WO2006008315A3 - A heat-sink structure for electronic devices and the like - Google Patents

A heat-sink structure for electronic devices and the like Download PDF

Info

Publication number
WO2006008315A3
WO2006008315A3 PCT/EP2005/053553 EP2005053553W WO2006008315A3 WO 2006008315 A3 WO2006008315 A3 WO 2006008315A3 EP 2005053553 W EP2005053553 W EP 2005053553W WO 2006008315 A3 WO2006008315 A3 WO 2006008315A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
thermal conductivity
heat
electronic devices
sink structure
Prior art date
Application number
PCT/EP2005/053553
Other languages
French (fr)
Other versions
WO2006008315A2 (en
WO2006008315A8 (en
Inventor
Luciano Marchitto
Original Assignee
Johnson Electric Moncalieri S
Luciano Marchitto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Electric Moncalieri S, Luciano Marchitto filed Critical Johnson Electric Moncalieri S
Publication of WO2006008315A2 publication Critical patent/WO2006008315A2/en
Publication of WO2006008315A8 publication Critical patent/WO2006008315A8/en
Publication of WO2006008315A3 publication Critical patent/WO2006008315A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The structure (S) comprises an upper layer (1) of a material with high thermal conductivity on which an electronic device (T) or the like is to be fitted, a lower layer (2) also made of a material with high thermal conductivity, and an intermediate layer (3) which is made of a material having a lower thermal conductivity than the upper and lower layers (1, 2). In the region (1b) surrounding the area (1) occupied by the device (T), the intermediate layer (3) has a thickness which decreases as the distance from the device (T) increases and, between the upper layer (1) and the lower layer (2), connection elements (1c; 1d) are provided which can define the distance between the upper and lower layers (1, 2) in a calibrated manner. The connection elements (1c; 1d) are distributed along a closed line which extends around the area occupied by the electronic device (T).
PCT/EP2005/053553 2004-07-23 2005-07-21 A heat-sink structure for electronic devices and the like WO2006008315A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITTO20040517 ITTO20040517A1 (en) 2004-07-23 2004-07-23 HEAT DISSIPATING STRUCTURE FOR ELECTRONIC AND SIMILAR DEVICES
ITTO2004A000517 2004-07-23

Publications (3)

Publication Number Publication Date
WO2006008315A2 WO2006008315A2 (en) 2006-01-26
WO2006008315A8 WO2006008315A8 (en) 2006-05-11
WO2006008315A3 true WO2006008315A3 (en) 2006-08-10

Family

ID=34972894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/053553 WO2006008315A2 (en) 2004-07-23 2005-07-21 A heat-sink structure for electronic devices and the like

Country Status (2)

Country Link
IT (1) ITTO20040517A1 (en)
WO (1) WO2006008315A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2026238A (en) * 1978-07-21 1980-01-30 Bbc Brown Boveri & Cie Cooling apparatus for electrical elements
EP0542546A1 (en) * 1991-11-14 1993-05-19 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
US6045927A (en) * 1996-05-22 2000-04-04 Hitachi Metals, Ltd. Composite material for electronic part and method of producing same
DE19908749A1 (en) * 1999-02-20 2000-08-31 Daimler Chrysler Ag Attaining uniform temperature distribution for semiconductor component soldered on carrier in systems with efficient cooler
US20030131973A1 (en) * 2000-09-20 2003-07-17 Rajesh Nair Uniform heat dissipating and cooling heat sink

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2026238A (en) * 1978-07-21 1980-01-30 Bbc Brown Boveri & Cie Cooling apparatus for electrical elements
EP0542546A1 (en) * 1991-11-14 1993-05-19 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
US6045927A (en) * 1996-05-22 2000-04-04 Hitachi Metals, Ltd. Composite material for electronic part and method of producing same
DE19908749A1 (en) * 1999-02-20 2000-08-31 Daimler Chrysler Ag Attaining uniform temperature distribution for semiconductor component soldered on carrier in systems with efficient cooler
US20030131973A1 (en) * 2000-09-20 2003-07-17 Rajesh Nair Uniform heat dissipating and cooling heat sink

Also Published As

Publication number Publication date
WO2006008315A2 (en) 2006-01-26
ITTO20040517A1 (en) 2004-10-23
WO2006008315A8 (en) 2006-05-11

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