CA1026013A - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- CA1026013A CA1026013A CA222,307A CA222307A CA1026013A CA 1026013 A CA1026013 A CA 1026013A CA 222307 A CA222307 A CA 222307A CA 1026013 A CA1026013 A CA 1026013A
- Authority
- CA
- Canada
- Prior art keywords
- heat sink
- sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA222,307A CA1026013A (en) | 1975-03-17 | 1975-03-17 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA222,307A CA1026013A (en) | 1975-03-17 | 1975-03-17 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1026013A true CA1026013A (en) | 1978-02-07 |
Family
ID=4102556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA222,307A Expired CA1026013A (en) | 1975-03-17 | 1975-03-17 | Heat sink |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA1026013A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2902771A1 (en) * | 1978-07-21 | 1980-01-31 | Bbc Brown Boveri & Cie | COOLING DEVICE FOR SEMICONDUCTOR COMPONENTS |
EP0253126A1 (en) * | 1986-06-19 | 1988-01-20 | International Business Machines Corporation | Heat sink |
US6273186B1 (en) | 2000-03-13 | 2001-08-14 | Satcon Technology Corporation | Low-cost, high density, staggered pin fin array |
US6397926B1 (en) * | 2000-01-26 | 2002-06-04 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method manufacturing the same and cooling apparatus using the same |
US6634421B2 (en) | 2000-03-10 | 2003-10-21 | Satcon Technology Corporation | High performance cold plate for electronic cooling |
US7017655B2 (en) | 2003-12-18 | 2006-03-28 | Modine Manufacturing Co. | Forced fluid heat sink |
US7040388B1 (en) * | 2000-01-14 | 2006-05-09 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method of manufacturing the same and cooling apparatus using the same |
US7159649B2 (en) | 2004-03-11 | 2007-01-09 | Thermal Corp. | Air-to-air heat exchanger |
-
1975
- 1975-03-17 CA CA222,307A patent/CA1026013A/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2902771A1 (en) * | 1978-07-21 | 1980-01-31 | Bbc Brown Boveri & Cie | COOLING DEVICE FOR SEMICONDUCTOR COMPONENTS |
EP0253126A1 (en) * | 1986-06-19 | 1988-01-20 | International Business Machines Corporation | Heat sink |
US7040388B1 (en) * | 2000-01-14 | 2006-05-09 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method of manufacturing the same and cooling apparatus using the same |
US6397926B1 (en) * | 2000-01-26 | 2002-06-04 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method manufacturing the same and cooling apparatus using the same |
US6634421B2 (en) | 2000-03-10 | 2003-10-21 | Satcon Technology Corporation | High performance cold plate for electronic cooling |
US6273186B1 (en) | 2000-03-13 | 2001-08-14 | Satcon Technology Corporation | Low-cost, high density, staggered pin fin array |
US7017655B2 (en) | 2003-12-18 | 2006-03-28 | Modine Manufacturing Co. | Forced fluid heat sink |
US7159649B2 (en) | 2004-03-11 | 2007-01-09 | Thermal Corp. | Air-to-air heat exchanger |
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