ITTO20040517A1 - HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES - Google Patents

HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES

Info

Publication number
ITTO20040517A1
ITTO20040517A1 ITTO20040517A ITTO20040517A1 IT TO20040517 A1 ITTO20040517 A1 IT TO20040517A1 IT TO20040517 A ITTO20040517 A IT TO20040517A IT TO20040517 A1 ITTO20040517 A1 IT TO20040517A1
Authority
IT
Italy
Prior art keywords
electronic
heat dissipating
similar devices
dissipating structure
similar
Prior art date
Application number
Other languages
Italian (it)
Inventor
Luciano Marchitto
Original Assignee
Johnson Electric Moncalieri Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Electric Moncalieri Srl filed Critical Johnson Electric Moncalieri Srl
Priority to ITTO20040517 priority Critical patent/ITTO20040517A1/en
Publication of ITTO20040517A1 publication Critical patent/ITTO20040517A1/en
Priority to PCT/EP2005/053553 priority patent/WO2006008315A2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
ITTO20040517 2004-07-23 2004-07-23 HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES ITTO20040517A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITTO20040517 ITTO20040517A1 (en) 2004-07-23 2004-07-23 HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES
PCT/EP2005/053553 WO2006008315A2 (en) 2004-07-23 2005-07-21 A heat-sink structure for electronic devices and the like

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO20040517 ITTO20040517A1 (en) 2004-07-23 2004-07-23 HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES

Publications (1)

Publication Number Publication Date
ITTO20040517A1 true ITTO20040517A1 (en) 2004-10-23

Family

ID=34972894

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO20040517 ITTO20040517A1 (en) 2004-07-23 2004-07-23 HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES

Country Status (2)

Country Link
IT (1) ITTO20040517A1 (en)
WO (1) WO2006008315A2 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2902771A1 (en) * 1978-07-21 1980-01-31 Bbc Brown Boveri & Cie COOLING DEVICE FOR SEMICONDUCTOR COMPONENTS
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
JPH09312361A (en) * 1996-05-22 1997-12-02 Hitachi Metals Ltd Composite material for electronic component and its manufacture
DE19908749A1 (en) * 1999-02-20 2000-08-31 Daimler Chrysler Ag Attaining uniform temperature distribution for semiconductor component soldered on carrier in systems with efficient cooler
US6942025B2 (en) * 2000-09-20 2005-09-13 Degree Controls, Inc. Uniform heat dissipating and cooling heat sink

Also Published As

Publication number Publication date
WO2006008315A3 (en) 2006-08-10
WO2006008315A2 (en) 2006-01-26
WO2006008315A8 (en) 2006-05-11

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