SE219969C1 - - Google Patents

Info

Publication number
SE219969C1
SE219969C1 SE847466A SE847466A SE219969C1 SE 219969 C1 SE219969 C1 SE 219969C1 SE 847466 A SE847466 A SE 847466A SE 847466 A SE847466 A SE 847466A SE 219969 C1 SE219969 C1 SE 219969C1
Authority
SE
Sweden
Application number
SE847466A
Other languages
Swedish (sv)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of SE219969C1 publication Critical patent/SE219969C1/sv

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/05—Etch and refill
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
SE847466A 1965-06-23 1966-06-21 SE219969C1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US466182A US3325882A (en) 1965-06-23 1965-06-23 Method for forming electrical connections to a solid state device including electrical packaging arrangement therefor

Publications (1)

Publication Number Publication Date
SE219969C1 true SE219969C1 (enExample) 1968-04-09

Family

ID=23850828

Family Applications (1)

Application Number Title Priority Date Filing Date
SE847466A SE219969C1 (enExample) 1965-06-23 1966-06-21

Country Status (8)

Country Link
US (1) US3325882A (enExample)
JP (1) JPS512792B1 (enExample)
CH (1) CH454985A (enExample)
DE (1) DE1640457B1 (enExample)
FR (1) FR1483570A (enExample)
GB (1) GB1073910A (enExample)
NL (1) NL153721B (enExample)
SE (1) SE219969C1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428866A (en) * 1965-06-23 1969-02-18 Ibm Solid state device including electrical packaging arrangement with improved electrical connections
US3433686A (en) * 1966-01-06 1969-03-18 Ibm Process of bonding chips in a substrate recess by epitaxial growth of the bonding material
DE1539692A1 (de) * 1966-06-23 1969-10-16 Blume & Redecker Gmbh Umklebevorrichtung fuer Spulen
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
US3461524A (en) * 1966-11-02 1969-08-19 Bell Telephone Labor Inc Method for making closely spaced conductive layers
US3748726A (en) * 1969-09-24 1973-07-31 Siemens Ag Method for mounting semiconductor components
US3753290A (en) * 1971-09-30 1973-08-21 Tektronix Inc Electrical connection members for electronic devices and method of making same
JPS4988563A (enExample) * 1972-12-23 1974-08-23
US3964157A (en) * 1974-10-31 1976-06-22 Bell Telephone Laboratories, Incorporated Method of mounting semiconductor chips
JPS52109289U (enExample) * 1976-02-16 1977-08-19
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
US5237485A (en) * 1985-04-26 1993-08-17 Sgs Microelettronica S.P.A. Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
US4768077A (en) * 1986-02-20 1988-08-30 Aegis, Inc. Lead frame having non-conductive tie-bar for use in integrated circuit packages
GB2202673B (en) * 1987-03-26 1990-11-14 Haroon Ahmed The semi-conductor fabrication
FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
JPH02306690A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 表面実装用配線基板の製造方法
US5605863A (en) * 1990-08-31 1997-02-25 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
DE19914718B4 (de) * 1999-03-31 2006-04-13 Siemens Ag Verfahren zum gleichzeitigen Herstellen einer Mehrzahl von Leuchtdiodenelementen mit integrierten Kontakten
DE19964471B4 (de) * 1999-03-31 2013-02-21 Osram Ag Leuchtdiode und Verfahren zur Herstellung einer Mehrzahl von Leuchtdioden
US6882044B2 (en) * 2002-05-17 2005-04-19 Agilent Technologies, Inc. High speed electronic interconnection using a detachable substrate
US7343758B1 (en) * 2004-08-09 2008-03-18 Continental Carbonic Products, Inc. Dry ice compaction method
DE102006009723A1 (de) * 2006-03-02 2007-09-06 Siemens Ag Verfahren zum Herstellen und planaren Kontaktieren einer elektronischen Vorrichtung und entsprechend hergestellte Vorrichtung
EP2560466A4 (en) * 2010-04-15 2015-05-06 Furukawa Electric Co Ltd BOARD AND METHOD FOR PRODUCING A BOARD

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
US3098951A (en) * 1959-10-29 1963-07-23 Sippican Corp Weldable circuit cards
US3235428A (en) * 1963-04-10 1966-02-15 Bell Telephone Labor Inc Method of making integrated semiconductor devices

Also Published As

Publication number Publication date
US3325882A (en) 1967-06-20
DE1640457B1 (de) 1970-10-29
NL6608622A (enExample) 1966-12-27
FR1483570A (enExample) 1967-09-06
CH454985A (de) 1968-04-30
GB1073910A (en) 1967-06-28
NL153721B (nl) 1977-06-15
JPS512792B1 (enExample) 1976-01-28

Similar Documents

Publication Publication Date Title
FR1483570A (enExample)
JPS4514690Y1 (enExample)
BE673125A (enExample)
JPS434725Y1 (enExample)
JPS4417429Y1 (enExample)
JPS4312182Y1 (enExample)
JPS4526106Y1 (enExample)
JPS4524709Y1 (enExample)
JPS4510865Y1 (enExample)
JPS435136Y1 (enExample)
JPS4612703Y1 (enExample)
JPS426226Y1 (enExample)
BE674829A (enExample)
BE674524A (enExample)
NL6606302A (enExample)
SE306849B (enExample)
BE671152A (enExample)
CH350565A4 (enExample)
BE681229A (enExample)
BE675012A (enExample)
BE674985A (enExample)
BE674891A (enExample)
BE675166A (enExample)
BE674761A (enExample)
BE674646A (enExample)