CA1026013A - Heat sink - Google Patents

Heat sink

Info

Publication number
CA1026013A
CA1026013A CA222,307A CA222307A CA1026013A CA 1026013 A CA1026013 A CA 1026013A CA 222307 A CA222307 A CA 222307A CA 1026013 A CA1026013 A CA 1026013A
Authority
CA
Canada
Prior art keywords
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA222,307A
Other languages
French (fr)
Inventor
Everett C. Elgar
Luc C. Matteau
George E. Murison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Canada Co
Original Assignee
Canadian General Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canadian General Electric Co Ltd filed Critical Canadian General Electric Co Ltd
Priority to CA222,307A priority Critical patent/CA1026013A/en
Application granted granted Critical
Publication of CA1026013A publication Critical patent/CA1026013A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
CA222,307A 1975-03-17 1975-03-17 Heat sink Expired CA1026013A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA222,307A CA1026013A (en) 1975-03-17 1975-03-17 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA222,307A CA1026013A (en) 1975-03-17 1975-03-17 Heat sink

Publications (1)

Publication Number Publication Date
CA1026013A true CA1026013A (en) 1978-02-07

Family

ID=4102556

Family Applications (1)

Application Number Title Priority Date Filing Date
CA222,307A Expired CA1026013A (en) 1975-03-17 1975-03-17 Heat sink

Country Status (1)

Country Link
CA (1) CA1026013A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2902771A1 (en) * 1978-07-21 1980-01-31 Bbc Brown Boveri & Cie COOLING DEVICE FOR SEMICONDUCTOR COMPONENTS
EP0253126A1 (en) * 1986-06-19 1988-01-20 International Business Machines Corporation Heat sink
US6273186B1 (en) 2000-03-13 2001-08-14 Satcon Technology Corporation Low-cost, high density, staggered pin fin array
US6397926B1 (en) * 2000-01-26 2002-06-04 Matsushita Electric Industrial Co., Ltd. Heat sink, method manufacturing the same and cooling apparatus using the same
US6634421B2 (en) 2000-03-10 2003-10-21 Satcon Technology Corporation High performance cold plate for electronic cooling
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US7040388B1 (en) * 2000-01-14 2006-05-09 Matsushita Electric Industrial Co., Ltd. Heat sink, method of manufacturing the same and cooling apparatus using the same
US7159649B2 (en) 2004-03-11 2007-01-09 Thermal Corp. Air-to-air heat exchanger

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2902771A1 (en) * 1978-07-21 1980-01-31 Bbc Brown Boveri & Cie COOLING DEVICE FOR SEMICONDUCTOR COMPONENTS
EP0253126A1 (en) * 1986-06-19 1988-01-20 International Business Machines Corporation Heat sink
US7040388B1 (en) * 2000-01-14 2006-05-09 Matsushita Electric Industrial Co., Ltd. Heat sink, method of manufacturing the same and cooling apparatus using the same
US6397926B1 (en) * 2000-01-26 2002-06-04 Matsushita Electric Industrial Co., Ltd. Heat sink, method manufacturing the same and cooling apparatus using the same
US6634421B2 (en) 2000-03-10 2003-10-21 Satcon Technology Corporation High performance cold plate for electronic cooling
US6273186B1 (en) 2000-03-13 2001-08-14 Satcon Technology Corporation Low-cost, high density, staggered pin fin array
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US7159649B2 (en) 2004-03-11 2007-01-09 Thermal Corp. Air-to-air heat exchanger

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