FR2431769B1 - COOLING DEVICE FOR SEMICONDUCTOR COMPONENT ELEMENTS - Google Patents

COOLING DEVICE FOR SEMICONDUCTOR COMPONENT ELEMENTS

Info

Publication number
FR2431769B1
FR2431769B1 FR7918636A FR7918636A FR2431769B1 FR 2431769 B1 FR2431769 B1 FR 2431769B1 FR 7918636 A FR7918636 A FR 7918636A FR 7918636 A FR7918636 A FR 7918636A FR 2431769 B1 FR2431769 B1 FR 2431769B1
Authority
FR
France
Prior art keywords
cooling device
semiconductor component
component elements
elements
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7918636A
Other languages
French (fr)
Other versions
FR2431769A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2431769A1 publication Critical patent/FR2431769A1/en
Application granted granted Critical
Publication of FR2431769B1 publication Critical patent/FR2431769B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR7918636A 1978-07-21 1979-07-18 COOLING DEVICE FOR SEMICONDUCTOR COMPONENT ELEMENTS Expired FR2431769B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH787578 1978-07-21
CH1299278 1978-12-21

Publications (2)

Publication Number Publication Date
FR2431769A1 FR2431769A1 (en) 1980-02-15
FR2431769B1 true FR2431769B1 (en) 1985-06-28

Family

ID=25702383

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7918636A Expired FR2431769B1 (en) 1978-07-21 1979-07-18 COOLING DEVICE FOR SEMICONDUCTOR COMPONENT ELEMENTS

Country Status (8)

Country Link
AT (1) AT383228B (en)
BR (1) BR7904617A (en)
CA (1) CA1138562A (en)
DE (1) DE2902771A1 (en)
FR (1) FR2431769B1 (en)
GB (1) GB2026238A (en)
NL (1) NL7905603A (en)
SE (1) SE443475B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057956A (en) * 1983-09-09 1985-04-03 Furukawa Electric Co Ltd:The Heat pipe type dissipator for semiconductor
DE4131739C2 (en) * 1991-09-24 1996-12-19 Behr Industrietech Gmbh & Co Cooling device for electrical components
JPH0637219A (en) * 1992-07-16 1994-02-10 Fuji Electric Co Ltd Cooling unit for power semiconductor device
DE4301865A1 (en) * 1993-01-25 1994-07-28 Abb Management Ag Cooling box for electric component
DE19600166A1 (en) * 1996-01-04 1997-07-17 Daimler Benz Ag Cooling body
JP3090954B2 (en) * 1996-01-04 2000-09-25 ダイムラークライスラー アクチエンゲゼルシャフト Cooling member with pins
DE19727912C1 (en) * 1997-07-01 1998-10-29 Daimler Benz Ag Cooling body for cooling power components
DE10102621B4 (en) * 2001-01-20 2006-05-24 Conti Temic Microelectronic Gmbh power module
ITTO20040517A1 (en) * 2004-07-23 2004-10-23 Johnson Electric Moncalieri Srl HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES
DE102014102262A1 (en) * 2014-02-21 2015-08-27 Maschinenfabrik Reinhausen Gmbh switching device
CN112338207A (en) * 2020-11-20 2021-02-09 佛山宇仁智能科技有限公司 Dot matrix circulating cooling mechanism for additive workpiece
CN116855892B (en) * 2023-09-05 2023-12-08 上海陛通半导体能源科技股份有限公司 Deposition method of high-yield AlSi or AlSiCu film

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439022B2 (en) * 1960-05-03 1974-03-21 Siemens Ag, 1000 Berlin U. 8000 Muenchen Heat sink for a semiconductor component
DE2008800A1 (en) * 1970-02-21 1971-09-16 Licentia Gmbh Converter cabinet or rack
FR2087762A5 (en) * 1970-05-29 1971-12-31 Comp Generale Electricite
CA1026013A (en) * 1975-03-17 1978-02-07 Everett C. Elgar Heat sink
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same

Also Published As

Publication number Publication date
SE7906190L (en) 1980-01-22
SE443475B (en) 1986-02-24
FR2431769A1 (en) 1980-02-15
GB2026238A (en) 1980-01-30
CA1138562A (en) 1982-12-28
ATA428579A (en) 1986-10-15
BR7904617A (en) 1980-04-08
AT383228B (en) 1987-06-10
NL7905603A (en) 1980-01-23
DE2902771A1 (en) 1980-01-31

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Legal Events

Date Code Title Description
ST Notification of lapse