AT383228B - Kuehlelement mit zwangsumlaufkuehlung fuer halbleiterbauelemente der leistungselektronik - Google Patents

Kuehlelement mit zwangsumlaufkuehlung fuer halbleiterbauelemente der leistungselektronik

Info

Publication number
AT383228B
AT383228B AT0428579A AT428579A AT383228B AT 383228 B AT383228 B AT 383228B AT 0428579 A AT0428579 A AT 0428579A AT 428579 A AT428579 A AT 428579A AT 383228 B AT383228 B AT 383228B
Authority
AT
Austria
Prior art keywords
cooling
power electronics
semiconductor components
forced circuit
cooling element
Prior art date
Application number
AT0428579A
Other languages
German (de)
English (en)
Other versions
ATA428579A (de
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of ATA428579A publication Critical patent/ATA428579A/de
Application granted granted Critical
Publication of AT383228B publication Critical patent/AT383228B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT0428579A 1978-07-21 1979-06-18 Kuehlelement mit zwangsumlaufkuehlung fuer halbleiterbauelemente der leistungselektronik AT383228B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH787578 1978-07-21
CH1299278 1978-12-21

Publications (2)

Publication Number Publication Date
ATA428579A ATA428579A (de) 1986-10-15
AT383228B true AT383228B (de) 1987-06-10

Family

ID=25702383

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0428579A AT383228B (de) 1978-07-21 1979-06-18 Kuehlelement mit zwangsumlaufkuehlung fuer halbleiterbauelemente der leistungselektronik

Country Status (8)

Country Link
AT (1) AT383228B (nl)
BR (1) BR7904617A (nl)
CA (1) CA1138562A (nl)
DE (1) DE2902771A1 (nl)
FR (1) FR2431769B1 (nl)
GB (1) GB2026238A (nl)
NL (1) NL7905603A (nl)
SE (1) SE443475B (nl)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4131739A1 (de) * 1991-09-24 1993-04-01 Behr Industrietech Gmbh & Co Kuehleinrichtung fuer elektrische bauelemente
DE4322665A1 (de) * 1992-07-16 1994-01-20 Fuji Electric Co Ltd Kühlvorrichtung für eine Halbleiterleistungsvorrichtung
DE4301865A1 (de) * 1993-01-25 1994-07-28 Abb Management Ag Kühldose
DE19600166A1 (de) * 1996-01-04 1997-07-17 Daimler Benz Ag Kühlkörper mit verbessertem Strömungswiderstand
DE19727912C1 (de) * 1997-07-01 1998-10-29 Daimler Benz Ag Kühlkörper für Leistungsbauelemente
US6039114A (en) * 1996-01-04 2000-03-21 Daimler - Benz Aktiengesellschaft Cooling body having lugs
EP1378008A2 (de) * 2001-01-20 2004-01-07 Conti Temic microelectronic GmbH Leistungsmodul

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057956A (ja) * 1983-09-09 1985-04-03 Furukawa Electric Co Ltd:The 半導体用ヒ−トパイプ放熱器
ITTO20040517A1 (it) * 2004-07-23 2004-10-23 Johnson Electric Moncalieri Srl Struttura dissipatrice del calore per dispositivi elettronici e simili
DE102014102262A1 (de) * 2014-02-21 2015-08-27 Maschinenfabrik Reinhausen Gmbh Schalteinrichtung
CN112338207A (zh) * 2020-11-20 2021-02-09 佛山宇仁智能科技有限公司 一种增材工件点阵循环冷却机构
CN116855892B (zh) * 2023-09-05 2023-12-08 上海陛通半导体能源科技股份有限公司 一种高产能AlSi或AlSiCu薄膜的沉积方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439022B2 (de) * 1960-05-03 1974-03-21 Siemens Ag, 1000 Berlin U. 8000 Muenchen Kühlkörper für ein Halbleiterbauelement
DE2008800A1 (de) * 1970-02-21 1971-09-16 Licentia Gmbh Stromrichterschrank oder gestell
FR2087762A5 (nl) * 1970-05-29 1971-12-31 Comp Generale Electricite
CA1026013A (en) * 1975-03-17 1978-02-07 Everett C. Elgar Heat sink
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4131739A1 (de) * 1991-09-24 1993-04-01 Behr Industrietech Gmbh & Co Kuehleinrichtung fuer elektrische bauelemente
DE4322665A1 (de) * 1992-07-16 1994-01-20 Fuji Electric Co Ltd Kühlvorrichtung für eine Halbleiterleistungsvorrichtung
DE4301865A1 (de) * 1993-01-25 1994-07-28 Abb Management Ag Kühldose
DE19600166A1 (de) * 1996-01-04 1997-07-17 Daimler Benz Ag Kühlkörper mit verbessertem Strömungswiderstand
US6039114A (en) * 1996-01-04 2000-03-21 Daimler - Benz Aktiengesellschaft Cooling body having lugs
DE19727912C1 (de) * 1997-07-01 1998-10-29 Daimler Benz Ag Kühlkörper für Leistungsbauelemente
EP1378008A2 (de) * 2001-01-20 2004-01-07 Conti Temic microelectronic GmbH Leistungsmodul

Also Published As

Publication number Publication date
SE7906190L (sv) 1980-01-22
FR2431769A1 (fr) 1980-02-15
GB2026238A (en) 1980-01-30
FR2431769B1 (fr) 1985-06-28
NL7905603A (nl) 1980-01-23
ATA428579A (de) 1986-10-15
BR7904617A (pt) 1980-04-08
DE2902771A1 (de) 1980-01-31
CA1138562A (en) 1982-12-28
SE443475B (sv) 1986-02-24

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee