SE344262B - - Google Patents
Info
- Publication number
- SE344262B SE344262B SE13271/69A SE1327169A SE344262B SE 344262 B SE344262 B SE 344262B SE 13271/69 A SE13271/69 A SE 13271/69A SE 1327169 A SE1327169 A SE 1327169A SE 344262 B SE344262 B SE 344262B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Conductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76585568A | 1968-10-08 | 1968-10-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE344262B true SE344262B (xx) | 1972-04-04 |
Family
ID=25074692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE13271/69A SE344262B (xx) | 1968-10-08 | 1969-09-26 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3499098A (xx) |
JP (1) | JPS4912950B1 (xx) |
BE (1) | BE739900A (xx) |
DE (1) | DE1950516B2 (xx) |
FR (1) | FR2020130A1 (xx) |
GB (1) | GB1282326A (xx) |
NL (1) | NL6914916A (xx) |
SE (1) | SE344262B (xx) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1262951A (en) * | 1969-01-08 | 1972-02-09 | Alcan Res & Dev | Improved jointing method for cables |
US3680209A (en) * | 1969-05-07 | 1972-08-01 | Siemens Ag | Method of forming stacked circuit boards |
US3678437A (en) * | 1970-12-30 | 1972-07-18 | Itt | Flat cable wafer |
US3721778A (en) * | 1971-06-21 | 1973-03-20 | Chomerics Inc | Keyboard switch assembly with improved operator and contact structure |
JPS51148960U (xx) * | 1975-05-22 | 1976-11-29 | ||
US4319708A (en) * | 1977-02-15 | 1982-03-16 | Lomerson Robert B | Mechanical bonding of surface conductive layers |
SE427514B (sv) * | 1979-05-25 | 1983-04-11 | Thomas & Betts Corp | Forfarande och anordning for anslutning av en forsta bandkabel med inbordes isolerade ledare till en andra bandkabel med inbordes isolerade ledare |
US4249303A (en) * | 1979-05-25 | 1981-02-10 | Thomas & Betts Corporation | Method for electrical connection of flat cables |
USRE31336E (en) * | 1979-05-25 | 1983-08-09 | Thomas & Betts Corporation | Method for electrical connection of flat cables |
US4521969A (en) * | 1979-05-25 | 1985-06-11 | Thomas & Betts Corporation | Apparatus for electrical connection of multiconductor cables |
US4258974A (en) * | 1979-05-25 | 1981-03-31 | Thomas & Betts Corporation | Installation kit for undercarpet wiring system |
US4535388A (en) * | 1984-06-29 | 1985-08-13 | International Business Machines Corporation | High density wired module |
NL8403755A (nl) * | 1984-12-11 | 1986-07-01 | Philips Nv | Werkwijze voor de vervaardiging van een meerlaags gedrukte bedrading met doorverbonden sporen in verschillende lagen en meerlaags gedrukte bedrading vervaardigd volgens de werkwijze. |
AU610249B2 (en) * | 1987-09-29 | 1991-05-16 | Microelectronics And Computer Technology Corporation | Customizable circuitry |
US5165166A (en) * | 1987-09-29 | 1992-11-24 | Microelectronics And Computer Technology Corporation | Method of making a customizable circuitry |
US4934045A (en) * | 1988-02-05 | 1990-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of producing electric circuit patterns |
US5164888A (en) * | 1988-12-29 | 1992-11-17 | International Business Machines | Method and structure for implementing dynamic chip burn-in |
JPH06291428A (ja) * | 1992-05-08 | 1994-10-18 | Stanley Electric Co Ltd | 回路基板 |
DE19531970A1 (de) * | 1995-08-30 | 1997-03-06 | Siemens Ag | Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer auf einem Trägersubstrat angeordnet ist |
DE19618100A1 (de) * | 1996-05-06 | 1997-11-13 | Siemens Ag | Verfahren zur Herstellung einer Mehrlagen-Verbundstruktur mit elektrisch leitenden Verbindungen |
US6107578A (en) * | 1997-01-16 | 2000-08-22 | Lucent Technologies Inc. | Printed circuit board having overlapping conductors for crosstalk compensation |
JP2002315163A (ja) * | 2001-04-11 | 2002-10-25 | Yazaki Corp | 交差電線の固定構造 |
JP2003123545A (ja) * | 2001-10-15 | 2003-04-25 | Yazaki Corp | ワイヤーハーネスおよびこれを配索した車両用モジュール体 |
JP4032353B2 (ja) * | 2003-12-26 | 2008-01-16 | セイコーエプソン株式会社 | 回路基板の製造方法、回路基板、電子機器、および電気光学装置 |
US7427719B2 (en) * | 2006-03-21 | 2008-09-23 | Intel Corporation | Shifted segment layout for differential signal traces to mitigate bundle weave effect |
US8851356B1 (en) | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
US8007286B1 (en) * | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
TWI334746B (en) * | 2008-03-31 | 2010-12-11 | Raydium Semiconductor Corp | Assembly structure |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2019625A (en) * | 1934-03-30 | 1935-11-05 | Rca Corp | Electrical apparatus |
US2872565A (en) * | 1955-04-28 | 1959-02-03 | Honeywell Regulator Co | Welding method |
US2977672A (en) * | 1958-12-12 | 1961-04-04 | Gen Electric | Method of making bonded wire circuit |
US3300851A (en) * | 1964-01-02 | 1967-01-31 | Gen Electric | Method of making bonded wire circuits |
-
1968
- 1968-10-08 US US765855A patent/US3499098A/en not_active Expired - Lifetime
-
1969
- 1969-09-26 SE SE13271/69A patent/SE344262B/xx unknown
- 1969-10-02 NL NL6914916A patent/NL6914916A/xx not_active Application Discontinuation
- 1969-10-06 BE BE739900D patent/BE739900A/xx unknown
- 1969-10-07 FR FR6934223A patent/FR2020130A1/fr not_active Withdrawn
- 1969-10-07 GB GB49238/69A patent/GB1282326A/en not_active Expired
- 1969-10-07 DE DE19691950516 patent/DE1950516B2/de not_active Withdrawn
- 1969-10-08 JP JP44080005A patent/JPS4912950B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
NL6914916A (xx) | 1970-04-10 |
US3499098A (en) | 1970-03-03 |
FR2020130A1 (xx) | 1970-07-10 |
JPS4912950B1 (xx) | 1974-03-28 |
GB1282326A (en) | 1972-07-19 |
BE739900A (xx) | 1970-03-16 |
DE1950516B2 (de) | 1972-08-03 |
DE1950516A1 (de) | 1970-10-29 |