BR7904617A - REFRIGERATION DEVICE FOR SEMICONDUCTOR CONSTRUCTIVE ELEMENTS - Google Patents

REFRIGERATION DEVICE FOR SEMICONDUCTOR CONSTRUCTIVE ELEMENTS

Info

Publication number
BR7904617A
BR7904617A BR7904617A BR7904617A BR7904617A BR 7904617 A BR7904617 A BR 7904617A BR 7904617 A BR7904617 A BR 7904617A BR 7904617 A BR7904617 A BR 7904617A BR 7904617 A BR7904617 A BR 7904617A
Authority
BR
Brazil
Prior art keywords
semiconductor
refrigeration device
constructive elements
constructive
elements
Prior art date
Application number
BR7904617A
Other languages
Portuguese (pt)
Inventor
X Vogel
P Knapp
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of BR7904617A publication Critical patent/BR7904617A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
BR7904617A 1978-07-21 1979-07-19 REFRIGERATION DEVICE FOR SEMICONDUCTOR CONSTRUCTIVE ELEMENTS BR7904617A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH787578 1978-07-21
CH1299278 1978-12-21

Publications (1)

Publication Number Publication Date
BR7904617A true BR7904617A (en) 1980-04-08

Family

ID=25702383

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7904617A BR7904617A (en) 1978-07-21 1979-07-19 REFRIGERATION DEVICE FOR SEMICONDUCTOR CONSTRUCTIVE ELEMENTS

Country Status (8)

Country Link
AT (1) AT383228B (en)
BR (1) BR7904617A (en)
CA (1) CA1138562A (en)
DE (1) DE2902771A1 (en)
FR (1) FR2431769B1 (en)
GB (1) GB2026238A (en)
NL (1) NL7905603A (en)
SE (1) SE443475B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057956A (en) * 1983-09-09 1985-04-03 Furukawa Electric Co Ltd:The Heat pipe type dissipator for semiconductor
DE4131739C2 (en) * 1991-09-24 1996-12-19 Behr Industrietech Gmbh & Co Cooling device for electrical components
JPH0637219A (en) * 1992-07-16 1994-02-10 Fuji Electric Co Ltd Cooling unit for power semiconductor device
DE4301865A1 (en) * 1993-01-25 1994-07-28 Abb Management Ag Cooling box for electric component
WO1997025741A1 (en) * 1996-01-04 1997-07-17 Daimler-Benz Aktiengesellschaft Cooling unit with pin elements
DE19600166A1 (en) * 1996-01-04 1997-07-17 Daimler Benz Ag Cooling body
DE19727912C1 (en) * 1997-07-01 1998-10-29 Daimler Benz Ag Cooling body for cooling power components
DE10102621B4 (en) * 2001-01-20 2006-05-24 Conti Temic Microelectronic Gmbh power module
ITTO20040517A1 (en) * 2004-07-23 2004-10-23 Johnson Electric Moncalieri Srl HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES
DE102014102262A1 (en) * 2014-02-21 2015-08-27 Maschinenfabrik Reinhausen Gmbh switching device
CN112338207A (en) * 2020-11-20 2021-02-09 佛山宇仁智能科技有限公司 Dot matrix circulating cooling mechanism for additive workpiece
CN116855892B (en) * 2023-09-05 2023-12-08 上海陛通半导体能源科技股份有限公司 Deposition method of high-yield AlSi or AlSiCu film

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439022B2 (en) * 1960-05-03 1974-03-21 Siemens Ag, 1000 Berlin U. 8000 Muenchen Heat sink for a semiconductor component
DE2008800A1 (en) * 1970-02-21 1971-09-16 Licentia Gmbh Converter cabinet or rack
FR2087762A5 (en) * 1970-05-29 1971-12-31 Comp Generale Electricite
CA1026013A (en) * 1975-03-17 1978-02-07 Everett C. Elgar Heat sink
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same

Also Published As

Publication number Publication date
CA1138562A (en) 1982-12-28
NL7905603A (en) 1980-01-23
DE2902771A1 (en) 1980-01-31
GB2026238A (en) 1980-01-30
FR2431769B1 (en) 1985-06-28
SE443475B (en) 1986-02-24
SE7906190L (en) 1980-01-22
AT383228B (en) 1987-06-10
FR2431769A1 (en) 1980-02-15
ATA428579A (en) 1986-10-15

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