, for instance rubber-like or elastomeric material, which enable a flow of the cooling fluid 14 essen-tially in the flow direction A between superimposed arranged rows of the component groups 6. The cooling fluid 14 can be maintained in a forced flow, with a pump 17 when working with a liquid coolant and a ventilator or the like when working with a gaseous fluid, through an external heat exchanger 18, a fluid inlet channel 15, a fluid filter 27, through the flow channels 23 in the container or vessel 13 and a fluid outlet channel 16. By means of not particularly shown, but conventional electrical lines the group of structural c~mponents 6 are connected with terminal contacts 19 at the top of the container 13.
Now as best seen by referring to Figure 2, the com-ponent group 6 can contain a number of tandemly arranged semi-conductorelements 4, flow guide plates 5, for instance, formed of sheet metal, and cooling elements 1, which are pressed against one another at their contactsurfaces in a statically defined clamping device. Such clamping device comprises, by ~_e way of example, essentially two traverses or crossties 10 or equivalent structure, both of the tension bolts 12, the two segmented pressure or contact spheres 8 or equivalent structure, the spring 9 and the tightening or clamping screw or threaded bolt 11 or the like. With such type clamping device or clamping means it is possible to clamp, with a pre-determined tension, a group of components 6 by means of the traverses 10 and the clamping screw 11. The spring force of the spring 9 or equivalent resilient element is dimensioned such that the contact pressure exerted upon the elements of the structural group 6 remains within permissible threshold values, even with the greatest possible temperature fluctuations which are contemplated to be encountered. Such are dependent upon the diameter of the active portion of the semiconductor elements 4.
The semiconductor elements 4 of essentially disk-shaped configuration, are cooled at both faces by metallic cooling elements 1 having good thermal conductance or heat dissipation properties. When working with small semiconductor elements a one sided cooling may be sufficient. The disk sur-faces of such semiconductor elements 4 are in electrical and heat conducting connection with corresponding contact surfaces 24 of the cooling element base or floor 2 of the cooling ele-ment 1, as best seen by referring to Figure 5. In order to improve the heat transfer action it is possible to arrange ~*~
between the disk surfaces of the semiconductor elements 4 and the cooling element bases or floors 2 not particularly shown, good heat conducting, thin metal layers or foils, for instance formed of lead, nickel, aluminum, gold, silver or alloys, while utilizing one or a number of such metals. Such type metal layers can also be applied, for instance by electrolytic sep-aration or precipitation, vapor deposition and cathode atomiz-ation upon the contact semiconductor disk.
Between neighboring semiconductor elements 4 of a group of structural components or elements 6 there are arranged two cooling elements 1, the bases or floors 2 of which, in each case, are in pressure contact with the disk surfaces of the semiconductor elements 4 and their heat conduction or dissi-pation plugs or pins, that is to say, the heat conduction elements 3 are in pressure contact with one another. Between both of these cooling elements 1 and between the cooling ele-ments 1 at both ends of the structural group 6 and the seg-mented pressure or contact spheres 8 there can be arranged the flow conducting plates 5, simultaneously usable as electrical contacts. The current infeed brackets of such current con-duction or conducting plates 5 protrude from the lateral boundary of the cooling elements 1, as best seen by referring to Figure 3. By incorporating such type flow conducting plates 5 it is possible to dispense with the use of other electrical connection elements. With the structural group 6, illustrated i2 in Figure 2, the semiconductor elements 4 are arranged in a Graetz bridge circuit confi~uration; they can however also be connected, for instance, in series for other fields of applic-ation.
As best seen by referring to the left-hand portion of Figure 2, partitions or separation walls 22 are arranged transversely with respect to the flow channels 23 and they are connected with the transverse partitions or walls 20 arranged along the structural group 6 and at a slight spacing with respect thereto between the traverses or crossties 10 of the clamping device. The transverse partitions 22 insure that a fluid circulation through the flow channel 23 is accomplished essentially only through the recesses between the heat con-ducting plugs or elements 3 in the cooling elements 1. They prevent that there occurs in the flow channel 23 a flow essen-tially about the semiconductor elements 4 and about the seg-mented pressure spheres 8 of the clamping device. The partitions 20, 21, 22 consist of an electrical insulator, preferably formed of a suitable plastics material resistant to, as needed, SF6, oil and pressure.
As best seen by referring to Figures 3 to 10, the cooling elements 1 possess a quadratic configuration and essentially consist of a cooling element base or floor 2 and arranged oriented perpendicular to the plane of the contact 1~8562 surface 24 of the cooling element base or floor 2, substan-tially rod-shaped heat conducting plugs 3 or equivalent structure having a square or rhomboid cross-section or heat conducting or dissipation elements 3 formed as plate-shaped or undulated elements. At the cooling element floors or bases 2 there can be arranged, externally of such contact surface 24, turbulating pins 7 or equivalent structure which improve the heat conductance from the cooling element 1 to the cooling fluid 14. They are particularly suitable when using liquid coolants. The heat conducting elements 3 are connected by the material from which they are formed or an identical or like material with the cooling element bases. Their cross-section can reduce with increasing spacing from the cooling element bases 2. It must at least be so large that there is insured over such heat conducting elements 3 a faultless force trans-mission by means of the clamping device. Plug-shaped or pin-shaped heat conducting elements 3 advantageously have a diagonal thereof disposed transversely with respect to the flow direction A of the cooling fluid 14. When using rhomboid-shaped heat conducting plugs or the like the shorter diagonal is aligned transversely with respect to the flow direction A. The heat conducting plugs are advantageously arranged at the same spacing from one another. For each square centimeter of surface per-pendicular to the lengthwise direction of such plugs there is present, for instance, one heat conducting plug 3. The con-nection or connecting portion for the heat conducting plug 3 with the cooling element floor or base 2 is preferably shaped so ~1`38562 as to be ogival or con~ergingly pointed. Due to this con-figuration there is obtained a good heat transfer from the cooling element base to the heat conducting plug 3 or the like.
As best seen by referring to Figure 4, the cooling element base 2 can have an irregular or non-uniform wall thick-ness. Preferably the periphery or, as shown in broken lines, the central and the peripheral region of the cooling element base can have a lesser wall thickness than the region disposed therebetween. Consequently, there is obtained a further improve-ment in the heat conductance. The length 1 of the heat conduct-ing elements amounts to two-fold to eight-fold, preferably four-fold to six-fold, the maximum thickness _ of the cooling element base or floor 2.
There can be mounted,as by mold ~ or casting, by way of e~le, the longitudinal partitions 20 at tne cooling elements 1, as such has been illustrated in Figures 6 to 10. These longitudinal or lengthwise partitions 20 augment the dissipation of heat to the cooling fluid.
The cooling elements l also can ha~e a rectangular or plate-shaped configuration, and the longer side of the rectangle can have a length amounting to three to twenty times the length of the shorter side of the rectangle. Moreover, the shorter 11~i2 side of the rectangle or the narrow side of the plate, as the case may be, can be oriented essentially transversely with respect to the flow direction A of the cooling fluid, as illus-trated in Figure 8, or can deviate from such direction by an angle of preferably less than 45, as shown in Figure 9.
The heat conducting elements 3 are arranged in rows parallel to one another. Heat conducting elements of neighbor-ing rows are offset relative to one another, i.e., in the flow direction A of the fluid coolant aligned with the gap of neighboring heat conducting elements within the preceding or subsequent row. Plug-shaped heat conducting elements of a row can be arranged partially in the intermediate spaces of the heat conducting elements of a neighboring row, as shown in Figure 6.
According to another construction, it is possible for the heat conducting elements to be oriented essentially in the flow direction A of the fluid coolant, and structured so as to be of surface-like or aereal configuration in an undulated or zig-zag shape, as shown in Figure 10.
What is important for the different shapes of the heat conducting elements is that there be present a slight flow resistance for the cooling fluid or coolant with rel-atively pronounced turbulence. In order to obtain a high cooling capacity or efficiency the heat exchange surfaces are also relatively large, their cross~section small and the transport paths of the heat or thermal energy to be removed are maintained as short as possible within the cooling element.
As large as possible number of cooling surfaces are to be pro-vided as close as possible to the heat source.
There will now be explained the mode of operation of the inventive cooling apparatus based upon the showing of Figures 1 and 2. By means of the circulation pump or the ventilator 17, a fluid coolant 14 is conveyed through the flow channels 23. The componentgroups 6, arranged in the flow channels 23, have the circulated coolant flowing thereabout and the electrical power losses, released in the form of heat by the semiconductor elements 4,are absorbed by the fluid coolant 14, removed and delivered to the surroundings by means of an external heat exchanger 18. By virtue of the partitions 22 arranged transversely with respect to the direction of flow in the flow channels 23, the fluid coolant flows essen-tially through the cooling elements 1 or, as the case may be, through compound cooling elements 25 formed of two identical or similar cooling elements 1, and, if desired, having arranged therebetween a flow guide plate 5. The cooling elements are in heat conducting and electrical connection with one another by means of their heat conducting elements 3. The heat which ~,~
is to be removed is predominantly transmitted from the heat conducting plugs or elements 3 to the turbulently flowing fluid coolant, and the flow essentially is directed perpen-dicular to the direction of orientation of the heat conducting elements.
When using hydrogen or a hydrogen-air mixture as the fluid coolant, there are to be employed specialty steels or coverings for the housing and lines in order to avoid the passage of hydrogen ions. When using air as the fluid coolant there is unnecessary a closed fluid circulation system employ-ing heat exchanger, particularly then when there does not exist any danger as concerns moisture and frost. To counter~
act against possible contamination of the semiconductor elements there is then required an air filter 27 for cleaning the infed air. Air velocities of 4 m/s to 12 m/s are standard. The pressure gradient within a heat conducting element is dependent upon the throughflow rate of the fluid medium and upon the mobility of the fluid molecules, i.e., upon the temperature.
Of course, the subject matter of the invention is not limited to what has been shown in the drawings. Thus, for instance, the container 13 for the cooling fluid or coolant 14 can be provided with cooling ribs, by means of which the heat can be transferred to the surroundings or to the prevail-ing air stream, and the fluid circulation system is arranged ~13~S62 within such container or vessel. The heat conducting elements
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truction such lose their blocking capability in the forward direction at approximately 160C. For safety reasons the tem-perature should not exceed about 125 C. The build-up of heat in the semiconductor is dependent upon the power loss as a function of time and the thermal conductlvity or dissipation and heat storage capabilities of the s~miconductor elements.
Cooling agents are employed when working with current intensities exceeding 100 amperes. Both air and also liquid coolants are conventionally utilized. Liquid cooling systems, owing to the danger of corrosion, are designed to work in a closed circulation system with recooling by untreated water or air. The semiconductor bodies are in heat conducting relation-ship with cooling bodies having cooling ribs and formed of al-uminum, aluminum alloys, copper or copper alloys or another suitable metal, having a low thermal resistance.
Cooling devices for semiconductor elements are es-pecially used in high-power or high-performance current rec-tifiers in the field of energy generation, energy distribution, in industrial applications and at vehicles. In this respect there are employed thyristors having a continuous limiting current of ~ 700 amperes and a peak blocking voltage of ~ 3200 volts.
Further developments in current rectifier installations has u~
resulted in the production of current rectifier arrays or groups operating at increasingly greater power and at the same time of more space-saving configuration, there being attained power outputs exceeding 50 MW. Such requires good heat dissipation or conduction within very narrow space require-ments.
Air cooling is the simplest type of cooling in terms of preparing and monitoring the cooling agent and the access-ibility to the semiconductor components or elements. Such frequentlyrequires air filters which, during periodic service or maintenance times, must be dismantled, cleaned, dried and again installed. In the case or current rectifiers having power outputs exceeding 2 MW and for the operation of semi-conductor elements, for instance in current rectifier banks or arrays at railroad vehicles, requiring special protection against contamination by metallic braking dust and so forth and also against moisture attack from fog, rain and snow, liquid cooling systems can be more suitable than air cooling systems.
Since liquids have much smaller heat transfer co-efficients than air, it is possible to get by with much smaller heat transmitting services when using liquid coolers. Water possesses more favorable heat transfer coefficients than, for instance, oil. Due to the danger of frost and the electrical con-~13aS62 ductivity of the water there is preferably employed an electrically insulating coolant, such as transformer oil.
Now in ~erman Patent Publication ~ ~ it is known to employ internally cooled heat transfer elements, so-called cooling cells or cans, having an oil circulation cooling for heat conduction or dissipation. In the flow path of the cooling liquid there are arranged, essentially erpen-dicular to the cell floors, plugs connected by their or a sim-ilar material with such cell floors. These plugs possess a square cross-section and have a diagonal thereof extending transversely with respect to the flow direction. Due to this arrangement of the plug-diagonals transversely with respect to the flow direction turbulence phenomena arises, leading to an improved transfer of the heat which is to be withdrawn from the cell floors to the liquid. Such type cooling cells do how-ever require a relatively high pressure for the liquid circu-lation, since the openings for the influx and efflux of the cooling liquid have a small cross-section. Sealing problems particularly arise by virtue of the hose connections needed for the liquid infeed and outfeed lines.
C~ qf'~ c,~
In~German Patent Publication No. 2,160,997~ there is furthermore known to the art to arrange externally cooled, large surface heat transfer elements between neighboring semi-conductor elements in heat conducting relationship and to accommodate such in a liquid container or vessel filled with oil.
SUMMARY OF THE INVENTION
It is a primary object of the present invention to provide a new and improved construction of cooling apparatus for electrical components which is not afflicted with the draw-backs and shortcoming of the prior art cooling systems.
Another and more specific object of the present in-vention aims at providing a new and improved construction of cooling apparatus for semiconductor elements of the power electronics art, possessing a relatively simple construction which is favorable as concerns the fabrication economies and rendering possible an improved heat dissipation or removal in relation to heretofore known cooling devices.
Now in order to implement these and still further objects of the invention, which will become more readily appar-ent as the description proceeds, the cooling apparatus of the present invention is manifested by the features that the semi-conductor element and the cooling element are arranged within a heat absorbing cooling fluid in a flow channel and surrounded in an areal manner by walls or longitudinal partitions of the flow channel.
5~2 The cooling fluid or coolant can be gaseous or vaporous, especially can be SF6-gas or a hydrogen-air mixture.
A particularly noteworthy advantage of the inventive cooling apparatus resides in the fact that the arrangement of the group of structuxal components containing the cooling and semiconductor elements within the flow channels affords high cooling efficiency both for liquid and also gaseous coolants.
With this cooling apparatus it is possible to attain, with li~uid cooling, comparatively small thermal resistances of less than 0.03 K/W using aluminum cooling elements and less than 0.02 K/W with copper cooling elements, and with air cool-ing there can be obtained thermal resistances of less than 0.05 K/W with aluminum cooling elements and less than 0.04 K/W
with copper cooling elements. A further advantage of the in-vention is in terms of the fact that within a flow channel there is afforded an improved heat dissipation or conductance from the cooling elements to the cooling fluid.
An advantage of the employed elements, which in their construction are similar to the heretofore known cooling cells or cans, resides in the ~act that they do not require any special cooling element encapsulation. Therefore, they are easier and simpler to fabricate than such cooling cells. The inlet and outlet openings for the cooling fluid in the cooling ~ 562 element can be designed to be larger than with the cooling cells, so that the pressure gradient for each cooling element is smaller. Consequently, the fluid pressure and the power output which must be expended by the circulating pump or ventilator, as the case may be, are smaller. Sealing prob-lems at the cooling elements do not arise, since such are immersed in the fluid or the fluid circulates thereabout. Due to short line paths for the heat which is to be dissipated within the cooling elements there is obtained, within very small space, a high cooling efficiency. A particular advantage of the cooling elements resides in the fact that they can be stacked upon one another. The cooling apparatus does not re-quire special maintenance and, with small space requirements of the group of structural components, insures for their easy exchangeability and hlgh longevity or service life.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be better understood and objects other than those set forth above, will become apparent when consideration is given to the following detailed description thereof. Such description makes reference to the annexed drawings wherein:
Figure 1 illustrates in vertical sectional view a cooling apparatus containing a number of groups of structural components containing semiconductor elements and cooling ele-ments within a cooling fluid container;
Figure 2 is a horizontal sectional view, according to the sectional line II-II of Figure 1, illustrating the prin-ciple of a clamping system having two groups of structural components;
Figure 3 is a horizontal sectional view, taken sub-stantially along the line III-III of Figure 2~ showing a par-titioned cooling element having square heat conduction or dissipation elements;
Figure 4 shows a cooling element in sectional view, taken substantially along the line IV-IV of Figure 3;
Figure 5 is a bottom plan view of a cooling element shown in the arrangements of Figures 3 and 4;
Figure 6 is a schematic horizontal sectional view of a cooling element having rhomboid heat conduction or dissipation elements;
~13BS6~
Figure 7 is a sectional view, taken substantially along the line VII-VII of Figure 6 of the cooling element thereof;
Figures 8 and 9 are respective schematic horizontal sectional views of two further constructions of cooling elements having plate-shaped heat conduction elements; and Figure 10 illustrates in schematic horizontal sectional view a cooling element having zig-zag shaped heat conduction or dissipation elements.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Describing now the drawings, the exemplary embodi-ment of inventive cooling apparatus shown in Figure 1 will be seen to comprise a container 13 filled with a suitable cooling : fluid or medium or fluid coolant 14, for instance transformer oil, SF6-gas, air or a hydrogen-air mixture. Within such con-tainer 13 there are arranged adjacent and above one another a number of groups of structural components orelements 6 which are to be cooled. These component groups 6 are located in flow channels 23 or equivalent structure which are bounded by ver-tical lengthwise partitions or walls 20 and connected with horizontal transverse partitions 21. The group of structural components 6, best seen by referring to Figure 2, are to be con-ceived as arranged, together with their clamping device of Figure 1, perpendicular to the plane of the drawing towards the rear. The cooling fluid 14 flows, in the direction of the arrow A,from below towards the top through such flow channels or ducts 23. Between superimposed arranged longitudinal par-titions 20 there are provided seallng elements 26 formed of any suitable elastic, for instance rubber-like or elastomeric material, which enable a flow of the cooling fluid 14 essen-tially in the flow direction A between superimposed arranged rows of the component groups 6. The cooling fluid 14 can be maintained in a forced flow, with a pump 17 when working with a liquid coolant and a ventilator or the like when working with a gaseous fluid, through an external heat exchanger 18, a fluid inlet channel 15, a fluid filter 27, through the flow channels 23 in the container or vessel 13 and a fluid outlet channel 16. By means of not particularly shown, but conventional electrical lines the group of structural c~mponents 6 are connected with terminal contacts 19 at the top of the container 13.
Now as best seen by referring to Figure 2, the com-ponent group 6 can contain a number of tandemly arranged semi-conductorelements 4, flow guide plates 5, for instance, formed of sheet metal, and cooling elements 1, which are pressed against one another at their contactsurfaces in a statically defined clamping device. Such clamping device comprises, by ~_e way of example, essentially two traverses or crossties 10 or equivalent structure, both of the tension bolts 12, the two segmented pressure or contact spheres 8 or equivalent structure, the spring 9 and the tightening or clamping screw or threaded bolt 11 or the like. With such type clamping device or clamping means it is possible to clamp, with a pre-determined tension, a group of components 6 by means of the traverses 10 and the clamping screw 11. The spring force of the spring 9 or equivalent resilient element is dimensioned such that the contact pressure exerted upon the elements of the structural group 6 remains within permissible threshold values, even with the greatest possible temperature fluctuations which are contemplated to be encountered. Such are dependent upon the diameter of the active portion of the semiconductor elements 4.
The semiconductor elements 4 of essentially disk-shaped configuration, are cooled at both faces by metallic cooling elements 1 having good thermal conductance or heat dissipation properties. When working with small semiconductor elements a one sided cooling may be sufficient. The disk sur-faces of such semiconductor elements 4 are in electrical and heat conducting connection with corresponding contact surfaces 24 of the cooling element base or floor 2 of the cooling ele-ment 1, as best seen by referring to Figure 5. In order to improve the heat transfer action it is possible to arrange ~*~
between the disk surfaces of the semiconductor elements 4 and the cooling element bases or floors 2 not particularly shown, good heat conducting, thin metal layers or foils, for instance formed of lead, nickel, aluminum, gold, silver or alloys, while utilizing one or a number of such metals. Such type metal layers can also be applied, for instance by electrolytic sep-aration or precipitation, vapor deposition and cathode atomiz-ation upon the contact semiconductor disk.
Between neighboring semiconductor elements 4 of a group of structural components or elements 6 there are arranged two cooling elements 1, the bases or floors 2 of which, in each case, are in pressure contact with the disk surfaces of the semiconductor elements 4 and their heat conduction or dissi-pation plugs or pins, that is to say, the heat conduction elements 3 are in pressure contact with one another. Between both of these cooling elements 1 and between the cooling ele-ments 1 at both ends of the structural group 6 and the seg-mented pressure or contact spheres 8 there can be arranged the flow conducting plates 5, simultaneously usable as electrical contacts. The current infeed brackets of such current con-duction or conducting plates 5 protrude from the lateral boundary of the cooling elements 1, as best seen by referring to Figure 3. By incorporating such type flow conducting plates 5 it is possible to dispense with the use of other electrical connection elements. With the structural group 6, illustrated i2 in Figure 2, the semiconductor elements 4 are arranged in a Graetz bridge circuit confi~uration; they can however also be connected, for instance, in series for other fields of applic-ation.
As best seen by referring to the left-hand portion of Figure 2, partitions or separation walls 22 are arranged transversely with respect to the flow channels 23 and they are connected with the transverse partitions or walls 20 arranged along the structural group 6 and at a slight spacing with respect thereto between the traverses or crossties 10 of the clamping device. The transverse partitions 22 insure that a fluid circulation through the flow channel 23 is accomplished essentially only through the recesses between the heat con-ducting plugs or elements 3 in the cooling elements 1. They prevent that there occurs in the flow channel 23 a flow essen-tially about the semiconductor elements 4 and about the seg-mented pressure spheres 8 of the clamping device. The partitions 20, 21, 22 consist of an electrical insulator, preferably formed of a suitable plastics material resistant to, as needed, SF6, oil and pressure.
As best seen by referring to Figures 3 to 10, the cooling elements 1 possess a quadratic configuration and essentially consist of a cooling element base or floor 2 and arranged oriented perpendicular to the plane of the contact 1~8562 surface 24 of the cooling element base or floor 2, substan-tially rod-shaped heat conducting plugs 3 or equivalent structure having a square or rhomboid cross-section or heat conducting or dissipation elements 3 formed as plate-shaped or undulated elements. At the cooling element floors or bases 2 there can be arranged, externally of such contact surface 24, turbulating pins 7 or equivalent structure which improve the heat conductance from the cooling element 1 to the cooling fluid 14. They are particularly suitable when using liquid coolants. The heat conducting elements 3 are connected by the material from which they are formed or an identical or like material with the cooling element bases. Their cross-section can reduce with increasing spacing from the cooling element bases 2. It must at least be so large that there is insured over such heat conducting elements 3 a faultless force trans-mission by means of the clamping device. Plug-shaped or pin-shaped heat conducting elements 3 advantageously have a diagonal thereof disposed transversely with respect to the flow direction A of the cooling fluid 14. When using rhomboid-shaped heat conducting plugs or the like the shorter diagonal is aligned transversely with respect to the flow direction A. The heat conducting plugs are advantageously arranged at the same spacing from one another. For each square centimeter of surface per-pendicular to the lengthwise direction of such plugs there is present, for instance, one heat conducting plug 3. The con-nection or connecting portion for the heat conducting plug 3 with the cooling element floor or base 2 is preferably shaped so ~1`38562 as to be ogival or con~ergingly pointed. Due to this con-figuration there is obtained a good heat transfer from the cooling element base to the heat conducting plug 3 or the like.
As best seen by referring to Figure 4, the cooling element base 2 can have an irregular or non-uniform wall thick-ness. Preferably the periphery or, as shown in broken lines, the central and the peripheral region of the cooling element base can have a lesser wall thickness than the region disposed therebetween. Consequently, there is obtained a further improve-ment in the heat conductance. The length 1 of the heat conduct-ing elements amounts to two-fold to eight-fold, preferably four-fold to six-fold, the maximum thickness _ of the cooling element base or floor 2.
There can be mounted,as by mold ~ or casting, by way of e~le, the longitudinal partitions 20 at tne cooling elements 1, as such has been illustrated in Figures 6 to 10. These longitudinal or lengthwise partitions 20 augment the dissipation of heat to the cooling fluid.
The cooling elements l also can ha~e a rectangular or plate-shaped configuration, and the longer side of the rectangle can have a length amounting to three to twenty times the length of the shorter side of the rectangle. Moreover, the shorter 11~i2 side of the rectangle or the narrow side of the plate, as the case may be, can be oriented essentially transversely with respect to the flow direction A of the cooling fluid, as illus-trated in Figure 8, or can deviate from such direction by an angle of preferably less than 45, as shown in Figure 9.
The heat conducting elements 3 are arranged in rows parallel to one another. Heat conducting elements of neighbor-ing rows are offset relative to one another, i.e., in the flow direction A of the fluid coolant aligned with the gap of neighboring heat conducting elements within the preceding or subsequent row. Plug-shaped heat conducting elements of a row can be arranged partially in the intermediate spaces of the heat conducting elements of a neighboring row, as shown in Figure 6.
According to another construction, it is possible for the heat conducting elements to be oriented essentially in the flow direction A of the fluid coolant, and structured so as to be of surface-like or aereal configuration in an undulated or zig-zag shape, as shown in Figure 10.
What is important for the different shapes of the heat conducting elements is that there be present a slight flow resistance for the cooling fluid or coolant with rel-atively pronounced turbulence. In order to obtain a high cooling capacity or efficiency the heat exchange surfaces are also relatively large, their cross~section small and the transport paths of the heat or thermal energy to be removed are maintained as short as possible within the cooling element.
As large as possible number of cooling surfaces are to be pro-vided as close as possible to the heat source.
There will now be explained the mode of operation of the inventive cooling apparatus based upon the showing of Figures 1 and 2. By means of the circulation pump or the ventilator 17, a fluid coolant 14 is conveyed through the flow channels 23. The componentgroups 6, arranged in the flow channels 23, have the circulated coolant flowing thereabout and the electrical power losses, released in the form of heat by the semiconductor elements 4,are absorbed by the fluid coolant 14, removed and delivered to the surroundings by means of an external heat exchanger 18. By virtue of the partitions 22 arranged transversely with respect to the direction of flow in the flow channels 23, the fluid coolant flows essen-tially through the cooling elements 1 or, as the case may be, through compound cooling elements 25 formed of two identical or similar cooling elements 1, and, if desired, having arranged therebetween a flow guide plate 5. The cooling elements are in heat conducting and electrical connection with one another by means of their heat conducting elements 3. The heat which ~,~
is to be removed is predominantly transmitted from the heat conducting plugs or elements 3 to the turbulently flowing fluid coolant, and the flow essentially is directed perpen-dicular to the direction of orientation of the heat conducting elements.
When using hydrogen or a hydrogen-air mixture as the fluid coolant, there are to be employed specialty steels or coverings for the housing and lines in order to avoid the passage of hydrogen ions. When using air as the fluid coolant there is unnecessary a closed fluid circulation system employ-ing heat exchanger, particularly then when there does not exist any danger as concerns moisture and frost. To counter~
act against possible contamination of the semiconductor elements there is then required an air filter 27 for cleaning the infed air. Air velocities of 4 m/s to 12 m/s are standard. The pressure gradient within a heat conducting element is dependent upon the throughflow rate of the fluid medium and upon the mobility of the fluid molecules, i.e., upon the temperature.
Of course, the subject matter of the invention is not limited to what has been shown in the drawings. Thus, for instance, the container 13 for the cooling fluid or coolant 14 can be provided with cooling ribs, by means of which the heat can be transferred to the surroundings or to the prevail-ing air stream, and the fluid circulation system is arranged ~13~S62 within such container or vessel. The heat conducting elements
3 of the cooling elements 1 also can be, for instance, circular, oval, ~star-shaped or parallelpiped. Their axes can be at an angle, differing from 90 , with respect to the plane of the contact surface 24 of the cooling element base 2. The number of heat conductingplugs per square centimeter (cm2) of cooling element base surface can be greater or smaller than one. The cooling element base can have a uniform wall thickness. The partitions or walls 20, 21 of the flow channels 23 can be arranged at an angle with respect to the container walls which differs from 90. Also, it is possible to use as the coolant different cooling agents than those herein mentioned.
Claims (30)
1. An arrangement for cooling electrical components especially semiconductor elements of the power electronics art, comprising:
(a) a container having walls defining the same;
(b) longitudinal partitions in said container defining at least one individual fluid flow channel; and (c) groups of structural components disposed in mutual spacing relative to one another and located in a fluid flow channel, each said group of components containing at least one semiconductor element and at least one cooling element, said elements in a group being in mutual pressural contact with one another in heat conducting relation and electrically connected, said channels providing passage means for guiding a heat-absorbing cooling fluid in a manner such that all of the components are substantially equally well cooled by a cooling fluid flowing through said channels.
(a) a container having walls defining the same;
(b) longitudinal partitions in said container defining at least one individual fluid flow channel; and (c) groups of structural components disposed in mutual spacing relative to one another and located in a fluid flow channel, each said group of components containing at least one semiconductor element and at least one cooling element, said elements in a group being in mutual pressural contact with one another in heat conducting relation and electrically connected, said channels providing passage means for guiding a heat-absorbing cooling fluid in a manner such that all of the components are substantially equally well cooled by a cooling fluid flowing through said channels.
2. The cooling apparatus as defined in claim 1, wherein:
said heat-absorbing cooling fluid is a heat-absorbing liquid; and said at least one group of structural components being arranged within the heat-absorbing liquid in the flow channel.
said heat-absorbing cooling fluid is a heat-absorbing liquid; and said at least one group of structural components being arranged within the heat-absorbing liquid in the flow channel.
3. The cooling apparatus as defined in claim 1 further including:
transverse partitions provided between adjacently arranged flow channels and between the walls of the container and such flow channels;
said longitudinal partitions being arranged essentially parallel to the direction of flow of the cooling fluid along such groups of structural components and connected with said transverse partitions;
partition means provided in each flow channel essentially transversely with respect to the direction of flow of the cooling fluid therein and transversely with respect to said longitudinal partitions; and said partition means shutting-off, in the flow direction within the flow channel, essentially all of the channel regions except those in which there are provided the cooling elements.
transverse partitions provided between adjacently arranged flow channels and between the walls of the container and such flow channels;
said longitudinal partitions being arranged essentially parallel to the direction of flow of the cooling fluid along such groups of structural components and connected with said transverse partitions;
partition means provided in each flow channel essentially transversely with respect to the direction of flow of the cooling fluid therein and transversely with respect to said longitudinal partitions; and said partition means shutting-off, in the flow direction within the flow channel, essentially all of the channel regions except those in which there are provided the cooling elements.
4. The cooling apparatus as defined in claim 3, wherein:
said groups of structural components are arranged adjacent one another at a mutual spacing.
said groups of structural components are arranged adjacent one another at a mutual spacing.
5. The cooling apparatus as defined in claim 3, wherein:
said groups of structural elements are arranged in storeys above one another.
said groups of structural elements are arranged in storeys above one another.
6. The cooling apparatus as defined in claim 3, wherein:
said longitudinal partitions are arranged at the cooling element.
said longitudinal partitions are arranged at the cooling element.
7. The cooling apparatus as defined in claim 6, further including:
sealing elements arranged between said longitudinal partitions; and said longitudinal partitions being arranged in tan-dem in the direction of flow of the cooling fluid.
sealing elements arranged between said longitudinal partitions; and said longitudinal partitions being arranged in tan-dem in the direction of flow of the cooling fluid.
8. The cooling apparatus as defined in claim 3, further including:
sealing elements arranged between said longitudinal partitions; and said lonitudinal partitions being arranged in tan-dem in the direction of flow of the cooling fluid.
sealing elements arranged between said longitudinal partitions; and said lonitudinal partitions being arranged in tan-dem in the direction of flow of the cooling fluid.
9. The cooling apparatus as defined in claim 1, further including:
heat conducting elements for heat conductively and electrically connecting two identical ones of said cooling elements with one another and form-ing a composite cooling element; and an electrical conductive flow guide element arranged between the cooling elements of the composite cooling element.
heat conducting elements for heat conductively and electrically connecting two identical ones of said cooling elements with one another and form-ing a composite cooling element; and an electrical conductive flow guide element arranged between the cooling elements of the composite cooling element.
10. The cooling apparatus as defined in claim 9, wherein:
said flow guide element is a flow guide plate.
said flow guide element is a flow guide plate.
11. The cooling apparatus as defined in claim 1, wherein:
said cooling fluid is at an excess pressure.
said cooling fluid is at an excess pressure.
12. The cooling apparatus as defined in claim 11, wherein:
said cooling fluid is an electrically insulating cooling liquid.
said cooling fluid is an electrically insulating cooling liquid.
13. The cooling apparatus as defined in claim 12, wherein:
said electrically insulating cooling liquid is oil.
said electrically insulating cooling liquid is oil.
14. The cooling apparatus as defined in claim 11, wherein:
the cooling fluid is gaseous or vaporous.
the cooling fluid is gaseous or vaporous.
15. The cooling apparatus as defined in claim 14, wherein:
said cooling fluid is SF6-gas.
said cooling fluid is SF6-gas.
16. The cooling apparatus as defined in claim 14, wherein:
said cooling fluid is a hydrogen-air mixture.
said cooling fluid is a hydrogen-air mixture.
17. A cooling apparatus as defined in claim 1 wherein said cooling element includes:
a cooling element base;
heat conducting elements oriented essentially perpendicular to said cooling element base and connected therewith; and the connection portion of said heat conducting elements at the cooling element base possessing a predetermined configuration.
a cooling element base;
heat conducting elements oriented essentially perpendicular to said cooling element base and connected therewith; and the connection portion of said heat conducting elements at the cooling element base possessing a predetermined configuration.
18. The cooling element as defined in claim 17, wherein:
said predetermined configuration of said connection portion is substantially ogival.
said predetermined configuration of said connection portion is substantially ogival.
19. The cooling element as defined in claim 17, wherein:
said predetermined configuration of said connection portion is essentially convergingly pointed.
said predetermined configuration of said connection portion is essentially convergingly pointed.
20. The cooling element as defined in claim 17, wherein:
said heat conducting elements serve for a cooling apparatus of the type defined in claim 1.
said heat conducting elements serve for a cooling apparatus of the type defined in claim 1.
21. The cooling element as defined in claim 17, wherein:
said heat conducting elements are essentially plug-shaped or rod-shaped in configuration;
said heating conducting elements having a rhomboid or square cross-sectional configuration; and said heat conducting elements having a diagonal thereof aligned essentially transversely with respect to the direction of flow of the cooling fluid.
said heat conducting elements are essentially plug-shaped or rod-shaped in configuration;
said heating conducting elements having a rhomboid or square cross-sectional configuration; and said heat conducting elements having a diagonal thereof aligned essentially transversely with respect to the direction of flow of the cooling fluid.
22. The cooling element as defined in claim 17, wherein:
said heat conducting elements possess a substan-tially plate-shaped or surface-shaped configuration;
and a narrow side of such heat conducting elements being oriented essentially transversely with respect to the direction of flow of the cooling fluid.
said heat conducting elements possess a substan-tially plate-shaped or surface-shaped configuration;
and a narrow side of such heat conducting elements being oriented essentially transversely with respect to the direction of flow of the cooling fluid.
23. The cooling element as defined in claim 22, wherein:
said heating conducting elements possess an essen-tially undulated configuration viewed in the dir-ection of flow of the cooling fluid,
said heating conducting elements possess an essen-tially undulated configuration viewed in the dir-ection of flow of the cooling fluid,
24. The cooling element as defined in claim 22, wherein:
said heat conducting elements possess an essentially zig-zag configuration viewed in the direction of flow of the cooling fluid.
said heat conducting elements possess an essentially zig-zag configuration viewed in the direction of flow of the cooling fluid.
25. The cooling element as defined in claim 17, 21 or 22, wherein:
said heat conducting elements are arranged in rows essentially parallel to one another; and the cross-sectional surface of the heat conducting elements reducing with increasing spacing from the cooling element base.
said heat conducting elements are arranged in rows essentially parallel to one another; and the cross-sectional surface of the heat conducting elements reducing with increasing spacing from the cooling element base.
26. The cooling element as defined in claim 21, wherein:
said heat conducting elements being arranged in rows; and the heat conducting elements of neighboring rows being offset with respect to one another.
said heat conducting elements being arranged in rows; and the heat conducting elements of neighboring rows being offset with respect to one another.
27. The cooling element as defined in claim 17, 21 or 22, wherein:
the wall thickness of the cooling element base decreases towards the peripheral region thereof; and said cooling element base at its central and per-ipheral region having a lesser wall thickness than in the intermediately dispositioned region.
the wall thickness of the cooling element base decreases towards the peripheral region thereof; and said cooling element base at its central and per-ipheral region having a lesser wall thickness than in the intermediately dispositioned region.
28. The cooling element as defined in claim 17 wherein:
the ratio of the maximum length of the heat conducting elements to the maximum thickness of the cooling element base is in the order of approximately 2 to 8.
the ratio of the maximum length of the heat conducting elements to the maximum thickness of the cooling element base is in the order of approximately 2 to 8.
29. The cooling element as defined in claim 28, wherein:
said ratio is in the order of 4 to 6.
said ratio is in the order of 4 to 6.
30. The cooling element as defined in claim 17, 21 or 22, further including:
turbulation pins arranged to protrude out of the peripheral region of the cooling element base at the side of such cooling element base situated opposite the heat conducting elements.
turbulation pins arranged to protrude out of the peripheral region of the cooling element base at the side of such cooling element base situated opposite the heat conducting elements.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH7875/78 | 1978-07-21 | ||
| CH787578 | 1978-07-21 | ||
| CH12992/78 | 1978-12-21 | ||
| CH1299278 | 1978-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1138562A true CA1138562A (en) | 1982-12-28 |
Family
ID=25702383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000331260A Expired CA1138562A (en) | 1978-07-21 | 1979-07-06 | Cooling apparatus for semiconductor elements |
Country Status (8)
| Country | Link |
|---|---|
| AT (1) | AT383228B (en) |
| BR (1) | BR7904617A (en) |
| CA (1) | CA1138562A (en) |
| DE (1) | DE2902771A1 (en) |
| FR (1) | FR2431769B1 (en) |
| GB (1) | GB2026238A (en) |
| NL (1) | NL7905603A (en) |
| SE (1) | SE443475B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057956A (en) * | 1983-09-09 | 1985-04-03 | Furukawa Electric Co Ltd:The | Heat pipe type dissipator for semiconductor |
| DE4131739C2 (en) * | 1991-09-24 | 1996-12-19 | Behr Industrietech Gmbh & Co | Cooling device for electrical components |
| JPH0637219A (en) * | 1992-07-16 | 1994-02-10 | Fuji Electric Co Ltd | Cooling unit for power semiconductor device |
| DE4301865A1 (en) * | 1993-01-25 | 1994-07-28 | Abb Management Ag | Cooling box for electric component |
| EP0835524A1 (en) * | 1996-01-04 | 1998-04-15 | Daimler-Benz Aktiengesellschaft | Cooling unit with pin elements |
| DE19600166A1 (en) * | 1996-01-04 | 1997-07-17 | Daimler Benz Ag | Cooling body |
| DE19727912C1 (en) * | 1997-07-01 | 1998-10-29 | Daimler Benz Ag | Cooling body for cooling power components |
| DE10102621B4 (en) * | 2001-01-20 | 2006-05-24 | Conti Temic Microelectronic Gmbh | power module |
| ITTO20040517A1 (en) * | 2004-07-23 | 2004-10-23 | Johnson Electric Moncalieri Srl | HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES |
| DE102014102262A1 (en) * | 2014-02-21 | 2015-08-27 | Maschinenfabrik Reinhausen Gmbh | switching device |
| CN112338207A (en) * | 2020-11-20 | 2021-02-09 | 佛山宇仁智能科技有限公司 | Dot matrix circulating cooling mechanism for additive workpiece |
| CN116855892B (en) * | 2023-09-05 | 2023-12-08 | 上海陛通半导体能源科技股份有限公司 | Deposition method of high-yield AlSi or AlSiCu film |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1439022B2 (en) * | 1960-05-03 | 1974-03-21 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Heat sink for a semiconductor component |
| DE2008800A1 (en) * | 1970-02-21 | 1971-09-16 | Licentia Gmbh | Converter cabinet or rack |
| FR2087762A5 (en) * | 1970-05-29 | 1971-12-31 | Comp Generale Electricite | |
| CA1026013A (en) * | 1975-03-17 | 1978-02-07 | Everett C. Elgar | Heat sink |
| DE2640000C2 (en) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same |
-
1979
- 1979-01-25 DE DE19792902771 patent/DE2902771A1/en not_active Ceased
- 1979-06-18 AT AT0428579A patent/AT383228B/en not_active IP Right Cessation
- 1979-07-06 CA CA000331260A patent/CA1138562A/en not_active Expired
- 1979-07-18 SE SE7906190A patent/SE443475B/en not_active IP Right Cessation
- 1979-07-18 FR FR7918636A patent/FR2431769B1/en not_active Expired
- 1979-07-19 BR BR7904617A patent/BR7904617A/en unknown
- 1979-07-19 GB GB7925223A patent/GB2026238A/en not_active Withdrawn
- 1979-07-19 NL NL7905603A patent/NL7905603A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| NL7905603A (en) | 1980-01-23 |
| SE443475B (en) | 1986-02-24 |
| AT383228B (en) | 1987-06-10 |
| FR2431769B1 (en) | 1985-06-28 |
| SE7906190L (en) | 1980-01-22 |
| FR2431769A1 (en) | 1980-02-15 |
| BR7904617A (en) | 1980-04-08 |
| GB2026238A (en) | 1980-01-30 |
| DE2902771A1 (en) | 1980-01-31 |
| ATA428579A (en) | 1986-10-15 |
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